COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

Title:

COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/013580

Kind Code:

A1

Abstract:

This copper-diamond composite has diamond particles dispersed in a copper-containing metal matrix, said copper-diamond composite being constituted such that when a 50% area average diameter of copper single-crystal particles in the metal matrix as obtained using an electron backscatter diffraction method is defined as A50, A50 is 1 µm to 10 µm.

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Inventors:

JUNG HYOJIN (JP)
SAKAI NORIYOSHI (JP)
NAGASAWA MOTOI (JP)

Application Number:

PCT/JP2022/029490

Publication Date:

February 09, 2023

Filing Date:

August 01, 2022

Export Citation:

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Assignee:

DENKA COMPANY LTD (JP)

International Classes:

C22C26/00; B22F3/24; C22C1/05; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/06; H01L23/373; H05K7/20

Domestic Patent References:

WO2021153506A1

2021-08-05

Foreign References:

JP2005184021A	2005-07-07
CN108588529A	2018-09-28

Attorney, Agent or Firm:

HAYAMI Shinji (JP)

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