Title:
COIL COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/095829
Kind Code:
A1
Abstract:
Provided is a coil component capable of improving stability when cores are disposed on a plurality of substrates. The coil component of the present disclosure comprises a plurality of substrates, a core material, and a support member. Each of the plurality of substrates includes a coil pattern. The plurality of substrates are layered in the thickness direction with gaps therebetween. The core material is disposed on each of the plurality of substrates. The support member engages with outer peripheral portions of the plurality of substrates and supports the plurality of substrates so as to maintain the gaps.
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Inventors:
SATO YOSHIYUKI (JP)
EBISUMOTO DAIGORO (JP)
KAWAMOTO TAKAYUKI (JP)
MISHIMA JUNYA (JP)
EBISUMOTO DAIGORO (JP)
KAWAMOTO TAKAYUKI (JP)
MISHIMA JUNYA (JP)
Application Number:
PCT/JP2023/038353
Publication Date:
May 10, 2024
Filing Date:
October 24, 2023
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01F27/24; H01F27/28; H01F27/30
Foreign References:
| CN112863826A | 2021-05-28 | |||
| JPS6228468U | 1987-02-20 | |||
| JP2011159689A | 2011-08-18 | |||
| JPH11346041A | 1999-12-14 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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