Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/082529
Kind Code:
A1
Abstract:
Disclosed are a semiconductor structure and a manufacturing method for the semiconductor structure. The semiconductor structure comprises: a first structural member and a second structural member, which are stacked and welded to each other, wherein the surface of the first structural member facing the second structural member is provided with a pad; the surface of the pad facing the second structural member is provided with a plurality of mutually separated protrusions; and a solder layer is further provided between the pad and the second structural member to cover the protrusions.
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Inventors:
LIU YING (CN)
Application Number:
PCT/CN2023/081691
Publication Date:
April 25, 2024
Filing Date:
March 15, 2023
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/498; H01L21/48; H01L21/603
Foreign References:
| CN213960403U | 2021-08-13 | |||
| CN111316409A | 2020-06-19 | |||
| US20080290528A1 | 2008-11-27 | |||
| JP2011198796A | 2011-10-06 |
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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