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WO/2016/114358A1 |
Provided are a substrate with which parasitic capacitance can be reduced, despite advanced miniaturization, and a method for manufacturing the same. The substrate 2 comprises a substrate body 2A having a first main surface 2a and a secon...
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WO/2016/111038A1 |
The present invention increases the adhesive force that exists between a substrate and an adhesive layer and that hermetically seals a piezoelectric oscillator on the substrate. A piezoelectric oscillation member (40) that is provided wi...
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WO/2016/111045A1 |
The present invention addresses the problem of increasing the adhesive force between an adhesive layer and a lid that hermetically seals a piezoelectric vibrator to a substrate. A piezoelectric vibration component (40) is provided with: ...
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WO/2016/111044A1 |
The present invention addresses the problem of increasing the adhesive force between an adhesive layer and a substrate that hermetically seals a piezoelectric vibrator to the substrate. A piezoelectric vibration component (40) is provide...
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WO/2016/111047A1 |
The present invention increases the adhesive force that exists between a lid and an insulating adhesive layer and that is for hermetically sealing a piezoelectric oscillator on a substrate. A piezoelectric oscillation member (40) that is...
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WO/2016/108771A1 |
The invention relates to resonant MEMS temperature sensors that sense the temperature changes by monitoring the frequency shifts of more than one DETF resonators (1, 2) resulting from the changing temperature.
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WO/2016/104576A1 |
This cover material for hermetic sealing (10) is configured from a cladding material (20) which comprises a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) that is bonded onto the silver brazing layer and is c...
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WO/2016/103925A1 |
Provided is an elastic wave device wherein the weather resistance of an IDT electrode can be improved. An elastic wave device 1 which utilizes plate waves. A supporting substrate 2 is provided with a recess 2b in an upper surface 2a. A p...
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WO/2016/104004A1 |
Provided is a resonator manufacturing method whereby it is possible to effectively address resistivity variations in individual wafers. The resonator manufacturing method includes a step of forming a silicon oxide film on the surface of ...
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WO/2016/100626A1 |
A micro-electrical-mechanical system (MEMS) guided wave device includes a piezoelectric layer including multiple thinned regions of different thicknesses each bounding in part a different recess, different groups of electrodes on or adja...
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WO/2016/098526A1 |
The present invention provides an acoustic wave device that can achieve miniaturization by devising the position of a through-hole for etching. In an acoustic wave device 1, a piezoelectric substrate 4 is stacked on a support substrate 2...
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WO/2016/093020A1 |
A method for producing a piezoelectric resonator that is provided with a piezoelectric thin film (20) on which function conductors (211, 212) are formed, a fixed layer (30) which is formed on a main surface of the piezoelectric thin film...
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WO/2016/093021A1 |
This method for manufacturing a hermetic-sealing lid member (1, 201, 301) is provided with: a step of forming a Ni-plated metal plate (70, 170) by forming a Ni-plated layer (11, 12, 41) on a surface of a metal plate (40) having corrosion...
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WO/2016/088830A1 |
Provided are an elastic wave device manufacturing method and an elastic wave device that can suppress contact with another part of a heat-radiating film or another component. Provided is an elastic wave device 1 in which: an IDT electrod...
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WO/2016/088681A1 |
Provided are an electronic component having high heat dissipation and a method for manufacturing same. An electronic component 1 provided with: an electronic component element 2 having first and second main surfaces 2a, 2b; a heat-dissip...
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WO/2016/084936A1 |
This SAW device comprises: an SAW element; a conductor part that is connected to the SAW element; an LT substrate that comprises the SAW element; and a case that contains the LT substrate comprising the SAW element. The case has a cover ...
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WO/2016/080506A1 |
Provided is a method for bonding wafers, which is capable of bonding wafers with high reliability, while suppressing influence on the wafers. This method for bonding wafers comprises: a step for preparing a first wafer having a surface o...
