Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HYDROGENATED RESIN AND PREPARATION METHOD THEREFOR, DIELECTRIC MATERIAL, SHEET MATERIAL, AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/216979
Kind Code:
A1
Abstract:
The application discloses a hydrogenated resin and a preparation method therefor, a dielectric material, a sheet material and an electric device, belonging to the field of polymer materials. The hydrogenated resin is obtained by hydrotreating a modified resin intermediate. The modified resin intermediate comprises: a hydrocarbon resin backbone and a benzocyclobutene group. The hydrocarbon resin backbone has a plurality of dangling double bonds, and the benzocyclobutene group is grafted to at least one of the plurality of dangling double bonds. The hydrogenated resin has excellent dielectric properties, excellent temperature resistance and excellent aging resistance.

Inventors:
CHANG TONGXIN (CN)
CAI LI (CN)
GAO FENG (CN)
LUO WEN (CN)
OU XIANGHUI (CN)
Application Number:
PCT/CN2023/092202
Publication Date:
November 16, 2023
Filing Date:
May 05, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C08F8/04; C08F36/06
Foreign References:
CN111875759A2020-11-03
CN113912795A2022-01-11
EP0227124A21987-07-01
US4667005A1987-05-19
US20170369609A12017-12-28
US5422410A1995-06-06
CN114085300A2022-02-25
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: