Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/070831
Kind Code:
A1
Abstract:
The present invention provides a polishing composition that allows etching to proceed efficiently. Provided is a polishing composition containing: silica particles as the abrasive grains; a basic compound; and water. Here, the basic compound includes an organic amine A represented by general formula (1) described in claim 1 of the present application, and a basic compound B that is a different basic compound from the organic amine A. Here, in formula (1), R1 is a hydrogen atom or an organic group, and X is an oxygen atom or a sulfur atom.
Inventors:
TAKAMA DAIKI (JP)
GOTO OSAMU (JP)
TANAKA YUKI (JP)
GOTO OSAMU (JP)
TANAKA YUKI (JP)
Application Number:
PCT/JP2023/034005
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2019087818A1 | 2019-05-09 | |||
| WO2018180479A1 | 2018-10-04 |
Foreign References:
| JP2020161603A | 2020-10-01 | |||
| JP2020027834A | 2020-02-20 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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