Title:
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/075562
Kind Code:
A1
Abstract:
Provided is a bonding device for bonding a first substrate and a second substrate, the bonding device including: a first holding part that holds the first substrate by attraction; a second holding part that is disposed at a position facing the first holding part and that holds the second substrate by attraction; a processing container that accommodates the first holding part and the second holding part and that forms a processing space isolated from the outside; a moving mechanism that relatively moves the first substrate held by the first holding part and the second substrate held by the second holding part to a close position and a spaced position; a decompression unit that is connected to the processing container and that decompresses the processing space; and a pressing mechanism that brings the central sections of the first substrate and the second substrate into contact with each other at the close position and that presses at least the first substrate. The first holding part includes an electrostatic attraction part for electrostatically attracting the first substrate.
Inventors:
YAMASAKI YUTAKA (JP)
TERADA TAKASHI (JP)
TERADA TAKASHI (JP)
Application Number:
PCT/JP2023/034679
Publication Date:
April 11, 2024
Filing Date:
September 25, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; H01L21/683
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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