| Document |
Document Title |
|
WO/2023/115985A1 |
The present invention relates to the field of high-voltage ceramic capacitors. Disclosed is a new high-voltage ceramic bus support capacitor for an automobile inverter. The bus support capacitor comprises a positive busbar, a negative bu...
|
|
WO/2023/113335A1 |
The present invention relates to a ceramic capacitor comprising: a plurality of dielectric layers; a ceramic body having front and rear surfaces facing each other, upper and lower surfaces facing each other, and both end surfaces facing ...
|
|
WO/2023/111368A1 |
Disclosed is a modular power core for railway vehicles, for adapting input electrical energy such that it can be transformed into mechanical energy to power the traction system of such railway vehicles, the power core including the follo...
|
|
WO/2023/112883A1 |
Provided is a ceramic electronic component that allows the strength of an identification mark to be increased against physical impact from outside, while suppressing a decrease in accuracy of recognition of the identification mark. This ...
|
|
WO/2023/113336A1 |
The present invention relates to a ceramic capacitor, comprising: a ceramic body having front and rear surfaces facing each other, upper and lower surfaces facing each other, and both end surfaces facing each other; a plurality of first ...
|
|
WO/2023/113511A1 |
A capacitor module disclosed in an embodiment of the present invention comprises: a capacitor including a case having an open bottom, a capacitor body disposed in the case and having first and second electrodes on both sides thereof, a r...
|
|
WO/2023/112882A1 |
The present invention provides a ceramic electronic component which is capable of maintaining the sinterability of an identification mark high relative to an element. A ceramic electronic component according to the present invention comp...
|
|
WO/2023/114961A1 |
A metal - insulator - metal (MIM) capacitor component that includes a substrate, where the metal - insulator - metal (MIM) capacitor component is configured to form a first capacitor with a top metal and a first bottom metal having a die...
|
|
WO/2023/106083A1 |
A capacitor 1 of one embodiment of this semiconductor device comprises: a substrate 10; a first electrode layer 22 provided on the substrate 10; a dielectric film 23 provided on the first electrode layer 22; a second electrode layer 24 p...
|
|
WO/2023/104867A1 |
Disclosed is a contact arrangement (1) for an electrical component, which contact arrangement has a first contact element (10) with a first guide portion (11) and a first contact portion (12), and a second contact element (20) with a sec...
|
|
WO/2023/105990A1 |
A film capacitor 1 is provided with a dielectric film (e.g., a first dielectric film 11), and a metal layer (e.g., first metal layer 21) provided on at least one surface of the dielectric film. The dielectric film is a resin film formed ...
|
|
WO/2023/105931A1 |
The purpose of the present invention is to provide a film capacitor which has good withstand voltage strength even in cases where a voltage is applied thereto for a long period of time with a high electric field strength at high temperat...
|
|
WO/2023/100502A1 |
A film capacitor according to the present disclosure is to be mounted on a substrate, and comprises: a multilayer body of dielectric films; a first electrode; a second electrode; a terminal electrode which comprises a connection part tha...
|
|
WO/2023/099092A1 |
The present disclosure concerns a choke module (1), comprising: a choke (2) with a magnetic core (4) and at least one winding (5, 6), and a support comprising at least one integrated capacitor (3, 12), wherein the choke (2) is located on...
|
|
WO/2023/100630A1 |
A module 10A for use in a semiconductor composite device 1A that supplies direct voltage adjusted by a voltage regulator including a semiconductor active element to a load 30, wherein: the module 10A comprises a capacitor layer 11 includ...
|
|
WO/2023/100538A1 |
Provided is a chip-type electronic component configured such that a large change in the electric characteristics can be suppressed after the chip-type electronic component is reflow-mounted. This chip-type electronic component comprises:...
|
|
WO/2023/094073A1 |
The invention relates to a cylindrical capacitor, consisting of a plurality of cylindrical winding elements which are stacked one on top of the other in the cylinder axial direction and have electrical contact surfaces on their end faces...
