Title:
STANDOFF AND SUPPORT STRUCTURES FOR RELIABLE LAND GRID ARRAY AND HYBRID LAND GRID ARRAY INTERCONNECTS
Document Type and Number:
WIPO Patent Application WO/2024/002139
Kind Code:
A9
Abstract:
Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier (640) having a first carrier thickness with an array of vias (650), each having a first diameter； providing pockets (660) around top surfaces of the vias (650), each having a second diameter and creating a portion of the pockets (660) having a second carrier thickness that is less than the first carrier thickness； providing socket contact springs (610), each comprising a hole support structure (630) that supports the socket contact spring (610) within the via (650), and a contact beam (612) configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly； wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam (612) from inelastically deforming when bent under load. Alternately, a contact feature (670) may be used to prevent the inelastic deformation.
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Inventors:
HOFFMEYER MARK K (US)
CZAPLEWSKI-CAMPBELL SARAH K (US)
BEAMAN BRIAN (US)
YU YUET-YING (US)
CZAPLEWSKI-CAMPBELL SARAH K (US)
BEAMAN BRIAN (US)
YU YUET-YING (US)
Application Number:
PCT/CN2023/103098
Publication Date:
February 01, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
IBM (US)
IBM CHINA CO LTD (CN)
IBM CHINA CO LTD (CN)
International Classes:
H01R43/18
Attorney, Agent or Firm:
ZHONGZI LAW OFFICE (CN)
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