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WO/2018/047690A1 |
Provided is a conductive material that allows solder on conductive particles to be disposed efficiently on an electrode even after the conductive material has been left standing for a set period of time, and is such that the yellowing of...
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WO/2018/047597A1 |
In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection re...
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WO/2018/042701A1 |
One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide...
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WO/2018/043505A1 |
One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide...
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WO/2018/043296A1 |
This (meth)acrylic resin composition is capable of achieving both storage stability in an atmosphere of 25°C and cold curing in an atmosphere of 60 to 140°C when a sealed container is used, and is also capable of exhibiting these chara...
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WO/2018/038475A1 |
The present invention relates to a pressure-sensitive adhesive tape, a method for manufacturing the same, and an electronic device comprising the same. The pressure-sensitive adhesive tape comprises: a fiber accumulation type substrate i...
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WO/2018/036163A1 |
A touch screen production method and an electrically conductive peelable tape. The production method of touch screen comprises: forming a touch electrode (10), and forming an electrically conductive peelable tape layer (20) on the touch ...
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WO/2018/034234A1 |
The die attach paste according to the present invention comprises: a (meth)acrylic copolymer (A) having a reactive group; a (meth)acrylic monomer (B); and a filler (C), the reactive group of the (meth)acrylic copolymer (A) being at least...
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WO/2018/030184A1 |
[Problem] The present invention provides: an epoxy resin composition which exhibits excellent storage stability, while having low initial viscosity and good curability at low temperatures; and a conductive adhesive which contains this ep...
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WO/2018/024073A1 |
The invention provides a heat-dissipating type conductive silver paste and a preparation method therefor. The heat-dissipating type conductive silver paste is prepared from 100 parts of a resin mixture, 100 to 500 parts of silver powder ...
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WO/2018/013342A1 |
Disclosed herein are electrically conductive adhesive compositions and their use in solar cell modules, wherein the electrically conductive adhesives comprise one or more olefinic carboxylic acids or derivatives thereof.
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WO/2018/008693A1 |
Provided are insulated particles with which an anisotropic conductive adhesive can be obtained, the anisotropic conductive adhesive achieving, if circuit substrates, each having a plurality of terminals, are to be electrically connected ...
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WO/2018/006503A1 |
Provided are a silver salt-doped conductive silver adhesive, and a preparation method and a use thereof. The silver salt-doped conductive silver adhesive is prepared and obtained from the following raw materials: 0.01-5 parts by weight o...
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WO/2018/009891A1 |
Blends comprising a conductive polymer and a matrix material are provided. The blends find utility in a number of applications, including use as a conformal coating on consumer electronic articles.
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WO/2018/003704A1 |
The present invention provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, can attain high electroconductivity (low connection resistance). The present invention further provide...
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WO/2017/206645A1 |
A conductive particle, manufacturing method thereof, conductive adhesive comprising the conductive particle, and manufacturing method thereof. The conductive particle comprises: a core microsphere (10); a conductive polymer layer (12) co...
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WO/2017/209427A1 |
The present invention relates to a flexible electromagnetic shielding sheet and an electronic device provided with same, the flexible electromagnetic shielding sheet comprising: a pressure-sensitive adhesive tape provided with an electro...
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WO/2017/209429A1 |
The present invention relates to a thin electromagnetic shielding sheet and an electronic device provided with same, the thin electromagnetic shielding sheet comprising: a pressure-sensitive adhesive tape comprising accumulated-fiber-typ...
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WO/2017/204218A1 |
Provided is an electroconductive adhesive composition which comprises: a thermosetting resin having a functional group capable of reacting with an epoxy group; an epoxy resin; an electroconductive filler; and urethane resin particles hav...
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WO/2017/204238A1 |
Provided is an electroconductive adhesive which is less apt to suffer cracking, chipping, etc. upon sintering and gives sintered objects having excellent mechanical strength. The electroconductive adhesive comprises metallic microparticl...
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WO/2017/195400A1 |
The present invention addresses the problem of providing an electrically conductive adhesive which has superior heat cycle properties and good reflow properties, and is less likely to come off a substrate. The problem is solved by an ele...
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WO/2017/192682A1 |
Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, at least one T, optionally D and optionally Q type monomers and is cross-linkable. The resin has a fluorine content of at l...
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WO/2017/188615A1 |
A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may inc...
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WO/2017/186192A1 |
A preparation method for a highly-conductive oxidation-resistant copper-silver composite powder. The method comprises the following steps: (1) using gas atomization to prepare a copper-silver alloy powder, the mass percentage of silver i...
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WO/2017/182621A1 |
The present invention is related to an electrically conductive, hot-melt adhesive or moulding composition, said composition comprising: a) a binding agent which comprises at least one (co)polymer selected from the group consisting of pol...
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WO/2017/178128A1 |
The present invention relates to a stick-type hot-melt adhesive body for use in hot-melt glue guns, the hot-melt adhesive body having at least one first section containing at least one reactive adhesive or consisting thereof and at least...