|
|
WO/2023/095473A1 |
[Problem] To provide a thin-film capacitor suited to having a high voltage applied thereto. [Solution] This thin-film capacitor 1 comprises: a dielectric layer 20; capacitor electrodes 21, 22 respectively provided on first and second sur...
|
|
WO/2023/095654A1 |
A module 10A is used in a semiconductor composite device 1A that supplies, to a load 30, a DC voltage adjusted by a voltage regulator 20 including a semiconductor active element, the module 10A comprising: a capacitor array composed of a...
|
|
WO/2023/095620A1 |
The present invention provides a multilayer ceramic electronic component which has a mechanical strength required for multilayer ceramic electronic components, while having desired ESR characteristics. A multilayer ceramic capacitor as...
|
|
WO/2023/095472A1 |
[Problem] To provide a thin-film capacitor having an increased dielectric withstand voltage. [Solution] A thin-film capacitor 1 comprises: a dielectric layer 20; capacitor electrodes 21, 22 respectively provided on a first and a second s...
|
|
WO/2023/090362A1 |
The present invention addresses the problem of providing a production method which is capable of efficiently producing a multilayer body that comprises a cellulose fiber layer and is capable of achieving a high amount of power storage. T...
|
|
WO/2023/090197A1 |
The present invention addresses the problem that, when forming a capacitor electrode by electrolytic plating using a seed layer, if step constriction occurs due to side etching in a step during formation of the seed layer, complete forma...
|
|
WO/2023/089870A1 |
In the present invention, a laminated ceramic capacitor comprises a body, external electrodes, a first inspection electrode, and a second inspection electrode. The body is formed by laminating a first internal electrode and a second inte...
|
|
WO/2023/090181A1 |
The present disclosure provides a circuit device that can suppress changes in the parasitic inductance of a capacitor. In the present disclosure, a circuit device (100) comprises a substrate (60) and a coil component (1). The coil compon...
|
|
WO/2023/090278A1 |
Provided is a capacitor (1) having a main body (10) in which a plurality of dielectric layers (13) and a plurality of electrode layers (11) are laminated, and an external electrode (20) connected to at least part of the main body, wherei...
|
|
WO/2023/090312A1 |
Provided is a laminated sheet manufacturing method which can easily reduce thickness non-uniformity. A manufacturing method of a laminated sheet 20 according to the present invention comprises: a ceramic green sheet manufacturing step S1...
|
|
WO/2023/088613A1 |
A bus bar (3) for a capacitor (1) is described, wherein the bus bar (3) is laminated and wherein the bus bar (3) comprises a round shape. Furthermore, a capacitor (1) comprising the bus bar (3) is described.
|
|
WO/2023/090293A1 |
Provided are an electronic element in which a physical quantity of a passive element can be varied in a wide range including the case where the physical quantity is 0(zero), and a circuit device. A variable capacitance element (100) comp...
|
|
WO/2023/090797A1 |
A ceramic capacitor of the present invention comprises: a ceramic body (100) in which a plurality of first dielectric layers (110) are stacked; and first and second bottom electrodes (211, 212) arranged on both sides of the bottom surfac...
|
|
WO/2023/090798A1 |
A ceramic capacitor of the present invention comprises: a ceramic body (100) having a plurality of first dielectric layers (110) stacked therein; and first and second bottom electrodes (211, 212) arranged on both sides of the lower surfa...
|
|
WO/2023/089871A1 |
This method for manufacturing a multilayer ceramic electronic component comprises: a step for alternately stacking a plurality of ceramic green sheets and a plurality of internal electrodes to obtain a mother stack in which an electrode ...
|
|
WO/2023/082493A1 |
Disclosed in the present invention are a method for producing an alloy powder, an alloy powder prepared by means of the method, and a slurry and a capacitor. By means of the method, particles closer to the spherical shape can be obtained...
