Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/095884
Kind Code:
A1
Abstract:
A resin composition containing compound B1 represented by formula (1-1) and at least one resin selected from the group consisting of a polyimide and a polyimide precursor having a polymerizable group, wherein the compound B1 has an ethylenically unsaturated bond value of at least 3.0 mmol/g; a cured product; a laminate; a method for producing a cured product; a method for producing a laminate; a method for manufacturing a semiconductor device; and a semiconductor device. In formula (1-1), R1 represents a hydrogen atom or a C1-3 alkyl group, Ar1 represents an aromatic group which may have a substituent, Z represents a hydrogen atom or an n-valent organic group, and Z does not include the structure -X1-C(=O)-C(=O)-X2-.
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Inventors:
OGAWA MICHIHIRO (JP)
NOZAKI ATSUYASU (JP)
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2023/038659
Publication Date:
May 10, 2024
Filing Date:
October 26, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; B32B15/088; B32B27/34; C08G73/10; G03F7/004; G03F7/027; G03F7/037
Domestic Patent References:
| WO2020226132A1 | 2020-11-12 | |||
| WO2020226131A1 | 2020-11-12 | |||
| WO2018225676A1 | 2018-12-13 | |||
| WO2022210096A1 | 2022-10-06 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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