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WO/2016/066305A1 |
Apparatus for determining and/or monitoring at least one process variable of a medium (2) in a container (3) with at least one vibratable unit (4), comprising at least one diaphragm (7) and at least one vibrating element (8), with a driv...
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WO/2016/067924A1 |
A method for manufacturing a piezoelectric device (10) in which a piezoelectric thin film (20) on which functional conductors (211, 212) are formed is secured to a support substrate (40) using a securing layer (30), wherein an alignment ...
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WO/2016/067664A1 |
Provided is an electronic device capable of suppressing a positional shift between a cap and a substrate, and a method for producing the same. This electronic device is equipped with: a substrate including a substrate body having a princ...
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WO/2016/063738A1 |
The purpose of the present invention is to provide an elastic wave device which uses an interlayer insulating film made from an inorganic dielectric material, and with which cracks and disconnection are unlikely to occur in wirings on th...
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WO/2016/061860A1 |
The invention provides a piezoelectric quartz-crystal resonator and a manufacturing method thereof. The piezoelectric quartz-crystal resonator comprises a circuit board, a quartz-crystal resonator and a thermistor; the thermistor is used...
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WO/2016/060072A1 |
This piezoelectric device (10) is provided with a piezoelectric substrate (110), a piezoelectric substrate (120) and a bonding layer (20). A conductive pattern (111) is formed on a front surface (110SM) of the piezoelectric substrate (11...
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WO/2016/050375A1 |
The invention relates to a method for the batch production of acoustic wave filters, including the following main steps: synthesising N theoretical filters, each filter being defined on the basis of a group of j theoretical resonator(s) ...
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WO/2016/052129A1 |
Provided is an acoustic wave device, which is capable of reducing capacitance between wiring lines, and not susceptible to characteristic deterioration due to parasitic capacitance or the like. Disclosed is an acoustic wave device 1 wher...
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WO/2016/042928A1 |
[Problem] To acquire a low-cost piezoelectric device with a simple configuration that allows mounting terminals to be formed at a desired position. [Solution] A piezoelectric device includes: lead-out wires (3) provided on the outer peri...
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WO/2016/039038A1 |
[Problem] To suppress generation of failure products by ensuring the strength of a ceiling material by maintaining the thickness of the ceiling material, and by reliably bonding a piezoelectric device and a mounting substrate to each oth...
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WO/2016/021304A1 |
A sacrificial layer (600) is formed on the back surface of a piezoelectric substrate (200) (S101). A supporting layer (300) is formed on the back surface of the piezoelectric substrate (200) so as to cover the sacrificial layer (600) (S1...
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WO/2016/014416A1 |
Embodiments described herein provide a temperature-compensated surface acoustic wave (TCSAW) device, a method of fabricating a TCSAW device, and a RF transceiver incorporating a TCSAW device. The TCSAW device includes a piezoelectric sub...
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WO/2015/199132A1 |
An elastic wave device achieving a further decrease in size is provided. An elastic wave device (1) is provided with: a piezoelectric substrate (2); a functional electrode (3) disposed on the piezoelectric substrate (2); a support layer ...
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WO/2015/193539A1 |
The present invention relates in general to electronic oscillation generators and to the stabilization of electronic oscillation generators, and especially to temperature- compensated oscillator units used in electronics and telecommunic...
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WO/2015/190429A1 |
This piezoelectric device is provided, on a substrate (11), with a support layer (14), a lower electrode (15), a piezoelectric film (16) and an upper electrode (17) in this order. The substrate (11) is provided with a first opening (23) ...
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WO/2015/178227A1 |
Provided is an elastic wave device that can be reduced in size and is excellent in terms of the joining strength between an elastic wave element and a bump electrode. An elastic wave device (1) includes: a piezoelectric substrate (2); an...
