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WO/2016/158829A1 |
Provided is a resin composition having long-term heat resistance, with which the rate of change in adhesive strength is low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the ...
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WO/2016/157594A1 |
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...
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WO/2016/152385A1 |
This anisotropically conductive film connects a terminal of a first electronic component and a terminal of a second electronic component in an anisotropically conductive manner, and is characterized by containing at least conductive part...
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WO/2016/152943A1 |
The present invention provides conductive particles, an anisotropic conductive adhesive, and a connection structure which are capable of achieving low connection resistance, and high connection reliability, even when used on wiring of al...
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WO/2016/152543A1 |
[Problem] To provide: a novel and improved anisotropic conductive connection structure which is able to be produced by a simple process and has high reliability; an anisotropic conductive connection method; and an anisotropic conductive ...
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WO/2016/152791A1 |
Provided is an anisotropic conductive film (1A) in which a sufficient amount of conductive particles (2) can be trapped even if connection terminals are at a fine pitch, and short-circuiting can be mitigated. The anisotropic conductive f...
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WO/2016/153292A1 |
The present application relates to an adhesive composition and an organic electronic apparatus comprising same. The adhesive composition has a structure in which moisture or oxygen can be effectively blocked from flowing into an organic ...
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WO/2016/148004A1 |
According to the present invention, a light emitting device is manufactured by bonding an LED element 52 on a wiring substrate 51 with an anisotropic conductive adhesive 50 being interposed therebetween. During the production of this dev...
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WO/2016/142422A1 |
The invention relates to a non-adhesive film-forming polymer composition (covering material) and to adhesive hot-melt glues in the form of pellets, which are covered with said polymer composition and can be produced by coextruding the ho...
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WO/2016/139221A1 |
The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive composition...
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WO/2016/140452A2 |
The present invention provides a vacuum thermoforming adhesive composition containing a polyurethane polymer and an acrylic polymer and having a difference in melting temperature and cross-linking temperature of 30-60°C. In addition, pr...
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WO/2016/140204A1 |
[Problem] Conventional conductive adhesives had difficulty with balancing storage stability and low-temperature curability, and with manifesting adhesive strength and conductivity when used on poorly-adhesive metal adherends such as gold...
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WO/2016/140196A1 |
The conduction paste comprises an adhesive and conductive particles that enable conduction between electrodes, wherein the coefficient of variation for the conductive particle diameter dimension is 25% or less. The average particle diame...
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WO/2016/136436A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive film through which air bubbles trapped at the bonding interface upon application of the pressure-sensitive adhesive film are apt to disappear at ordinary te...
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WO/2016/125644A1 |
A thermoconductive electroconductive adhesive composition including an electroconductive filler (A), an epoxy resin (B), a curing agent (C), and an organic solvent (D), the electroconductive filler (A) being a submicron silver fine powde...
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WO/2016/127056A1 |
Various labels for use in adverse environments are described. The labels are particularly well suited for applications in which a permanent label bond is required. The labels utilize a two stage adhesive which is initially in the form of...
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WO/2016/125737A1 |
The present invention provides a thermally conductive paste with improved conductivity that uses silver particles and has high conductivity while meeting a requirement for low-temperature firing at not more than 300°C and a manufacturin...
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WO/2016/122145A1 |
The present invention relates to: an antistatic adhesive composition containing an acrylate resin, a reactive acrylate monomer comprising an alkylene oxide unit, and an ionic antistatic agent; and an antistatic adhesive tape using the same.
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WO/2016/121806A1 |
This paste adhesive composition includes metal particles (A) and a compound (B) polymerized by heating, and when the metal particles (A) are caused to undergo sintering and form a particle connection structure by heat treatment, and the ...
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WO/2016/121296A1 |
Provided is a bonding composition with which it is possible to suppress fillet formation while maintaining sufficient spread to the bonding interface together with obtaining high bonding strength by bonding at a relatively low temperatur...
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WO/2016/117613A1 |
To connect an electronic component at low temperatures by using a photocurable adhesive and to prevent alignment deviation of the electronic component. A method for producing a connected body, which comprises: an adhesive arrangement ste...
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WO/2016/117350A1 |
Provided is an anisotropic conductive film with superior insulation between neighboring terminals and superior conductivity for long periods between connected terminals, even when connected to substrates that have been anti-corrosion tre...
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WO/2016/113026A1 |
Use of an electrically conductive composition as an electrically conductive adhesive for mechanically and electrically connecting at least one contact of a solar cell with an electrical conductor, wherein said at least one contact is sel...
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WO/2016/108460A1 |
The present invention relates to an adhesive composition for a polarizing plate and, more specifically, to an adhesive composition for a polarizing plate, wherein the change rate of relaxation modulus of an adhesive layer before and afte...
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WO/2016/109261A1 |
A halogen-free flame retardant adhesive comprises an acrylic copolymer preparable by polymerization of monomers comprising a first monomer which comprises a low glass transition temperature (Tg) monomer, a second monomer which comprises ...
