Title:
SEMICONDUCTOR PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/082345
Kind Code:
A1
Abstract:
Disclosed in the present disclosure is a semiconductor packaging structure, comprising a packaging substrate and crystal grains. The packaging substrate comprises a preset packaging channel, a first contact member and a second contact member. The crystal grains comprise a first packaging crystal grain and a second packaging crystal grain; and a projection of a first pin of the first packaging crystal grain on the packaging substrate coincides with a projection of a second pin of the second packaging crystal grain on the packaging substrate. The first pin is electrically connected to the first contact member by means of a first wire; the second pin is electrically connected to the second contact member by means of a second wire; and a projection of a mounting end part of the first wire on the packaging substrate and a projection of a mounting end part of the second wire on the packaging substrate are staggered.
Inventors:
SHI HONGLONG (CN)
Application Number:
PCT/CN2022/129642
Publication Date:
April 25, 2024
Filing Date:
November 03, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/48
Foreign References:
| CN114093854A | 2022-02-25 | |||
| CN103000588A | 2013-03-27 | |||
| CN101604684A | 2009-12-16 | |||
| CN113161323A | 2021-07-23 | |||
| US20150085195A1 | 2015-03-26 |
Attorney, Agent or Firm:
BOXIN CHINA INTELLECTUAL PROPERTY (CN)
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