METHOD FOR MANUFACTURING ELECTROLYTIC COPPER FOIL

WIPO Patent Application WO/2023/219264

A1

A method for manufacturing an electrolytic copper foil, according to one embodiment of the present invention, comprises the steps of: dissolving copper (Cu) and nickel (Ni) in sulfuric acid to prepare an electrolytic solution containing copper ions and nickel ions; and forming a copper layer by supplying current to a positive electrode plate and a negative electrode rotating drum that are disposed apart from each other in the electrolytic solution, wherein the concentration of the nickel ions is adjusted to 50 ppm to 350 ppm.

WO/2017/051898	METAL FOIL, METAL FOIL PROVIDED WITH RELEASE LAYER, LAMINATE BODY, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS, AND PRINTED CIRCUIT BOARD PRODUCTION METHOD
JP4065004	Electrolytic copper foil, surface-treated electrolytic copper foil obtained by using the electrolytic copper foil, copper-clad laminate and printed wiring board using the surface-treated electrolytic copper foil.
JP4349690	Manufacturing method of electrolytic copper foil

KIM JEONG HWAN (KR)
HEO SAE KWON (KR)
HU GYUN (KR)

PCT/KR2023/004101

November 16, 2023

March 28, 2023

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KOREA ZINC CO LTD (KR)
KZAM CORP (KR)

C25D1/04; C25D3/58; C25D5/00

KR20130109161A	2013-10-07
KR20210056073A	2021-05-18
JP2021054031A	2021-04-08
JP2015045092A	2015-03-12
KR20190012922A	2019-02-11
KR102405236B1	2022-06-07
KR100389061B1	2003-06-25
JP2020530878A	2020-10-29

CHANG, Duck Soon et al. (KR)

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