Title:
REPLACEMENT LEAD PACKAGE AND REPLACEMENT LEAD SET FOR WRITING IMPLEMENT
Document Type and Number:
WIPO Patent Application WO/2024/085151
Kind Code:
A1
Abstract:
The present invention provides a replacement lead package and a replacement lead set which are for a writing implement and which achieve a plastic-free state and suppress an increase in manufacturing costs. This replacement lead package is constituted by a flat plate body 2 composed of a cardboard comprising a core formed by a paper base material in a wavy shape, and a liner composed of a paper base material adhered to both surfaces of the core, wherein a linear space section formed between the core and the liner is used as a replacement lead chamber, and the replacement lead L for a writing tool is accommodated in the replacement lead chamber. A replacement lead extraction hole 9 of the replacement lead chamber is formed in an end section of the flat plate body 2, and a label seal 10 for covering the lead replacement extraction hole 9 is stuck to the flat plate body 2 and thus the replacement lead extraction hole 9 is sealed.
Inventors:
KAJIZUKA TAKASHI (JP)
HASHIMOTO CHIKA (JP)
FUKAZAWA NAOTO (JP)
YOSHIDA KAZUNORI (JP)
HASHIMOTO CHIKA (JP)
FUKAZAWA NAOTO (JP)
YOSHIDA KAZUNORI (JP)
Application Number:
PCT/JP2023/037572
Publication Date:
April 25, 2024
Filing Date:
October 17, 2023
Export Citation:
Assignee:
MITSUBISHI PENCIL CO (JP)
International Classes:
B43K19/14
Foreign References:
| JP2003080889A | 2003-03-19 | |||
| JPS633220U | 1988-01-11 | |||
| DE19541443A1 | 1996-07-04 |
Attorney, Agent or Firm:
KINOSHITA Shigeru (JP)
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