Title:
GSR ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/085098
Kind Code:
A1
Abstract:
[Problem] When forming GSR elements directly onto an integrated circuit substrate (ASIC), it has been difficult to form micro-coils because of a) the method of forming inverted trapezoidal grooves, b) unevenness in the ASIC substrate surface, and c) the placement of openings in the ASIC substrate. [Solution] a) A positive-resist resin film is applied onto an ASIC substrate, and is simultaneously exposed and developed with grooves for installing magnetic wires and with a plurality of alignment-mark recesses to form inverted trapezoidal grooves, b) the primary bases are flattened by a two-layer resin method to eliminate the unevenness, and c) partial exposure for only the grooves for installing magnetic wires is added to form inverted trapezoidal and bilaterally-symmetrical grooves. GSR elements having a micro-coil pitch of 3 μm or less can thereby be manufactured directly onto ASIC substrates.
Inventors:
KUDO KAZUE (JP)
TANABE JUNNICHI (JP)
HONKURA YOSHINOBU (JP)
HONKURA SHINPEI (JP)
KIKUCHI EIKI (JP)
TANABE JUNNICHI (JP)
HONKURA YOSHINOBU (JP)
HONKURA SHINPEI (JP)
KIKUCHI EIKI (JP)
Application Number:
PCT/JP2023/037313
Publication Date:
April 25, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
MAGNEDESIGN CORP (JP)
International Classes:
G01R33/02; H01L21/822; H01L27/04; H10N50/00; H10N50/01; H10N50/80
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