Title:
ULTRAFAST LASER MICRO-HOLE MACHINING METHOD FOR IN-SITU HOLE TRIMMING
Document Type and Number:
WIPO Patent Application WO/2024/087248
Kind Code:
A1
Abstract:
An ultrafast laser micro-hole machining method for in-situ hole trimming, which relates to the field of laser micro-hole machining. For the problems of it being difficult to optimize micro-hole geometric shapes and recast layers adhering to hole walls in laser drilling processes, through hole machining is carried out firstly, then reaming modification is carried out, and the geometric shape of a through hole is optimized in two steps, such that a micro-hole with high roundness and small taper and a large-area micro-hole array can be machined. Therefore, the micro-hole size accuracy is ensured, and the machining efficiency is also improved.
Inventors:
ZHANG FENGYUN (CN)
SUN SHUFENG (CN)
WANG QIAN (CN)
WANG JIN (CN)
WANG PINGPING (CN)
PANG YONG (CN)
WANG YADI (CN)
SHAO JING (CN)
ZHANG JIAN (CN)
SUN SHUFENG (CN)
WANG QIAN (CN)
WANG JIN (CN)
WANG PINGPING (CN)
PANG YONG (CN)
WANG YADI (CN)
SHAO JING (CN)
ZHANG JIAN (CN)
Application Number:
PCT/CN2022/130050
Publication Date:
May 02, 2024
Filing Date:
November 04, 2022
Export Citation:
Assignee:
UNIV QINGDAO TECHNOLOGY (CN)
International Classes:
B23K26/382; B23K26/70
Attorney, Agent or Firm:
JINAN SHENGDA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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