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Patent Searching and Data


Title:
BONDING DEVICE AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/092380
Kind Code:
A1
Abstract:
The present disclosure relates to a bonding device and a bonding method. In the bonding device, a press-bonding mechanism (1) moves a first membrane to be bonded (4) toward a bearing membrane (31), so as to move said first membrane (4) to gradually come into contact, from the middle to both ends, with a second membrane to be bonded (5), such that said first membrane (4) is finally completely bonded to said second membrane (5) to form a press-bonded membrane assembly. A clamping fixture and the press-bonding mechanism (1) synchronously move toward a flexible bonding pad (22) to allow the flexible bonding pad (22) to sequentially come into contact, from the middle to both ends, with the bearing membrane (31), so as to remove bubbles between the bearing membrane (31) and the flexible bonding pad (22) from both sides. There are no bubbles or wrinkles between the first membrane (4) and the second membrane (5), making the quality of the bonded membrane assembly relatively stable. (FIG. 1)

Inventors:
ZHOU GUODONG (CN)
WANG PENG (CN)
FAN RONGKUN (CN)
WANG JIALIN (CN)
LIANG HAITAO (CN)
ZENG FEI (CN)
MENG XUE (CN)
PU QIANG (CN)
ZHOU WEI (CN)
YE LIPENG (CN)
HE JI (CN)
Application Number:
PCT/CN2022/128509
Publication Date:
May 10, 2024
Filing Date:
October 31, 2022
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
B29C63/02; B29C63/00; B29C65/00; B29C65/78
Foreign References:
CN114801150A2022-07-29
CN114454489A2022-05-10
CN217553401U2022-10-11
JP2005035130A2005-02-10
US20110146893A12011-06-23
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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