Title:
BOARD THICKNESS ADJUSTING AND SHAPING INTEGRATED SYSTEM FOR GYPSUM BUILDING MATERIAL PRODUCTION LINE
Document Type and Number:
WIPO Patent Application WO/2022/227545
Kind Code:
A1
Abstract:
Disclosed in the present invention is a board thickness adjusting and shaping integrated system for a gypsum building material production line, comprising a forming belt used for driving gypsum slurry to move, and a forming table provided directly above the forming belt, wherein a thickness adjusting and balancing mechanism is provided on the sidewall of the forming table. The present invention can perform a convergence shaping action on the gypsum slurry by means of a shaping and guiding mechanism. During implementation, a thickness adjusting and force applying mechanism can control the descending height of the forming table to adjust the thickness of a formed board, and then by means of a lifting and lowering device, the forming table is driven to lower so as to perform a board forming action; moreover, the shaping and guiding mechanism is used for pushing, in the process that the forming belt drives the gypsum slurry to move to a position directly below the forming table, the gypsum slurry that is highly accumulated on the surface of the forming belt to move towards the center of the forming belt, so as to perform convergence on the remaining slurry; moreover, in the process of performing convergence on the remaining gypsum slurry, the shaping and guiding mechanism can further guide the converged gypsum slurry to flow into a low accumulation region on the surface of the forming belt, so as to perform a guiding and shaping action.
Inventors:
YANG XIAODONG (CN)
ZHANG YUFEI (CN)
YANG ZHENGBO (CN)
WU JIANJIANG (CN)
ZHANG YUFEI (CN)
YANG ZHENGBO (CN)
WU JIANJIANG (CN)
Application Number:
PCT/CN2021/133356
Publication Date:
November 03, 2022
Filing Date:
November 26, 2021
Export Citation:
Assignee:
CHINA NATIONAL BUILDING MATERIALS TECH INNOVATION & RESEARCH INSTITUTE LIMITED COMPANY (CN)
International Classes:
B28B19/00; B28B17/00
Domestic Patent References:
| WO2006111248A1 | 2006-10-26 |
Foreign References:
| CN113199618A | 2021-08-03 | |||
| CN211590595U | 2020-09-29 | |||
| CN111347547A | 2020-06-30 | |||
| CN212146907U | 2020-12-15 | |||
| US1769530A | 1930-07-01 |
Attorney, Agent or Firm:
BEIJING HESHINIP INTELLECTUAL PROPERTY OFFICE (CN)
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