| Document |
Document Title |
|
WO/2023/074633A1 |
A heat dissipation member according to the present invention comprises: a copper-diamond composite body in which a plurality of diamond particles are dispersed in a metal matrix that contains copper; and a metal film which is bonded to a...
|
|
WO/2023/067224A1 |
The present invention discloses a monocrystalline shape memory alloy consisting of: 11.5 % - 14.0 % Al by weight; 2.5 % - 5.5 % Ni by weight; 0.02 % - 0.58 % Be by weight, the balance being Cu and unavoidable impurities. The alloy of the...
|
|
WO/2023/065942A1 |
Disclosed in the present invention are a copper alloy material for a 5G base station power connector, and a preparation method therefor. The copper alloy material is composed of the following components: 0.80-1.30 wt% of Cr, 0.10-0.25 wt...
|
|
WO/2023/065940A1 |
Disclosed are a Cu-Sn-P copper alloy material having a high tin content and a preparation method therefor. The copper alloy material is composed of Cu as well as 10.50-12.50wt% of Sn, 0.30-0.50wt% of P, 0.10-0.35wt% of Sc, 0.05-0.20wt% o...
|
|
WO/2023/063394A1 |
This antimicrobial substance comprises a base material and a copper-tin alloy layer that is disposed on the base material and that contains 60−90 at% of copper and 10−40 at% of tin with respect to a total of 100 at% of copper and tin...
|
|
WO/2023/063018A1 |
Provided is copper alloy powder which is appropriate for a process involving rapid melting and rapid solidification, such as for a laminate molding, and makes it possible to produce a molded article having high density and high conductiv...
|
|
WO/2023/061514A1 |
A Cu-15Ni-8Sn-based alloy for ocean engineering, and a preparation method therefor. The Cu-15Ni-8Sn-based alloy for ocean engineering comprises the following components in percentages by weight: 14-16% of Ni, 7-9% of Sn, 0.3-2.0% of Zn, ...
|
|
WO/2023/063346A1 |
This copper alloy has a composition containing 0.10 mass% to 2.6 mass% of Mg, with the balance being Cu and unavoidable impurities, and has at least five edge curves, wherein the edge curve has: an average value of a strain period of 0.0...
|
|
WO/2023/047514A1 |
Provided is an insulated wire which is less likely to experience breakage and is also able to withstand stress that is applied momentarily. Disclosed is an insulated wire 1 having a conductor 2 obtained by twisting a plurality of strands...
|
|
WO/2023/047044A1 |
The invention relates to a method for the additive manufacture of a copper object, the method being a method for additive manufacture by powder bed deposition and selective fusion, said object being manufactured by the selective fusion o...
|
|
WO/2023/048082A1 |
Provided are a filter and a filter assembly that have excellent producibility at low cost, high mechanical strength, as well as both waterproofness and air permeability. A filter 2 comprises a porous sintered body 3 formed by sintering a...
|
|
WO/2023/041537A1 |
The copper alloy composition is a Cucomp(Al2O3)aZrbCrc mass composition in which, in mass percent: 1.5% ≤ a ≤ 5%, 0.01% ≤ b ≤ 5%, 0% ≤ c ≤ 5%, the complement consisting of copper and unavoidable impurities.
|
|
WO/2023/037747A1 |
The present invention provides an electronic component comprising a component body and an external electrode provided on a surface of the component body, characterized in that the external electrode comprises an Ni/Cu/Sn stacked structure.
|
|
WO/2023/038591A1 |
The invention relates to a flux composition developed for increasing the casting quality of the copper-based alloys, comprising potassium aluminum fluoride (KAIF4), calcium fluoride (CaF2), sodium fluoride (NaF), borax pentahydrate (Na2B...
|
|
WO/2023/032389A1 |
A copper alloy wire which is a wire rod formed from a copper alloy, has a wire diameter of 2.5 mm to less than 9.5 mm, and has a drawing value of 70% or higher, said copper alloy having a composition comprising 0.05 mass% to 1.6 mass% of...
|
|
WO/2023/033038A1 |
A terminal material that has a plating film and that can be used as a terminal for electrical connection or as a contact element for a connector, the terminal material comprising: a base material made of copper or a copper alloy; and a p...
