Title:
【発明の名称】取り外し自在のリード支持体を備えた半導体接続構成体およびその製造方法
Document Type and Number:
Japanese Patent JP3151219
Kind Code:
B2
Abstract:
A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.
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Inventors:
Distiff Ano, Thomas, H
Grave, Gully, W.
Candros, Igora, Wai.
Matthew, Gotan
Svice, Jason
Union, lorry
Gibson, David
Grave, Gully, W.
Candros, Igora, Wai.
Matthew, Gotan
Svice, Jason
Union, lorry
Gibson, David
Application Number:
JP50470694A
Publication Date:
April 03, 2001
Filing Date:
July 23, 1993
Export Citation:
Assignee:
Tetsusera, Inc.
International Classes:
H01L23/31; H01L23/495; H01L23/498; H01L23/50; H01L21/60; H05K1/18; H05K3/36; H05K3/40; (IPC1-7): H01L23/50; H01L21/60; H05K1/18
Domestic Patent References:
| JP4152648A | ||||
| JP4168738A | ||||
| JP4162734A | ||||
| JP4107939A | ||||
| JP61137353A | ||||
| JP45642U | ||||
| JP6504408A |
Other References:
【文献】国際公開92/5582(WO,A1)
Attorney, Agent or Firm:
Minoru Yakushi (1 person outside)