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WO/2017/169534A1 |
An electroconductive adhesive is provided with which sintered objects that are less apt to suffer cracks, chipping, or the like due to sintering and that have excellent mechanical strength are obtained. The electroconductive adhesive com...
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WO/2017/170371A1 |
Provided is an electroconductive adhesive tape whereby high levels of repulsion resistance and electrical characteristics can be obtained at the same time. The electroconductive adhesive tape 1 pertaining to the present invention is prov...
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WO/2017/163721A1 |
Provided is a method for manufacturing a connection structure in which the allowable range of a terminal interval in a member can be enlarged and which can be mounted at low temperature. The method comprises: an arranging step for arrang...
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WO/2017/164318A1 |
The present invention provides an anisotropic conductive adhesive which allows for flip chip mounting of a light emission element, such as an LED chip having fine-pitch wiring, and is capable of imparting high optical characteristics, hi...
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WO/2017/156674A1 |
The present disclosure is directed to a process for preparing foamed articles comprising at least one ethylene/α-olefin interpolymer and use of the foamed articles in various applications, such as footwear applications. The ethylene/α-...
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WO/2017/154226A1 |
Provided is an adhesive film having few fish eyes, exceptional mechanical strength and heat resistance, little dust adhesion, and excellent adhesive characteristics, the adhesive film being used in various types of surface protection fil...
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WO/2017/149426A1 |
A method of and system (200) for manufacturing an electronic device (300, 300'), a curable conductive adhesive for use in the same, and an electronic device (300, 300') are disclosed. The method includes printing a conductive adhesive on...
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WO/2017/138253A1 |
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...
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WO/2017/138252A1 |
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...
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WO/2017/138483A1 |
Provided are insulated coated conductive particles which enable the achievement of a good balance between excellent insulation reliability and conduction reliability even in a connection between micro circuits. Each insulated coated cond...
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WO/2017/133864A1 |
Electrical debonding of PU hot melt adhesives by use of conductive inks The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conducti...
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WO/2017/130892A1 |
Provided is a conductive material capable of providing high conduction reliability since the conductive material has high storage stability, and shows, after being arranged on a member to be connected, excellent solder cohesiveness perfo...
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WO/2017/130789A1 |
In one embodiment, the present invention provides an adhesive film 1 which comprises, superposed in the following order, a first non-electroconductive adhesive layer 2, an electroconductive adhesive layer 3 containing electroconductive p...
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WO/2017/130754A1 |
The anisotropic conductive film connects a terminal of a first circuit member and a terminal of a second circuit member in an anisotropically conductive manner, and comprises a film-forming resin, a radical polymerizable compound, an oxi...
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WO/2017/119103A1 |
The present invention provides a two-part urethane-based adhesive agent composition for automobiles, which has a high curing rate and excellent productivity, has such a property that a cured article formed from a first solution alone sho...
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WO/2017/119274A1 |
Provided is an adhesive composition having excellent life properties. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent and a hindered amine compound. This is consid...
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WO/2017/112386A1 |
A polymerizable pre-adhesive composition includes packaging material and a packaged pre-adhesive reactive mixture sealed within the packaging material. The packaging material includes: a semicrystalline polylactic acid (PLA); a polyvinyl...
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WO/2017/102071A1 |
The present invention relates to a process for producing a hot melt adhesive (HMA) material, preferably hot melt pressure sensitive adhesive (HMPSA) material, having a substantially tack-free coating comprising a novel moulding and spray...
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WO/2017/104665A1 |
Provided is a conductive adhesive tape which can have improved adhesiveness while maintaining electrical characteristics, and is less likely to lift or peel even when being exposed to high temperature or high humidity after being attache...
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WO/2017/090659A1 |
This adhesive composition for circuit connection contains (A) a radical-polymerizable compound, (B) a radical generator, and (C) particles including at least one type of metal compound selected from the group consisting of metal hydroxid...
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WO/2017/090759A1 |
[Problem] To provide a thermosetting composition which, when being cured quickly at a high temperature (within one minute at 100-150°C), can achieve the ability to avoid sudden boiling, and the ability of fast curing ability. [Solution]...
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WO/2017/090875A1 |
The present invention relates to an anisotropic conductive film comprising a conductive layer and an insulation layer, wherein each of the conductive layer and the insulation layer comprises two types of inorganic fillers having differen...
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WO/2017/090693A1 |
This adhesive composition contains (a) a thermoplastic resin, (b) a silane compound having a urethane bond and an alkoxysilyl group in one molecule, (c) a radical-polymerizable compound, and (d) a radical-polymerization initiator, and, a...
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WO/2017/086441A1 |
Provided are a film-wound body capable of achieving good temporary adhesion, and a method for producing the film-wound body. The film-wound body is provided with: an adhesive film (2) having a first surface (recessed surface) which is fo...
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