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WO/2016/109245A1 |
The present invention provides a compressible micron-sized polymer particle and use thereof, a curable composition and preparation method thereof, a pressure-sensitive adhesive, and an adhesive tape. The compressible micron-sized polymer...
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WO/2016/109262A1 |
A halogen-free flame retardant adhesive comprises an acrylic copolymer preparable by polymerization of monomers comprising a first monomer which comprises a low glass transition temperature (Tg) monomer, a second monomer which comprises ...
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WO/2016/104275A1 |
Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode and that makes it possible to improve the reliability of conduction between electrodes. This electrically condu...
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WO/2016/104978A1 |
Provided are an adhesive composition for optical use comprising 10-60 weight % of a monofunctional (meta)acrylate-based oligomer, an image display device, and a method for producing an image display device.
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WO/2016/104276A1 |
Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode, that makes it possible to prevent positional displacement between electrodes, and that makes it possible to in...
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WO/2016/104188A1 |
A sheet for thermal bonding which has a tensile modulus of 10-3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt% and which, when heated from 23ºC to 400ºC in the air at a heating rate of 10 ºC/min and t...
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WO/2016/095436A1 |
The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction d...
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WO/2016/092742A1 |
The present invention pertains to an adhesive containing: (A) a curable resin composition containing one or more types selected from a silicone resin, a modified silicone resin, an epoxy resin, and a modified epoxy resin; and (B) conduct...
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WO/2016/092725A1 |
The present invention pertains to a transparent resin composition containing: (A) a silicone composition containing (A-1) 100 parts by mass of an organopolysiloxane having at least one structure represented by general formula (1) per mol...
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WO/2016/093261A1 |
Provided is a connector inspection method allowing a conductive particle to be inspected readily and rapidly after connector production; also provided are a connector, a conductive particle and an anisotropic conductive adhesive. In the ...
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WO/2016/087516A1 |
The invention provides an electrically conductive adhesive tape including a body having a lower face, an upper face and a thickness. The body of the adhesive tape comprises an electrically insulating adhesive and a powder made up of cond...
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WO/2016/080677A1 |
An anisotropic conductive adhesive film is disclosed. The adhesive film is an anisotropic conductive adhesive film comprising a curable resin, a curing agent and conductive particles, and electrically disconnects circuit electrodes, whic...
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WO/2016/076096A1 |
Provided are: a heat-curable adhesive composition which does not undergo the bleeding out of a resin therefrom; and a heat-curable adhesive sheet. A heat-curable adhesive composition according to the present invention, which constitutes ...
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WO/2016/076356A1 |
Provided are a thermosetting adhesive composition that exhibits stable electrical conductivity even in high-temperature environments and high-temperature high-humidity environments; and a thermosetting adhesive sheet. A thermosetting adh...
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WO/2016/066434A1 |
The invention relates to a barrier adhesive mass for encapsulating an (opto)electronic assembly, containing: a glue base, which consists of at least one reactive resin having at least one group that can be activated, at least one polymer...
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WO/2016/065604A1 |
A rosin dispersion is a reaction product of, by dry weight based on total dry weight of the rosin dispersion, from 80 % to 98 % a rosin resin, and from 2% to 20 % a dispersant. The rosin resin is processed by at least one method of a) mo...
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WO/2016/068165A1 |
The present invention provides a conductive material with which excellent conduction reliability can be obtained for an oxide layer. This conductive material contains conductive particles that are provided with resin core particles (10),...
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WO/2016/061121A1 |
Weldable adhesive compositions that dampen noise or vibration are described. In addition, various tape products that include the adhesive compositions are described. Also described are various methods of damping noise or vibration by use...
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WO/2016/051829A1 |
Provided is an electroconductive pressure-sensitive adhesive sheet which comprises a pressure-sensitive adhesive layer that comprises a pressure-sensitive adhesive resin (A) and a carbon-based filler (B), wherein the pressure-sensitive a...
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WO/2016/043066A1 |
Provided are an anisotropic conductive adhesive with which interference with cationic polymerization reaction is inhibited and good connection is possible, and a method for producing a connection structure. The anisotropic conductive adh...
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WO/2016/031786A1 |
A conductive adhesive sheet which comprises at least an adhesive conductive layer (X) and a non-adhesive conductive layer (Y), and wherein: the adhesive conductive layer (X) is a layer that is formed from an adhesive composition containi...
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WO/2016/031552A1 |
The purpose of the present invention is to provide an electrically conductive adhesive composition which has excellent adhesive properties without containing harmful substances such as solder (lead). Specifically, this electrically condu...
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WO/2016/033522A1 |
A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond f...
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WO/2016/032268A1 |
The present invention relates to an adhesive having pigment material and metal oxide mixed therein, and a colorable heat ray blocking carbon-ceramic film using same, the adhesive being provided with a functional coating layer formed by m...
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WO/2016/032261A1 |
The present invention relates to an adhesive having pigment material and metal oxide mixed therein, and a colorable heat ray blocking carbon-ceramic film using same, the adhesive being provided with a functional coating layer formed by m...
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