|
|
WO/2023/032919A1 |
Provided is a graphite-copper composite material which comprises a copper layer and flaked graphite particles that are laminated with the copper layer interposed therebetween and which has a copper volume fraction of 3-30%, said graphite...
|
|
WO/2023/032390A1 |
A wire rod which is formed of a copper alloy and has a tensile strength of 400 MPa or more, an elongation at break of 5% or more, a conductivity of 60% IACS or more and a wire diameter of 0.5 mm or less, wherein: the copper alloy has a c...
|
|
WO/2023/021418A1 |
The copper-titanium alloy according to the invention comprises, by weight, at least 90% copper, from 5 to 7% titanium and from 0.25 to 0.5% iron. It has excellent ductility at the solution-annealed temper and high yield strength after an...
|
|
WO/2023/015784A1 |
Disclosed is a braze paste for fluxless brazing of stainless steel. The braze paste is mainly composed of water, sodium silicate, nanosilicon dioxide and a copper-based braze material. The braze paste is prepared from the following raw m...
|
|
WO/2023/013579A1 |
A copper-diamond composite (30) of the present invention comprises a plurality of diamond particles (20) dispersed in a metal matrix (10) containing copper, wherein, when the grain size distribution of the diamond particles (20) is measu...
|
|
WO/2023/013501A1 |
This heat dissipation member includes a copper-diamond composite in which a plurality of diamond particles are dispersed in a copper-containing metal matrix, and a metal film bonded to at least one face of the copper-diamond composite, w...
|
|
WO/2023/013500A1 |
This heat dissipation member comprises: a copper-diamond composite in which a plurality of diamond particles are dispersed in a metal matrix containing copper; and a metallic film that is joined to at least one surface of the copper-diam...
|
|
WO/2023/013502A1 |
A heat-dissipating member according to the present invention which includes a copper-diamond composite in which a plurality of diamond particles are dispersed in a metal matrix containing copper, and also includes a metal film joined to ...
|
|
WO/2023/013580A1 |
This copper-diamond composite has diamond particles dispersed in a copper-containing metal matrix, said copper-diamond composite being constituted such that when a 50% area average diameter of copper single-crystal particles in the metal...
|
|
WO/2023/003481A1 |
The object of the invention is a copper-chromium alloy containing 99.1-99.49 wt.% of copper, 0.3-0.7 wt.% of chromium, 0.05-0.1 wt.% of zirconium and 0.01-0.15 wt.% of scandium, the use of this alloy for making cap electrodes. Also the o...
|
|
WO/2023/002720A1 |
[Problem] To provide a heating coil for high-frequency heater, the heating coil having good cooling efficiency, being able to be used continuously over long periods without being damaged even under high output conditions, and achieving m...
|
|
WO/2023/000510A1 |
Disclosed in the present invention are a silicide-reinforced copper-titanium alloy matrix composite material and a preparation method therefor. The composite material comprises a copper-titanium alloy matrix and silicide particles disper...
|
|
WO/2023/281862A1 |
This composite material comprises: a first member which contains tungsten and comprises tungsten as a first component; a second member which contains copper, comprises copper as a first component, and is joined to the first member; and a...
|
|
WO/2023/282351A1 |
Provided is a conductive paste that exhibits an excellent conductivity and an excellent long-term reliability. This conductive paste comprises, per 100 parts by mass of a binder component containing an acrylate compound and an epoxy co...
|
|
WO/2023/276906A1 |
Provided is a copper alloy material which has excellent press punching workability and sufficiently high volume resistivity, and for which the temperature coefficient of resistance (TCR) is negative and has a small absolute value, and a ...
|
|
WO/2023/277198A1 |
A copper strip for edgewise bending, which involves performing edgewise bending at a ratio R/W for a bending radius R and width W of 5.0 or less, is characterized in that the thickness t is set to be within a range of 1 mm to 10 mm, incl...
|
|
WO/2023/277196A1 |
A copper strip for edgewise bending, which involves performing edgewise bending at a ratio R/W for a bending radius R and width W of 5.0 or less, is characterized in that the thickness t is set within a range of 1 mm to 10 mm, inclusive,...
