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WO/2024/083789A1 |
The present invention provides a device (1) and a method for online x-ray fluorescence analysis of a chemical fluid from at least one chemical fluid bath (100). The device comprises a housing (2), a sample holder and an x-ray fluorescenc...
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WO/2024/078627A1 |
Disclosed in the present invention are an electrolytic copper dissolution-integrated insoluble anode copper plating process optimization method and apparatus. According to the method, two processes of acidic electrolytic copper dissoluti...
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WO/2024/075698A1 |
A composite material obtained by forming, on a material, a composite film comprising a silver layer containing carbon particles, wherein the crystallite size of the silver in the composite film is greater than 40nm and no greater than 70...
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WO/2024/067514A1 |
The present application relates to the technical field of photovoltaics, and discloses a solar cell electroplating device and a solar cell electroplating method. A first conductive assembly and a second conductive assembly are respective...
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WO/2024/070236A1 |
Provided is a plating apparatus with which, even when the flow amount of a plating solution sprayed from a spray unit is increased, there is no excessive rising of a material subject to plating to a high position within retained plating ...
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WO/2024/070234A1 |
Provided is a plating apparatus that suppresses the occurrence of defects in a plated object without the plated object rising excessively to a high position in a plating solution in which the plated object is contained, even if the flow ...
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WO/2024/068704A1 |
An apparatus for electrolytically coating metal wires arranged in a web also called a 'plating section' is presented. Compared to prior art plating sections, the apparatus is provided with one or more ultrasound emission boxes that hang ...
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WO/2024/069257A1 |
The present invention relates to a system (1 ) for coloring metal objects, comprising: - a device (2) for the anodic coloring of metal objects, configured to color surfaces of said metal objects based on a coloring command signal (C); - ...
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WO/2024/068552A1 |
Porous metal plate material and process for producing such a material. The material comprises a perforated metal base plate and an electrodeposited layer with pin-shaped protrusions on at least one side of the perforated base plate made ...
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WO/2024/062396A1 |
A galvanic plating apparatus (100) and a method for galvanically plating a component carrier structure (102) are provided. The galvanic plating apparatus (100) comprises an anode (104) split into a plurality of separate anode parts (106)...
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WO/2024/051135A1 |
A method for improving a silicon-wafer cleaning effect. The method is characterized by comprising the following steps: step I, a pre-cleaned silicon wafer being put into a first feeding tank (1), wherein the silicon wafer is immersed und...
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WO/2024/046426A1 |
The present invention provides a plating solution dispersion method, relating to the technical field of electroplating. The plating solution dispersion method comprises: when electroplating, intermittently inserting bubbles into a platin...
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WO/2024/041968A1 |
The invention relates to a method for controlling the chromium feed in an electrolysis process for producing a chromium layer by means of direct current and use of an anode (44, 144, 244) and a cathode (48, 148, 248), comprising, during ...
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WO/2023/239403A9 |
An electrochemical device including at least one of a carbonaceous cathode, and at least one of a metal-containing anode. A separation distance between the carbonaceous cathode and the metal-containing anode is about 1 to about 5000 micr...
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WO/2024/030745A1 |
Examples are disclosed that relate to operating an electrodeposition system comprising an inert anode. In one example system, the electrodeposition system includes a substrate holder and a cathode chamber configured to hold a catholyte. ...
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WO/2024/028973A1 |
A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction...
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WO/2024/022201A1 |
The present disclosure provides an electroplating apparatus, a multi-channel electroplating apparatus group, and an electroplating reaction system. The electroplating apparatus comprises: a cathode control member, a cathode chamber frame...
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WO/2024/004379A1 |
An image comparison system (300) comprises: an acquisition unit (111) that acquires a surface state image of a metal piece that shows the result of a plating test; a condition acquisition unit (113) that acquires test conditions for the ...
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WO/2023/246889A1 |
Disclosed in the present invention is an acid sulfate electroplating copper combination additive for dense filling of PCB through hole metal. The additive is made up of a bridger, a carrier, a refiner, and a leveler having mass ratios of...
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WO/2023/246176A1 |
The present invention relates to the technical field of metal material surface treatment, and provides a preparation method for a composite film with a self-repairing function, a product, and a use. The method comprises the following ste...
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WO/2023/248286A1 |
An anode chamber liquid management method comprising: a step for preparing a plating tank in which an anode and a diaphragm in contact with or attached firmly to the upper surface of the anode are arranged, and which is provided with a c...
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WO/2023/240729A1 |
The present invention relates to an absorption layer-adjustable laser peening forming device and method. The laser peening forming device comprises a laser peening strengthening system, an x-y-z three-axis machining platform, and a worki...
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WO/2023/243079A1 |
Provided is a plating device with which it is possible to clean a contact cleaning member. The plating device includes: a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate in which...
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WO/2023/243078A1 |
Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid ...
