Title:
PLATING DEVICE AND DRYING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/148869
Kind Code:
A1
Abstract:
The present disclosure provides a plating device and a drying method that make it possible to keep an electrical contact dry. This plating device comprises a blow module and a substrate holder that holds a substrate and has an electrical contact for supplying power to the substrate. The blow module has a substrate holder stage for supporting the substrate holder, a drying nozzle assembly that has a nozzle for spraying a gas at the substrate and the substrate holder, and an actuator for moving the drying nozzle assembly such that the nozzle moves in a plane along the surface of the substrate.
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Inventors:
YAMASAKI GAKU (JP)
Application Number:
PCT/JP2022/004188
Publication Date:
August 10, 2023
Filing Date:
February 03, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D21/00
Domestic Patent References:
| WO2020050009A1 | 2020-03-12 |
Foreign References:
| JP2018100432A | 2018-06-28 | |||
| JP2014519209A | 2014-08-07 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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