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WO/2023/042835A1 |
An elastic wave filter (1) has an elastic wave resonance circuit (10) in a series arm and/or a parallel arm. The elastic wave resonance circuit (10) has a plurality of split resonators connected in series. A first split resonator (for ex...
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WO/2023/042834A1 |
[Problem] To provide a crystal device which makes it possible to reduce the cost for noble metal as a material cost without decreasing aging characteristics. [Solution] The present invention uses a carousel-type sputtering device 10 to...
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WO/2023/044404A1 |
The disclosure describes devices for monitoring physiological activity (e.g., a pulse). These devices can include: a detector configured to detect sound; an ultrasound system to detect fluid flow; an adhesive to attach a detector to skin...
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WO/2023/040661A1 |
A SAW resonant device, comprising: a piezoelectric substrate; an electrode layer which is arranged on the piezoelectric substrate and comprises an IDT, where the IDT comprises a first bus, multiple first electrode strips, a second bus an...
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WO/2023/035400A1 |
The present application relates to the technical field of acoustic wave resonators, and provides a Lamb wave resonator and a manufacturing method therefor. The Lamb wave resonator comprises a support substrate, a support structure, a pie...
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WO/2023/036028A1 |
Provided in the embodiments of the present invention are a bulk acoustic wave resonance device, a filter device, and a radio frequency front-end device. The bulk acoustic wave resonance device comprises: a first layer comprising a cavity...
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WO/2023/036618A1 |
An apparatus is disclosed for a surface-acoustic-wave filter (402) with a compensation layer (128) having multiple densities (130-1 to 130-N). In an example aspect, the apparatus includes at least one surface-acoustic-wave filter with a ...
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WO/2023/036025A1 |
Provided in the embodiments of the present invention are a bulk acoustic wave resonance device, a filtering device, and a radio-frequency front-end device. The bulk acoustic wave resonance device comprises: a first layer, the first layer...
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WO/2023/038042A1 |
Provided is an elastic wave device in which a piezoelectric layer can be more reliably formed into a convex shape and heat dissipation can be effectively improved. An elastic wave device 1 comprises: a support member (support substrate...
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WO/2023/037944A1 |
Provided is an elastic wave device that can improve isolation characteristics. An elastic wave device 10 comprises: a mounting substrate 2 which is a multilayer body including a first layer 2a provided with first signal wiring 3 and se...
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WO/2023/037916A1 |
Provided is an elastic wave device in which disconnection of wiring electrodes is unlikely to occur. The elastic wave device according to the present invention comprises: a piezoelectric substrate including a piezoelectric layer; a fun...
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WO/2023/037978A1 |
This high-frequency circuit (1) is capable of simultaneously transmitting an LTE signal and an NR signal. The high-frequency circuit (1) comprises filters (11, 21, and 31), power amplifiers (41 and 42), and a switch (51) connected betwee...
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WO/2023/036027A1 |
Embodiments of the present invention provide a bulk acoustic wave resonator device, a filter device, and a radio frequency front-end device. The bulk acoustic wave resonator device comprises: a first layer comprising a cavity; a first el...
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WO/2023/036026A1 |
Provided in the present embodiment are a bulk acoustic wave resonance device, a filter device and a radio frequency front-end device. The bulk acoustic wave resonance device comprises: a first layer comprising a cavity; a first electrode...
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WO/2023/036024A1 |
Embodiments of the present invention provide a surface acoustic wave resonance device, a filtering device, and a radio frequency front end device. The surface acoustic wave resonance device comprises: a support layer; a piezoelectric lay...
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WO/2023/035235A1 |
The present application relates to the field of resonators, and provides a resonator, a filter, and an electronic device, for use in improving the quality factor of the resonator. The resonator comprises a piezoelectric substrate, an int...
