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Title:
BORON NITRIDE PLATE SURFACE TREATMENT METHOD, METHOD FOR PRODUCING CERAMIC SINTERED BODY, AND METHOD FOR PRODUCING BORON NITRIDE PLATE
Document Type and Number:
WIPO Patent Application WO/2023/190299
Kind Code:
A1
Abstract:
A boron nitride plate surface treatment method according to an embodiment comprises a first polishing step and a second polishing step. In the first polishing step, a surface of a boron nitride plate is polished using a first polishing member having a grit in the range of F120 to F220 inclusive, or #240 to #320 inclusive. In the second polishing step, said surface of the boron nitride plate is polished using a second polishing member having a grit in the range of #360 to #1000 inclusive. The second polishing step is performed after the first polishing step. The boron nitride plate is suitable for a method for manufacturing a silicon nitride substrate. In the first polishing step, a pressing amount of the first polishing member preferably lies in the range of 0.2 mm to 1.0 mm inclusive, and a processing point speed preferably lies in the range of 80 mm/s to 180 mm/s inclusive.

Inventors:
MATSUMOTO IKKI (JP)
Application Number:
PCT/JP2023/012125
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
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Assignee:
TOSHIBA KK (JP)
TOSHIBA MATERIALS CO LTD (JP)
International Classes:
B24B7/22; B24B1/00; B28B11/08; C04B35/583; C04B35/587; C04B35/64
Domestic Patent References:
WO2013146789A12013-10-03
WO2019235594A12019-12-12
Foreign References:
JP2014148436A2014-08-21
JP2017087332A2017-05-25
JP2001019561A2001-01-23
JP2017052070A2017-03-16
JPH05220669A1993-08-31
Attorney, Agent or Firm:
IX PATENT LAW FIRM, P.C. (JP)
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