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WO/2023/238572A1 |
The present invention relates to a plating apparatus and a plating method, by each of which at least one main surface of a rectangular substrate is plated. A plating apparatus according to the present invention is provided with: a proces...
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WO/2023/232420A1 |
The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substra...
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WO/2023/234564A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively deposit metal raw materials on a substrate using electrochemical additive manufacturing (ECAM). In additio...
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WO/2023/234565A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively build up layers of metal materials on a substrate by using electrochemical additive manufacturing (ECAM). ...
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WO/2023/229670A1 |
A system may include a first semiconductor processing station configured to deposit a material on a first semiconductor wafer and a chemical tank that provides liquid to the processing station during a deposition process. The chemical ta...
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WO/2023/225279A1 |
Systems and methods for beneficially affecting the surface morphology of electrically conductive materials using electrochemistry are described. The systems and methods for beneficially affecting the surface morphology of electrically co...
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WO/2023/223278A1 |
A process for regenerating chemical milling solutions, comprising the steps of introducing a reagent containing silicon into a solution in such a way as to establish a molar ratio of Si/ Al equal to 1 in the solution, and letting the sil...
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WO/2023/222734A1 |
The present invention relates to a device for nanofiltration or reverse osmosis of aqueous electrolytes and a process for treating aqueous solutions at high osmotic pressures.
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WO/2023/213866A1 |
The present invention relates to a method for depositing a zinc-nickel alloy on a substrate, particularly to a method for electrolytically depositing a zinc-nickel alloy on a substrate, wherein a zinc-nickel deposition bath is utilized a...
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WO/2023/203409A1 |
The present invention relates to a piece of equipment (10) for the galvanic surface treatment of an object (O). The equipment (10) comprises: a galvanic treatment tank (20) suited to receive an electrolytic substance (S) for the galvanic...
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WO/2023/203824A1 |
The present invention proposes a method with which it is possible to manufacture a steel sheet having a beautiful plating layer without a quality defect such as a plating defect or a pickup caused, in particular, by a distortion in the s...
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WO/2023/196285A1 |
Electroplating methods may include providing an initial anolyte to a first compartment of an electrochemical cell. The methods may include providing an initial catholyte to a second compartment of the electrochemical cell. The initial ca...
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WO/2023/196284A1 |
Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemica...
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WO/2023/185546A1 |
Disclosed in the present invention is an electroplating apparatus, comprising: a film frame, the center of which is provided with a through hole; a conveying branch pipe extending from a side wall of the film frame through hole to the ed...
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WO/2023/183158A1 |
Methods and apparatus for electroplating a substrate incorporate aspects of digital lithography and feedback from electroplating processes to improve characteristics of plating material based on die patterns. In some embodiments, a metho...
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WO/2023/176096A1 |
Provided are: a method for circulating an iron-based electroplating solution that can stably produce an iron-based electroplating solution with high electrolysis efficiency, no sludge contamination, and power saving without requiring a l...
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WO/2023/174255A1 |
An electroplating clamp, and an assembly line capable of vertical rack electroplating and horizontal rotating electroplating, which relate to the technical field of electroplating clamps. The electroplating clamp comprises a support plat...
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WO/2023/172854A1 |
An electroplating apparatus comprises an anode chamber flow loop. The anode chamber flow loop comprises an anode chamber that contains an anolyte solution and an anode. A flow meter doses anolyte solution components into the anode chambe...
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WO/2023/164994A1 |
A bactericidal environmentally friendly composite coating, a preparation method therefor, and a bactericidal environmentally friendly product. The bactericidal environmentally friendly composite coating comprises: a semi-bright nickel la...
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WO/2023/168210A1 |
Examples are disclosed herein that relate to characterizing a plating gap between an anode structure and a cathode in an electrodeposition tool. One example provides a fixture for characterizing a spacing of a plating gap of an electrode...
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WO/2023/167009A1 |
Provided are an apparatus and a method for trivalent chromium plating for a cylinder, with which it is possible to perform trivalent chromium plating using a trivalent chromium plating solution, with good and uniform deposition and excel...
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WO/2023/154151A1 |
A system may include a first semiconductor processing station configured to deposit a material on a first semiconductor wafer, a second semiconductor processing station configured perform measurements indicative of a thickness of the mat...
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WO/2023/148869A1 |
The present disclosure provides a plating device and a drying method that make it possible to keep an electrical contact dry. This plating device comprises a blow module and a substrate holder that holds a substrate and has an electric...
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WO/2023/146591A1 |
Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system. The methods may include removing the sem...
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WO/2023/143842A1 |
The disclosure relates to a substrate holder (S1) for holding a substrate (1) in a chemical and/or electrolytic surface treatment of the substrate (1), a substrate handling system comprising a substrate holder (S1) and an immersion scann...
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WO/2023/146590A1 |
A semiconductor processing chamber may process wafers by submerging the wafers in a liquid. To determine when the liquid is free of disturbances or contaminants and thus ready to receive the next wafer, a camera may be positioned to capt...
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