Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190064
Kind Code:
A1
Abstract:
Provided are: a resin composition including a polyimide or a polyimide precursor, wherein a cured product obtained from the resin composition satisfies all of the following conditions (i) to (iv); a cured product; a laminate; a method for producing cured product; a method for producing a laminate; a method for producing a semiconductor device; and a semiconductor device; condition (i): Young's modulus of the cured product is 3.5 GPa or more, condition (ii): the coefficient of thermal expansion of the cured product in the temperature range from 25°C up to 125°C is less than 50 ppm/°C, condition (iii): the Tg of the cured product is 240°C or higher, and condition (iv): the elongation at break of the cured product is 40% or higher.
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Inventors:
OOTA KAZUYA (JP)
NOZAKI ATSUYASU (JP)
OGAWA MICHIHIRO (JP)
DAIKUHARA KENJI (JP)
NOZAKI ATSUYASU (JP)
OGAWA MICHIHIRO (JP)
DAIKUHARA KENJI (JP)
Application Number:
PCT/JP2023/011593
Publication Date:
October 05, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; B32B27/34; C08F2/44; C08F283/04; C08F290/14; G03F7/004; G03F7/027; G03F7/20; G03F7/40; H01L21/312
Domestic Patent References:
| WO2021020344A1 | 2021-02-04 | |||
| WO2021020463A1 | 2021-02-04 | |||
| WO2020066975A1 | 2020-04-02 | |||
| WO2022045123A1 | 2022-03-03 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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