LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2024/094198

A1

The present invention is applicable to the technical field of LED packaging, and provides an LED light-emitting device and a manufacturing method therefor. The LED light-emitting device comprises a support, an LED chip and a package adhesive layer. The support comprise a substrate and an enclosing dam, wherein the substrate has a front surface and a back surface opposite each other, and the enclosing dam has a bottom surface and a top surface opposite each other; the LED chip and the bottom surface of the enclosing dam are arranged on the front surface of the substrate, the enclosing dam surrounds the LED chip to form a chip mounting area for mounting the LED chip and bearing the package adhesive layer, and the package adhesive layer performs packaging above the LED chip; and the enclosing dam and the package adhesive layer are transparent or semitransparent, and transparent or semitransparent hollow particles are arranged at the top of the package adhesive layer. By means of the LED light-emitting device and the manufacturing method therefor provided in the present invention, the product brightness is high, and the user experience is good.

WANG DONGDONG (CN)
YANG LIMIN (CN)
SUN PINGRU (CN)
WANG CHUANHU (CN)
TAN PANFENG (CN)
LI CHUNLIANG (CN)
HUANG HUI (CN)
WU PIANPIAN (CN)

PCT/CN2023/129764

May 10, 2024

November 03, 2023

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HUIZHOU JUFEI OPTOELECTRONICS LTD (CN)

H01L33/54; H01L33/48; H01L33/50; H01L33/56

CN115663098A	2023-01-31
CN110098301A	2019-08-06
CN102931178A	2013-02-13
CN109037419A	2018-12-18
US20160104827A1	2016-04-14

SHENZHEN YOUTH PATENT AND TRADEMARK AGENCY LTD (CN)

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