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Title:
BOTTOM SUPPORT PLATE, BATTERY CELL, BATTERY PACK, AND ELECTRIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/017130
Kind Code:
A1
Abstract:
The present application discloses a bottom support plate, a battery cell, a battery pack, and an electric device. The bottom support plate of the present application is used for supporting an electrode assembly in a battery cell, and the bottom support plate comprises: a bottom support plate body; and a connecting plate, wherein the connecting plate is disposed on the lower surface of the bottom support plate body, an exhaust groove is formed between the edge of the connecting plate and the lower surface of the bottom support plate body, the exhaust groove passes through the peripheral edges of the bottom support plate body at least along a first direction and a second direction, the first direction and the second direction are both perpendicular to the thickness direction of the bottom support plate body, and the exhaust groove is communicated with a gap between a housing of the battery cell and an insulating sleeve film. According to the present application, the exhaust groove passes through the peripheral edges of the bottom support plate body, such that when thermal runaway occurs in the electrode assembly, the gas around the electrode assembly can be discharged in time by means of the exhaust groove, thereby avoiding the risk of battery explosion due to the fact that the gas locally generated by the electrode assembly is accumulated and cannot be discharged in time.

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WO/2023/240872BATTERY PACK
WO/2021/149300BATTERY MODULE, POWER SUPPLY DEVICE COMPRISING BATTERY MODULE, AND ELECTRIC VEHICLE AND POWER STORAGE DEVICE COMPRISING POWER SUPPLY DEVICE
Inventors:
KE HAIBO (CN)
LI QUANKUN (CN)
MEI XIANG (CN)
YANG KAIHUAN (CN)
HUANG SHOUJUN (CN)
WANG PENG (CN)
Application Number:
PCT/CN2023/107217
Publication Date:
January 25, 2024
Filing Date:
July 13, 2023
Export Citation:
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Assignee:
CONTEMPORARY AMPEREX TECHNOLOGY CO LTD (CN)
International Classes:
H01M50/30
Foreign References:
CN107394063A2017-11-24
US20150318526A12015-11-05
CN217589304U2022-10-14
Attorney, Agent or Firm:
BEIJING CHENQUAN INTELLECTUAL PROPERTY LAW FIRM (CN)
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