Title:
BONDED BODY, METHOD FOR DISMANTLING BONDED BODY, AND THERMOSETTING ADHESIVE USED FOR BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/024862
Kind Code:
A1
Abstract:
The present invention provides a bonded body which can be dismantled even in cases where deformation of an adherend cannot be utilized for separation since rigid bodies are bonded with each other by an adhesive. The present invention provides a bonded body which comprises a first member, a second member and a bonding part which is arranged between the first member and the second member so as to bond the first member and the second member to each other. With respect to this bonded body, the bonding part contains a thermosetting adhesive. The thermosetting adhesive has a peel strength from a glass sheet of 1.0 N/20 mm or less after being heated at 180°C for 30 minutes.
Inventors:
KUMAKURA KENTA (JP)
NAGAIDA MIYABI (JP)
HONDA SATOSHI (JP)
NAGAIDA MIYABI (JP)
HONDA SATOSHI (JP)
Application Number:
PCT/JP2023/027455
Publication Date:
February 01, 2024
Filing Date:
July 26, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B7/022; C09J4/02; C09J11/06; C09J201/00
Domestic Patent References:
| WO2020162330A1 | 2020-08-13 |
Foreign References:
| JP2021095526A | 2021-06-24 | |||
| JP2003231867A | 2003-08-19 | |||
| JP2003231875A | 2003-08-19 | |||
| JP2016204617A | 2016-12-08 | |||
| JP2007152869A | 2007-06-21 |
Attorney, Agent or Firm:
OI, Michiko (JP)
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