Title:
SILVER-CONTAINING COMPOSITION AND SILVER SINTERED BODY
Document Type and Number:
WIPO Patent Application WO/2024/029487
Kind Code:
A1
Abstract:
The present invention provides a silver-containing composition that contains first silver particles and second silver particles, the first silver particles having a D50 equal to or greater than 0.1 μｍ and less than 0.4 μｍ, the second silver particles having a D50 equal to or greater than 0.4 μｍ and less than 2.3 μｍ. The ratio of the total content of the first silver particles and second silver particles to the total content of all silver particles is 65 mass% or more. The present invention provides a silver sintered body formed using the silver-containing composition. As test piece having the same composition as that of the silver sintered body, a test piece having a width of 5 mm, a length of 6 mm at the area to be measured, and a thickness of 0.1 mm is created and when the test piece is subjected to a tensile test in the longitudinal direction at a test speed of 1×10-4/s, the maximum stress is at least 100 MPa.
Inventors:
MORII MASATO (JP)
SEKIGUCHI TAKUYA (JP)
SEKIGUCHI TAKUYA (JP)
Application Number:
PCT/JP2023/027942
Publication Date:
February 08, 2024
Filing Date:
July 31, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
B22F1/00; B22F1/052; B22F1/107; B22F7/08; B22F9/00
Domestic Patent References:
| WO2021044817A1 | 2021-03-11 |
Foreign References:
| JP2021059769A | 2021-04-15 | |||
| JP2021195592A | 2021-12-27 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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