Title:
MICROPHONE STRUCTURE AND VOICE COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/216687
Kind Code:
A1
Abstract:
The present application discloses a microphone structure and a voice communication device. The microphone structure comprises a hollow housing, a first substrate, an acoustic element, a second substrate, a third substrate and an elastic vibration thin film. The first substrate, the second substrate, and the third substrate are sequentially laminated from top to bottom. A sound transmission hole is formed in the first substrate in a penetrating manner in the thickness direction; a first sound cavity is formed in the second substrate; and a second sound cavity is formed in the third substrate, and the sound transmission hole, the first sound cavity, and the second sound cavity are coaxially arranged. The hollow housing sealingly covers the first substrate, an accommodating cavity is defined by the hollow housing and the first substrate, and the acoustic element is provided on the first substrate and located in the accommodating cavity. The elastic vibration thin film is sealedly provided at a transition position of the first sound cavity and the second sound cavity.
Inventors:
MIAO JIANMIN (CN)
ZHANG JINJIAO (CN)
ZHANG JINJIAO (CN)
Application Number:
PCT/CN2023/079600
Publication Date:
November 16, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
MG MICROELECTRONICS CO LTD (CN)
International Classes:
H04R19/04
Foreign References:
| CN114374920A | 2022-04-19 | |||
| CN111050259A | 2020-04-21 | |||
| CN209964302U | 2020-01-17 | |||
| US20200267480A1 | 2020-08-20 | |||
| CN114786104A | 2022-07-22 | |||
| CN217389001U | 2022-09-06 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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