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WO/2022/180431A1 |
Embodiments of a radio frequency feedline structure. A first printed circuit board (PCB) includes upper and lower metal layers and at least one cutout defining an upper portion of an open channel. The upper and lower metal layers are ele...
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WO/2022/176853A1 |
A printed wiring board comprising a first insulating layer and a through-hole conductor. The first insulating layer has a through-hole extending therethrough from a first surface of the first insulating layer to a second surface thereof ...
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WO/2022/169501A1 |
A photodiode structure including a silicon substrate, an oxide layer on the silicon substrate, a silicon on insulator region on the oxide layer, a germanium absorption region, a silicon nitride waveguide, a cathode region, and an anode r...
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WO/2022/161604A1 |
The present application concerns a tunable differential transmission line segment, comprising a differential pair of signal line segments (10) arranged in a first plane. A pair of tuning line segments (20) is arranged in a second plane s...
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WO/2022/162188A1 |
A Goubau transmission line (1) for propagating a surface electromagnetic wave. A first transmission line part (11) and a second transmission line part is each configured for propagating the surface electromagnetic wave and each comprises...
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WO/2022/162500A1 |
An electrical device comprising a coplanar waveguide above a substrate (200) including a signal line (101) surrounded on one side by a first portion (103A) of ground plane and on another side by a second portion (103B) of ground plane, w...
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WO/2022/158416A1 |
A wiring board comprising: a substrate composed of a dielectric material and having a first surface and a second surface opposite the first surface; a signal conductor positioned on the first surface and extending to an end of the substr...
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WO/2022/154657A1 |
The invention relates to a planar transmission line for communication with cryogenic devices. The planar transmission line comprises a first part and a second part, wherein the first part comprises a first conductive layer, a first diele...
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WO/2022/148835A1 |
A radio frequency module is disclosed comprising: a radio frequency circuit block which comprises a stack of at least two metal plates and a plurality of radio frequency waveguides defined by channels in the metal plates so as to carry r...
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WO/2022/147627A1 |
Various substrate- integrated waveguide (SIW) filtering crossover systems are described. An example SIW filtering crossover system may include: a substrate; a top metal plate placed on top of the substrate; a bottom metal plate placed be...
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WO/2022/147389A1 |
Example embodiments relate to substrate integrated waveguide (SIW) transitions. An example SIW may include a dielectric substrate having a top surface and a bottom surface and a first metallic layer portion coupled to the top surface of ...
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WO/2022/143347A1 |
Disclosed are a leaky circular waveguide assembly applicable to MIMO technology, and a manufacturing method therefor. The leaky circular waveguide assembly comprises two plastic tubes, an outer conductor and a sheath layer, wherein the i...
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WO/2022/146975A1 |
A waveguide assembly is disclosed herein. In an embodiment, a waveguide assembly includes a circuit board, a housing and a waveguide filter channel. The circuit board has at least one waveguide interface formed from an electrically condu...
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WO/2022/146669A1 |
Provided is an electromagnetic phased array (EPA) including an signal distributor comprising an input port to which a signal is input and first to fourth output ports from which the signal is divided and output, first to fourth waveguide...
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WO/2022/137465A1 |
Provided is a waveguide of which the width is set so that the characteristic impedance of the lowest-order mode in the waveguide changes according to a predetermined function.
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WO/2022/139034A1 |
The proposed technology relates to a chip-to-chip interface device comprising a waveguide and, more particularly, to a chip-to-chip interface device comprising a waveguide having the property of being flexible.
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WO/2022/137468A1 |
Provided is a coupler in which the density of a dielectric body is changed in a section where a first waveguide and a second waveguide positioned in parallel are joined.
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WO/2022/137469A1 |
A Butler matrix circuit is provided, which comprises at least one of a phase shifter which shifts the phase of a signal and in which at least one of the width of the phase shifter and the density of a dielectric in the phase shifter is s...
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WO/2022/138355A1 |
In the present invention, a stack has a structure in which a plurality of insulator layers are stacked in an up-down direction. A first conductor layer is provided on an upper main surface of an insulator layer, and transmits a first sig...
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WO/2022/137466A1 |
A phase shifter that shifts the phase of a signal, wherein at least one among the width of the phase shifter and the density of a dielectric within the phase shifter is set such that the characteristic impedance of the lowest-order mode ...
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WO/2022/137464A1 |
In this waveguide, the density of a dielectric in the waveguide is set such that the lowest-order-mode characteristic impedance in the waveguide varies in accordance with a predetermined function.
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WO/2022/132445A1 |
Base station antenna feed boards are provided. A base station antenna feed board includes a phase shifter and a hybrid radio frequency transmission line that is coupled to the phase shifter. The hybrid radio frequency transmission line i...
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WO/2022/130394A1 |
A printed circuit board is provided, comprising a horizontally extending dielectric substrate and a substrate integrated waveguide (SIW). The SIW comprises two horizontally disposed conductive ground planes spaced by a vertical distance,...
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WO/2022/130836A1 |
An antenna device (1) equipped with one or more fed antennas (3) provided to a main surface (2a) of a substrate (2), a parasitic antenna (4) provided to the substrate (2), and a terminator (5) connected to the parasitic antenna (4) and p...
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WO/2022/124038A1 |
According to the present invention, a first waveguide conductor layer is provided to an element body. A second waveguide conductor layer is provided to the element body, and is located below the first waveguide conductor layer. A plurali...
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WO/2022/118810A1 |
The present invention is a transmission line. A first spacer layer includes a plurality of first upper contact portions, which include the upper end of a first spacer. The first spacer layer is fixed to a third section and a first sectio...
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WO/2022/115403A1 |
A surface mountable thin-film coupler may include a monolithic base substrate and a plurality of ports formed over the monolithic base substrate. The surface mountable thin-film coupler may include at least one thin-film component connec...
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WO/2022/114092A1 |
The present invention is a transmission line. Hollow portions overlap a first ground conductor layer, as viewed in the vertical direction. The hollow portions each include a first part positioned in a second orthogonal direction of a sig...
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WO/2022/113889A1 |
The present invention comprises a laminate, a first signal conductor layer that is provided to the laminate and extends in the longitudinal direction, and a first ground conductor layer that is provided to the laminate and is provided ab...
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WO/2022/113618A1 |
This transmission line (10) is provided with: a resin substrate (11) which comprises a resin base material (111) and a signal line (112) that is arranged on the resin base material (111); and a resin substrate (12) which comprises a resi...
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WO/2022/113739A1 |
The present invention is a transmission line. A first hollow portion is provided to a laminate. The first hollow portion is positioned above a signal conductor layer and below a first ground conductor layer. The first hollow portion over...
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WO/2022/113591A1 |
The present invention is provided with a body, a signal conductor layer, and a first ground conductor layer. The body includes a single-layer first insulating body layer. The signal conductor layer is provided lower than the first insula...
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WO/2022/114205A1 |
A multilayered substrate comprising a plurality of layers stacked in a stack vertical direction. The plurality of layers include a first spacer, a first ground conductor layer located above the first spacer, and a signal conductor layer ...
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WO/2022/113818A1 |
The present invention is a transmission line. A signal conductor layer extends in the longitudinal direction, which is orthogonal to the vertical direction. A first ground conductor layer is provided above the signal conductor layer. A p...
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WO/2022/107499A1 |
This transmission path, which is capable of transmitting a first electromagnetic wave having a first frequency and a second electromagnetic wave having a second frequency lower than the first frequency and has the same cross section in t...
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WO/2022/100916A1 |
The invention relates to a measurement device neck (12) of a radar-based fill level measurement device (1) that is used to determine a fill level profile (L(a, ꞵ)) of a filling material (2). In this case, the measurement device neck (1...
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WO/2022/097490A1 |
The horn antenna according to one embodiment of the present invention comprises a waveguide tube part and a horn part. The waveguide tube part has a first dielectric block and a first post wall. The first post wall: includes a plurality ...
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WO/2022/087315A1 |
A surface mount constructed millimeter wave transceiver device and methods of making a surface mount constructed millimeter wave transceiver device are disclosed. The transceiver device includes a printed circuit board having a first wav...
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WO/2022/085653A1 |
An antenna device (18) includes: a first conductor layer (L8); a second conductor layer (L7); and a dielectric layer (P7) sandwiched between the first and second conductor layers. The first conductor layer has formed therein: a first ant...
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WO/2022/087027A1 |
Improved waveguides, transitions, and conductors for propagating electromagnetic energy. A device includes a waveguide port, two or more coaxial waveguides, and a transition disposed between the waveguide port and the two or more coaxial...
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WO/2022/084350A1 |
Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can i...
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WO/2022/086725A1 |
A ring resonator based T-shaped duplexer for use in communication systems includes a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the firs...
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WO/2022/085881A1 |
Provided is a device for transmitting signals, the device including: a first conductive base and a second conductive base parallel to each other, a waveguide at least partially surrounded by side walls located between the first conductiv...
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WO/2022/079769A1 |
In a waveguide connection structure according to the present invention, a first waveguide is connected to a second waveguide differing from the first waveguide, or to a transmission/reception device that transmits and receives radio wave...
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WO/2022/080067A1 |
In the present invention, a substrate main body includes a first resin layer and a second resin layer which is laminated under the first resin layer. A first signal conductor layer is provided on the upper main surface of the second resi...
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WO/2022/078638A1 |
The present invention discloses an improved RF interface board and a laminated assembly having a RF interface board having an inner and an outer part, comprising a dielectric support having a first and a second surfaces and at least a fi...
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WO/2022/075254A1 |
[Problem] To provide a differential transmission line that makes it possible to reduce the difference in line length between a pair of signal lines while reducing transmission loss. [Solution] This differential transmission line 1 is pro...
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WO/2022/074812A1 |
A transmission line constituent body 100 comprises a first and a second transmission line body 10a, 10b. The first and second transmission line bodies 10a, 10b each comprise: a waveguide 1 through which a high-frequency signal is trans...
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WO/2022/070856A1 |
This wiring substrate comprises a substrate, a signal conductor, and a ground conductor, wherein: the substrate has a first surface and has, in the first surface, an opening that is a mounting region for an electronic component; the sign...
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WO/2022/069806A1 |
The present description relates to a connector that can be configured mechanically between a wireless radio frequency transmission and a wired radio frequency transmission via a cylindrical radio frequency dielectric waveguide (202), the...
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