Title:
MODIFIED RESIN AND PREPARATION METHOD THEREFOR, DIELECTRIC MATERIAL, SHEET MATERIAL, AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/216980
Kind Code:
A1
Abstract:
The application discloses a modified resin and a preparation method thereof, a dielectric material, a sheet material, and an electric device, belonging to the field of polymer materials. The modified resin comprises: a hydrocarbon resin backbone and a benzocyclobutene group. The hydrocarbon resin backbone has a plurality of dangling double bonds, and the benzocyclobutene group is grafted to at least one of the plurality of dangling double bonds. The modified resin has at least the following advantages: a high glass transition temperature, which results in excellent high temperature resistance, and a lower dielectric loss, which results in excellent dielectric properties. The modified resin can facilitate the preparation of a circuit board with high heat resistance and low dielectric loss, such that the electrical performance of the circuit board can be improved, and the service life and reliability of the circuit board can also be improved.
More Like This:
Inventors:
CHANG TONGXIN (CN)
CAI LI (CN)
GAO FENG (CN)
LUO WEN (CN)
OU XIANGHUI (CN)
CAI LI (CN)
GAO FENG (CN)
LUO WEN (CN)
OU XIANGHUI (CN)
Application Number:
PCT/CN2023/092206
Publication Date:
November 16, 2023
Filing Date:
May 05, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C08F8/00; C08F36/06
Foreign References:
| CN114085300A | 2022-02-25 | |||
| US20200347168A1 | 2020-11-05 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: