Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/095830
Kind Code:
A1
Abstract:
This semiconductor device comprises: a conductor; a semiconductor chip that is mounted on the conductor and is electrically connected via a bonding material; a first substrate that is positioned with a gap interposed between the first substrate and the conductor in the thickness direction of the semiconductor chip, and has an insulating layer and an electrode layer; an electronic component that is positioned on the first substrate and is electrically connected to the electrode layer; and wiring that electrically connects the semiconductor chip and the electrode layer. The first substrate has a region that overlaps with the conductor as viewed in the thickness direction of the semiconductor chip.
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Inventors:
EGUSA HIROSHI (JP)
Application Number:
PCT/JP2023/038360
Publication Date:
May 10, 2024
Filing Date:
October 24, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L25/07; H01L23/36; H01L25/00; H01L25/18
Foreign References:
| JPH09139461A | 1997-05-27 | |||
| JPH02291160A | 1990-11-30 | |||
| JP2013247168A | 2013-12-09 | |||
| JP2018014357A | 2018-01-25 | |||
| JP2016018842A | 2016-02-01 |
Attorney, Agent or Firm:
KITANO Shuhei et al. (JP)
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