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WO/2023/037925A1 |
This elastic wave filter (1) comprises: a first filter circuit (10) provided to a first route (r1) linking a first terminal (T1) and a second terminal (T2); and an additional circuit (20) provided to a second route (r2) connected in para...
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WO/2023/032942A1 |
A high-frequency filter (1) comprises: a filter circuit part (10) provided to a first route (r1) between a first signal electrode (T10) and a second signal electrode (T20); and an addition circuit part (20) provided to a second route (r2...
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WO/2023/032342A1 |
The present invention comprises: a piezoelectric oscillation element that comprises a piezoelectric piece, a first excitation electrode that is disposed on a first surface of the piezoelectric piece, and a second excitation electrode tha...
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WO/2023/028906A1 |
Provided in the present application are a method for processing a substrate for a filter, and a substrate and a TC-SAW filter. The method for processing a substrate for a filter comprises: processing a support layer substrate having a co...
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WO/2023/030359A1 |
The present invention relates to a bulk acoustic resonator, comprising a substrate, a bottom electrode, a top electrode, an acoustic mirror, and a piezoelectric layer. The bottom electrode is a gap electrode comprising a gap layer, the g...
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WO/2023/028826A1 |
A layout design method for an electronic component, comprising: acquiring connection information of each BAWR in a BAWR circuit (201); generating a plurality of state parameter sets, and determining a plurality of candidate arrangements ...
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WO/2023/030848A1 |
Aspects of the disclosure relate to wireless communication filtering. One aspect is an apparatus including a first acoustic resonator that is part of a first bandpass filter having a first passband and coupled to a circuitry connection p...
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WO/2023/031521A1 |
A MEMS (microelectromechanical system) resonator (150) comprising a substrate (105), a resonator element (100), and a cavity (110). The resonator element (100) is separated from the substrate (105) by said cavity (110), and the resonator...
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WO/2023/033032A1 |
This elastic wave element comprises a piezoelectric layer composed of piezoelectric crystals, and an IDT electrode positioned on an upper surface of the piezoelectric layer and having a plurality of electrode fingers. A normalized thickn...
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WO/2023/033147A1 |
Provided is an elastic wave device in which torsional deformation is unlikely to occur in a piezoelectric layer. An elastic wave device 1 comprises: a support member 3; a piezoelectric layer 6 that is provided on the support member 3, ...
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WO/2023/033148A1 |
Provided is a filter element with which electric power resistance and IMD characteristics can be effectively improved. A filter element 1 comprises: a piezoelectric layer having a polarization axis direction; and a plurality (at least ...
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WO/2023/028993A1 |
The present application provides a crystal oscillator plate, a crystal oscillator, and an electronic device. The crystal oscillator plate is a symmetrical-shaped sheet. At least a first point and a second point are provided on the axis o...
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WO/2023/025989A1 |
According to an aspect, there is provided a structure for a thin-film bulk acoustic resonator. The structure comprises a substrate (101) comprising a cavity (104) having at least one slanted flat surface (103) facing away from the cavity...
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WO/2023/026990A1 |
Provided are a filter device and a composite filter device that have achieved improved isolation characteristics without degradation in pass characteristics. This filter device is provided with: an input terminal 3 and an output termin...
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WO/2023/028392A1 |
Surface acoustic wave, SAW, filter packages (103) employing an enhanced thermally conductive cavity frame (128) for heat dissipation, and related fabrication methods are disclosed. The SAW filter package also includes a cavity frame comp...
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WO/2023/026771A1 |
Provided are a glass composition and a sealing material that can be sealed at low temperature while having good weather resistance. The glass composition of the present invention is characterized by containing, in mol%, TeO2 15-80%, Mo...
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WO/2023/026888A1 |
The present invention provides a composite substrate which is suppressed in occurrence of a warp. A composite substrate according to one embodiment of the present invention comprises a supporting substrate and a piezoelectric film that i...