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WO/2015/178333A1 |
[Problem] To provide a surface-mounted crystal resonator, a manufacturing method therefor, and an oscillator which enable improved productivity by facilitating manufacturing, better quality, and smaller influence of noise from outside by...
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WO/2015/170528A1 |
Provided is a surface acoustic wave device comprising a piezoelectric substrate (1), an IDT electrode (2) having an interdigital electrode finger (3) formed on the piezoelectric substrate (1), and a wiring electrode (5) connected to the ...
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WO/2015/159465A1 |
Provided is an electronic component wherein: micro-cracks and cracks are not easily generated in a substrate at the time of dicing in a manufacture step; cracks are not susceptible to extending into a region surrounded by means of a supp...
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WO/2015/161257A1 |
A monolithic integration of phase change material (PCM) switches with a MEMS resonator is provided to implement switching and reconfiguration functionalities. MEMS resonator includes a piezoelectric material to control terminal connectio...
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WO/2015/133422A1 |
An aluminum nitride piezoelectric thin film having nitrogen polarity (N polarity) is obtained with exceptional productivity. Provided are an aluminum nitride piezoelectric thin film (3) containing germanium, and a method for manufacturin...
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WO/2015/125145A1 |
A low frequency micro oscillator-driven oscillating system including at least one electric oscillation generator operative to produce oscillations at a first frequency, at least one oscillated article, at least one intermediate element, ...
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WO/2015/106805A1 |
The present invention concerns an electroacoustic filter (1), comprising an electrode (2)having a main layer (6)which consists of a metallic material comprising an alloy of copper and molybdenum. According to a second aspect, the present...
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WO/2015/098679A1 |
Provided is an elastic wave device which is not susceptible to the occurrence of cracks or separation of a piezoelectric thin film. An elastic wave device (1) wherein: a multilayer film (3), which is obtained by laminating a plurality of...
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WO/2015/098372A1 |
Provided is a frequency adjustment method wherein a residue does not tend to occur, frequency can be adjusted with high accuracy, and a strength decrease is small. This frequency adjustment method for a piezoelectric vibrator (1) is prov...
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WO/2015/098694A1 |
Provided is an elastic wave device with which electrostatic breakdown does not readily occur. In this elastic wave device (1), a dielectric film (3) is formed upon a piezoelectric substrate (2), an IDT electrode (4A) provided with a firs...
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WO/2015/079870A1 |
This hollow-space-sealing resin sheet contains an inorganic filler in an amount greater than or equal to 68% by volume, and the particle-size distribution of said inorganic filler is such that the percentage of particles constituting sai...
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WO/2015/080023A1 |
This invention provides a piezoelectric thin film that comprises an aluminum nitride that has an increased piezoelectric coefficient and contains an inexpensive non-scandium element. In said piezoelectric thin film, which comprises an al...
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WO/2015/079887A1 |
This invention provides a sealing thermosetting-resin sheet and a hollow-package manufacturing method whereby it is difficult for the material constituting said sealing thermosetting-resin sheet to flow into gaps between an adherend and ...
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WO/2015/079871A1 |
This hollow-space-sealing resin sheet contains an inorganic filler in an amount greater than or equal to 62% by volume, and the particle-size distribution of said inorganic filler is such that the percentage of particles constituting sai...
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WO/2015/072056A1 |
This piezoelectric wafer has: a piezoelectric vibration piece; a frame section that supports the piezoelectric vibration piece; and a connecting section that connects the frame section and the piezoelectric vibration piece to each other....
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WO/2015/072057A1 |
This piezoelectric wafer has: a piezoelectric vibration piece; a frame section that supports the piezoelectric vibration piece; and a connecting section that connects the piezoelectric vibration piece to the frame section. A pair of firs...
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WO/2015/060032A1 |
[Problem] To provide a highly reliable piezoelectric vibration element for which a reduction in the electrode dimensions can be minimized when the frequency is adjusted, and which has excellent weather resistance and heat resistance; and...
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