Title:
MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/090427
Kind Code:
A1
Abstract:
The present invention provides a molded body which has low compression set and low hardness, while having electrical conductivity. This molded body contains a polyurethane elastomer and a conductive filler; the polyurethane elastomer comprises a matrix that contains a specific first structure and domains that are dispersed in the matrix; the domains each contain a second structure that is different from the first structure; the conductive filler is unevenly distributed in the matrix; the parameter A indicating the viscoelasticity term of the domains and the parameter B indicating the viscoelasticity term of the matrix as determined by a viscoelastic image of a cross-section of this molded body obtained by a scanning probe microscope satisfy the relational expression A < B; the content ratio of the conductive filler in this molded body is 0.02% by mass to 5.0% by mass; the volume resistivity of this molded body is 1.0 × 109 Ω∙cm or less; and the Young's modulus of this molded body is 0.5 MPa to 4.0 MPa.
Inventors:
HIRATANI TAKAYUKI (JP)
WATANABE MASAHIRO (JP)
HINO TETSUO (JP)
OGAWA RYO (JP)
YOSHIMATSU NOBUKI (JP)
WATANABE MASAHIRO (JP)
HINO TETSUO (JP)
OGAWA RYO (JP)
YOSHIMATSU NOBUKI (JP)
Application Number:
PCT/JP2023/038324
Publication Date:
May 02, 2024
Filing Date:
October 24, 2023
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
C08J5/00; C08G18/08; C08G18/44; C08K3/04; C08L75/04; G03G15/00; H01B1/24
Domestic Patent References:
| WO2022230638A1 | 2022-11-03 |
Foreign References:
| JP2021067946A | 2021-04-30 | |||
| JPH10111599A | 1998-04-28 | |||
| JP2014228597A | 2014-12-08 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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