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WO/2023/026835A1 |
A crystal vibration element (1) comprises: a crystal piece (C) that has an oscillation frequency in a range of 50-100 MHz; and excitation electrodes (EU) that are respectively positioned on both surfaces of the crystal piece (C), and eac...
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WO/2023/020306A1 |
A surface acoustic wave amplifier capable of achieving a wavelet reconstruction function. The surface acoustic wave amplifier is characterized in that: the surface acoustic wave amplifier has the function of amplifying an input signal, a...
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WO/2023/022157A1 |
The present invention inhibits the flowing of current between extraction electrodes. This elastic wave device includes: a first substrate; a piezoelectric layer that overlaps the first substrate in a plan view and has a first main surfac...
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WO/2023/020792A1 |
Certain aspects of the present disclosure can be implemented in an electroacoustic device. The electroacoustic device generally includes a substrate and one or more resonator structures disposed above the substrate. In some cases, each r...
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WO/2023/021949A1 |
An elastic wave filter device is provided that achieves both improvement in filter characteristics, such as the amount of out-of-band attenuation, and reduction of insertion loss. A bandpass filter 1 is constructed on a piezoelectric s...
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WO/2023/023240A1 |
A bulk acoustic wave, BAW,resonator includes a piezoelectric layer oriented so that an N-polar surface forms a frontside surface that faces away from the substrate while a metal-polar surface forms the backside surface and faces toward t...
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WO/2023/017825A1 |
Provides are an elastic wave device capable of confining elastic wave energy to a piezoelectric layer side and in which conductance does not readily deteriorate, and a method for manufacturing the elastic wave device. An elastic wave d...
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WO/2023/017780A1 |
Provided is an elastic wave device that is not prone to deterioration of device characteristics. The elastic wave device 1 has: a silicon nitride membrane 7 provided upon a piezoelectric layer 6; and an IDT electrode 8 provided upon th...
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WO/2023/017743A1 |
Provided are a piezoelectric vibration device and a method for manufacturing a piezoelectric vibration device that enable filling of the interior of a holding member with nitrogen gas or the like, without increasing tact time. The method...
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WO/2023/016500A1 |
The present invention relates to a bulk acoustic resonator and a manufacturing method therefor. The resonator comprises a substrate, a bottom electrode, an acoustic mirror, a top electrode, and a piezoelectric layer. The bottom electrode...
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WO/2023/017659A1 |
The present invention suppresses degradation in high-frequency characteristics. In a first balun (7) of a high-frequency circuit (100), a first end (711) of a first coil (71) is connected to an amplifier (3), and a second end (712) of th...
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WO/2023/013741A1 |
The present invention suppresses leakage of elastic waves. This elastic wave device comprises: a support member equipped with a support substrate which is thick in a first direction; and an IDT electrode that has a piezoelectric layer pr...
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WO/2023/011716A1 |
The present disclosure relates to surface acoustic wave (SAW) devices. The disclosure presents a SAW device with a multi-layer stack that includes YAG as a novel acoustic material. The SAW device comprises, in particular, a YAG layer, an...
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WO/2023/013169A1 |
According to the present invention, stress generated in a resonator as a result of an impact is alleviated. This resonating device comprises a resonator 10 including a base portion 130, a plurality of vibrating arms 121A to 121D respec...
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WO/2023/014670A1 |
A process for fabricating a transversely-excited film bulk acoustic resonator (XBAR) and that XBAR are described. A sacrificial pillar is formed on a surface of a piezoelectric wafer and a highly conforming dielectric layer is deposited ...
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WO/2023/013694A1 |
The present invention addresses the problem of suppressing variation in chip size. This elastic wave apparatus comprises: a first substrate; a piezoelectric layer that overlaps the first substrate as seen in a first direction and has a f...
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WO/2023/013742A1 |
The present invention suppresses an elastic wave leak. This elastic wave device comprises: a support member comprising a support substrate having a thickness in a first direction; a piezoelectric layer provided in the first direction of ...
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