Title:
COMPOSITION FOR FINISH POLISHING
Document Type and Number:
WIPO Patent Application WO/2024/070832
Kind Code:
A1
Abstract:
The present invention provides a composition for finish polishing, the composition enabling efficient proceeding of etching, thereby being capable of improving the polishing rate, while maintaining the surface quality after the polishing. The present invention provides a composition for finish polishing, the composition containing silica particles that serve as abrasive grains, a basic compound, and water. The basic compound contains ammonia and an amine (A) which has a lower pKa than ammonia; and the ratio (CA/CB) of the content (CA) of the amine (A) to the content (CB) of the ammonia is 0.05 or more on a weight basis.
Inventors:
TAKAMA DAIKI (JP)
TANAKA YUKI (JP)
GOTO OSAMU (JP)
TSUCHIYA KOHSUKE (JP)
TANAKA YUKI (JP)
GOTO OSAMU (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2023/034006
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2019087818A1 | 2019-05-09 | |||
| WO2018180479A1 | 2018-10-04 |
Foreign References:
| JP2020161603A | 2020-10-01 | |||
| JP2020027834A | 2020-02-20 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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