Title:
CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2024/095688
Kind Code:
A1
Abstract:
According to the present invention, a first surface (5a) of a substrate (5) is provided with a groove part (9a) and a groove part (9b) that linearly extend. In cases where the angle (C1) between a bottom surface (91a) and a lateral surface (92a) of the groove part (9a) is smaller than the angle (C2) between a bottom surface (91b) and a lateral surface (92b) of the groove part (9b), the thickness (L1) of a lateral surface part (312a) of an adhering layer (31a) which is formed along the lateral surface (92a) of the groove part (9a) is smaller than the thickness (L2) of a lateral surface part (312b) of an adhering layer (31b) which is formed along the lateral surface (92b) of the groove part (9b).
Inventors:
OKADA MOMOKO
MURATA KEISHIRO
SAKAUE YOSHITAKA
MURATA KEISHIRO
SAKAUE YOSHITAKA
Application Number:
PCT/JP2023/036339
Publication Date:
May 10, 2024
Filing Date:
October 05, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01B5/14; G06F3/041; G06F3/044
Domestic Patent References:
| WO2015146447A1 | 2015-10-01 |
Foreign References:
| JP2016510153A | 2016-04-04 | |||
| JP2015138286A | 2015-07-30 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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