|
|
WO/2023/276466A1 |
Provided is a metal-ceramic bonded substrate in which a metal plate is bonded to a ceramic substrate through a brazing material. The metal plate and the ceramic substrate are bonded through a brazing material comprising: at least one typ...
|
|
WO/2023/276780A1 |
Provided is a copper plate material containing 0.0005-0.1 mass% (inclusive) of Ni, 0.0005-0.1 mass% (inclusive) of Sn, 100 ppm or less of C, 800 ppm or less of O, 10 ppm or less of H, and 50 ppm or less of Ag, with the rest made up by Cu...
|
|
WO/2023/276904A1 |
Provided is a copper alloy material which, as, for example, a resistive material, has sufficiently high volume resistivity, and for which the absolute value of the thermoelectromotive force against copper is small and the resistance temp...
|
|
WO/2023/276905A1 |
The present invention provides: a copper alloy material which has a sufficiently high volume resistivity, for example, as a resistive material, while having a small absolute value for the thermal electromotive force against copper and a ...
|
|
WO/2023/275215A1 |
The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a n...
|
|
WO/2023/277199A1 |
A copper strip for edgewise bending, which involves performing edgewise bending at a ratio R/W for a bending radius R and width W of 5.0 or less, for which the thickness t is set within a range of 1 mm to 10 mm, inclusive, and in a cross...
|
|
WO/2023/277197A1 |
A copper strip for edgewise bending, which involves performing edgewise bending at a ratio R/W for a bending radius R and width W of 5.0 or less, is characterized in that the thickness t is set within a range of 1 mm to 10 mm, inclusive,...
|
|
WO/2022/270440A1 |
The present invention provides a novel Cu bonding wire which enables the achievement of good bonding reliability at a 1st bonding part in a high-temperature high-humidity environment. This bonding wire for semiconductor devices is charac...
|
|
WO/2022/270075A1 |
Provided is a novel Cu bonding wire that achieves a good FAB shape, that also achieves good bonding properties in a second bonding part, and that additionally achieves good bonding reliability in a first bonding part in a high-temperatur...
|
|
WO/2022/270050A1 |
The present invention provides a novel Cu bonding wire which enables the achievement of a good FAB shape, while enabling the achievement of good bonding reliability at a 2nd bonding part even in a harsh high-temperature environment. This...
|
|
WO/2022/270077A1 |
Provided is a novel Cu bonding wire that produces a good FAB shape, and that suppresses galvanic corrosion in a high-temperature environment and produces good bonding reliability in a 2nd junction. This bonding wire for a semiconductor d...
|
|
WO/2022/270312A1 |
Provided is a novel Cu bonding wire that suppresses galvanic corrosion in high-temperature environments and provides good bond reliability in a second bonding section, even when an encapsulating resin material with a high sulfur content ...
|
|
WO/2022/270438A1 |
The present invention provides a novel Cu bonding wire which enables the achievement of good bonding reliability at a 1st bonding part even in a high-temperature high-humidity environment, while enabling the achievement of good bonding r...
|
|
WO/2022/270049A1 |
The present invention provides a novel Cu bonding wire that exhibits a satisfactory FAB shape and exhibits satisfactory bonding reliability with a second bonding section even in severe high-temperature conditions. This bonding wire for a...
|
|
WO/2022/267080A1 |
An alloy having a capillary structure. The surface of the alloy has a capillary channel network, and the capillary channel network is a capillary structure consisting of a plurality of interconnected grain boundary channels. Also provide...
|
|
WO/2022/268676A1 |
Disclosed is a high strength, hot-formable special brass alloy having a microstructure comprising a β-phase with a volume percentage of 50 - 80% and a γ-phase with a volume percentage of 10 - 40%, which has 50 - 60 at.% of Cu, 25 - 36 ...
|
|
WO/2022/270313A1 |
Provided is a novel Cu bonding wire that, even if a sealing resin material having a high sulfur content is used, suppresses galvanic corrosion in high temperature environments and provides good bonding reliability of secondary bonded sec...
|