|
|
WO/2023/084878A1 |
This electronic component (10) comprises an element body (20), two first internal electrodes (41) as wiring, a glass film (50), and a first base electrode (61A). The first internal electrodes (41) are positioned in an interior of the ele...
|
|
WO/2023/084879A1 |
In the present invention, a first internal electrode (41) is positioned inside an element body (20). A glass film (50) covers an outer surface (21) of the element body (20). A first base electrode (61A) is electrically connected to the f...
|
|
WO/2023/084943A1 |
An electronic component (101) comprises: a body (10) having a first surface (1); a base electrode (6) disposed on the first surface (1); and a plating film (7) covering the base electrode (6). The first surface (1) has a reference surfac...
|
|
WO/2023/085264A1 |
Provided are: a layered ceramic capacitor with improved adhesion between a capacitor body and bumps; and a paste for manufacturing bumps. This layered ceramic capacitor 1 comprises: a layered body 2 in which a dielectric layer 14 and an ...
|
|
WO/2023/083611A1 |
A choke module (1) comprises a choke (2) with a magnetic core (4) and at least two windings (5, 6) and footprint capacitor (3) which forms a plate capacitor and which is configured to provide a mechanical support for the choke (2),, the ...
|
|
WO/2023/085204A1 |
An electronic component 100 comprises: an element 10; and an exterior body 20 that seals the element 10. The exterior body 20 has a first part 21 that includes a first resin material and a second part 22 that includes a second resin mate...
|
|
WO/2023/085439A1 |
The purpose of the present invention is to provide, for example: an electronic component mounting module of surface mount type using bus bars, wherein the height of solder mount surface is aligned between an anode bus bar and a cathode b...
|
|
WO/2023/085265A1 |
Provided are a laminated ceramic capacitor and a paste for bump manufacturing with which the adhesive force between a capacitor body and a bump is improved. A laminated ceramic capacitor 1 according to the present invention is provided w...
|
|
WO/2023/084858A1 |
An element (20) has a recess (26A) that is recessed from an outer surface (21). The inner surface of the recess (26A) is not covered with a glass film (50). When the recess (26A) is viewed facing in a direction orthogonal to the outer su...
|
|
WO/2023/084942A1 |
An electronic component (101) comprises: a body (10) having a first surface (1); and a plurality of electrodes (3) disposed on the first surface (1). Each of the plurality of electrodes (3) has a base electrode (6) and a plated film (7) ...
|
|
WO/2023/085263A1 |
Provided is a multilayered ceramic capacitor and a bump manufacturing paste for achieving an improved acoustic noise prevention effect. A multilayered ceramic capacitor 1 of the present invention comprises: a stack 2 in which dielectric ...
|
|
WO/2023/085205A1 |
An electronic component 100 comprises: an electronic component element body 110 having a first surface 110e and a second surface 110f and including a first internal electrode 43, a second internal electrode 40, a collecting electrode 30 ...
|
|
WO/2023/080587A1 |
A deep learning-based MLCC stacked alignment inspection system according to one embodiment of the present invention comprises an integrated defect detection unit which detects defects by detecting a key area requiring inspection in captu...
|
|
WO/2023/080069A1 |
The purpose of the present invention is to provide a novel dielectric ceramic composition which has a high dielectric constant and low dielectric loss, in which the dielectric constant is increased by DC voltage, and in which the maximum...
|
|
WO/2023/074824A1 |
There is a growing need for saving space for circuit apparatuses comprising a capacitor apparatus. Provided is a capacitor apparatus comprising an insertion hole portion into which an external terminal is inserted, and a first connection...
|
|
WO/2023/076227A2 |
An apparatus includes at least one conductive sheet forming a forward current path from a first terminal of the at least one conductive sheet to a second terminal of the at least one conductive sheet. The at least one conductive sheet ha...
|
|
WO/2023/071016A1 |
Provided are an interdigital capacitor (1), a bending sensor (2) and a fabrication method therefor. The interdigital capacitor (1) mainly comprises an electrode layer (11), and the electrode layer (11) comprises a first electrode (111) a...
|
