Title:
SOLID-STATE IMAGING DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/095805
Kind Code:
A1
Abstract:
Provided is a solid-state imaging device having a laminated structure in which a first substrate and a second substrate that is smaller in area than the first substrate are layered. The first substrate has: an electronic circuit that includes an imaging element; an inspection circuit that is for inspecting the electronic circuit; a first joining electrode that is provided in a first layering region in which the second substrate is layered and that is for electrically and physically joining to the second substrate; and an inspection electrode that is provided in a region other than the first layering region and that electrically connects to the inspection circuit. The second substrate has: a logic circuit that controls the imaging element; and a second joining electrode that is for joining to the first joining electrode of the first substrate.
Inventors:
USHIKU YUKI (JP)
YAMADA KYOSUKE (JP)
YAMADA KYOSUKE (JP)
Application Number:
PCT/JP2023/038168
Publication Date:
May 10, 2024
Filing Date:
October 23, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/02; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Domestic Patent References:
| WO2020129686A1 | 2020-06-25 |
Foreign References:
| JP2020098901A | 2020-06-25 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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