Title:
RESIN COMPOSITION, CURED OBJECT, LAYERED OBJECT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED OBJECT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/095885
Kind Code:
A1
Abstract:
A resin composition comprising at least one resin selected from the group consisting of polyimides and precursors thereof, a polymerizable compound, and a photopolymerization initiator, wherein the polymerizable compound has an ethylenically unsaturated bond equivalent of 100-300 g/mol; a cured object; a layered object; a method for producing the cured object; a method for producing the layered object; a method for producing a semiconductor device; and the semiconductor device.
Inventors:
OOTA KAZUYA (JP)
MASAKI YOSUKE (JP)
NOZAKI ATSUYASU (JP)
OGAWA MICHIHIRO (JP)
MASAKI YOSUKE (JP)
NOZAKI ATSUYASU (JP)
OGAWA MICHIHIRO (JP)
Application Number:
PCT/JP2023/038660
Publication Date:
May 10, 2024
Filing Date:
October 26, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; B32B15/088; B32B27/34; C08L79/08; G03F7/004; G03F7/027; G03F7/037
Attorney, Agent or Firm:
SIKs & Co. (Kyobashi-Nisshoku Bldg. 8-7, Kyobashi 1-chome, Chuo-k, Tokyo 31, JP)
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