SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS - SONY SEMICONDUCTOR SOLUTIONS CORP

Title:

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

Document Type and Number:

WIPO Patent Application WO/2024/005172

Kind Code:

A1

Abstract:

The purpose of the present invention is to improve the production yield. A semiconductor device according to the present invention comprises a base member which has a first bonding surface and a semiconductor chip which has a rectangular second bonding surface; and the second bonding surface of the semiconductor chip and the first bonding surface of the base member are directly bonded to each other. The semiconductor chip is provided with: a multilayer wiring layer that comprises the second bonding surface; and a semiconductor layer that is arranged on a surface of the multilayer wiring layer, the surface being on the reverse side from the second bonding surface side. The multilayer wiring layer comprises a warping suppression layer which extends along at least one side of the second bonding surface and suppresses warping of the semiconductor chip.

Inventors:

HORIKIRI TATSUYA (JP)
FUJII YOSUKE (JP)
MIYAWAKI TAKUHIRO (JP)
SAITO SOTETSU (JP)
YAMAGUCHI MASANARI (JP)
MURAKAMI YUKAKO (JP)
OINOUE TAKASHI (JP)
OGAWA NAOKI (JP)
HIRATSUKA TATSUMASA (JP)
ONODERA TAKUMI (JP)
MIKI HOKUTO (JP)
HIRANO TAKAAKI (JP)
NEGORO YOICHI (JP)
OKUYAMA ATSUSHI (JP)

Application Number:

PCT/JP2023/024297

Publication Date:

January 04, 2024

Filing Date:

June 29, 2023

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H01L27/146; H04N25/70

Domestic Patent References:

WO2020183965A1	2020-09-17
WO2019021705A1	2019-01-31
WO2020055889A1	2020-03-19

Foreign References:

JP2010165747A	2010-07-29
JP2009212315A	2009-09-17
JPH1140687A	1999-02-12
JP2010205893A	2010-09-16
JP2008270487A	2008-11-06