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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/001806A1 |
The invention relates to the use of a curable adhesive comprising (i) a (meth)acrylic acid, (ii) a C1 -6- alkyl (meth)acrylate, (iii) optionally, a hydroxy-C1-6-alkyl (meth)acrylate, (iv) optionally, a cycloalkyl (meth)acrylate; (v) opti...
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WO/2023/286709A1 |
A 2-cyanoacrylate adhesive composition comprising a 2-cyanoacrylate compound and a polyfunctional cyanoacrylate compound, wherein the storage modulus at 25°C of a cured product obtained by homopolymerization of the 2-cyanoacrylate compo...
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WO/2023/286701A1 |
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a U...
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WO/2023/286699A1 |
The present invention addresses the problem of providing a UV-curable resin composition that provides a flexible cured product having a lower crosslinking density than conventional cured products. The present invention comprises the foll...
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WO/2023/286710A1 |
A 2-cyanoacrylate adhesive composition comprising a 2-cyanoacrylate compound and a polyfunctional cyanoacrylate compound, wherein the storage modulus at 25°C of a cured product obtained by homopolymerization of the 2-cyanoacrylate compo...
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WO/2023/285760A1 |
The present invention relates to a crosslinkable two-component composition comprising: - a component A comprising: - an iodonium salt having one of the formulae (I-A), (I-B) or (I-C); - at least one (meth)acrylate monomer M1, - an organi...
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WO/2023/285759A1 |
The present invention relates to a crosslinkable two-component composition comprising: - a component A comprising: - an iodonium salt having one of the formulae (I-A), (I-B) or (I-C); - at least one (meth)acrylate monomer M1 having one o...
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WO/2023/286700A1 |
The present invention addresses the problem of providing a UV/heat-curing type curable resin composition which exhibits sufficiently high adhesion strength even after having only undergone either a UV-curing treatment or a heat-curing tr...
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WO/2023/282117A1 |
The present invention provides: a photocurable resin composition having a low viscosity before curing, having an excellent low-temperature storability, and producing, after curing, a film that has excellent water resistance, bending resi...
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WO/2023/276773A1 |
The present invention addresses the problem of providing a resin composition and an adhesive that have a high moisture resistance after heat curing. The present invention provides a resin composition including (A) a (meth)acrylate compou...
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WO/2023/276944A1 |
Provided is a pressure-sensitive adhesive composition which can give cured objects inhibited from changing in gel content even under high-temperature high-humidity conditions. This pressure-sensitive adhesive composition comprises a uret...
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WO/2023/276889A1 |
This adhesive film for connecting a circuit comprises: a resin component containing a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator; and conductive particles, wherein the resin component ...
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WO/2023/276708A1 |
A purpose of the present invention is to provide a thickener which is suitable for use as a thickener for adhesives and which, when used as a thickener for adhesives, especially cyanoacrylate-based adhesives, makes the adhesives have exc...
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WO/2023/277008A1 |
Provided are: an ethylenically unsaturated group-containing urethane polymer able to suppress a change in the gel fraction of a cured product even under conditions of high temperature and high humidity; a method for producing same; and a...
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WO/2022/267990A1 |
The present invention relates to a nopol bio-based silicon-containing oxetane monomer, a method for preparing the monomer, a photocurable composition comprising the monomer, and a photocurable material derived from the photocurable compo...
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WO/2022/260053A1 |
This photo/moisture-curable resin composition includes a radically polymerizable compound (A), a moisture-curable resin (B), a photopolymerization initiator (C), and a compound (D) having at least three isocyanate groups within the molec...
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WO/2022/259905A1 |
A conductive paste according to the present invention comprises a conductive filler (a) and a binder (b), wherein the binder (b) includes a terminal hydroxyl group-containing polyalkylene glycol (meth)acrylate (b1).
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WO/2022/255308A1 |
The purpose of the present invention is to provide a UV-curable adhesive composition having excellent printability, UV reactivity in the presence of oxygen, and adhesiveness with respect to a variety of types of base materials. Another p...
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WO/2022/252755A1 |
Disclosed are a ribbon carrier film, a preparation method therefor, and an application thereof, the ribbon carrier film comprising a pre-crosslinked layer and a bonding layer, the matrix resin of the pre-crosslinked layer and the bonding...
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WO/2022/255317A1 |
A purpose of the present invention is to provide an ultraviolet-curable heat-dissipating resin composition excellent in terms of printability, heat-dissipating property, and adhesiveness to various substrates. Another purpose is to provi...
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WO/2022/255313A1 |
The purpose of the present invention is to provide an ultraviolet-curable composition excellent in terms of printability, ultraviolet-light reactivity in the presence of oxygen, and tackiness at ordinary temperature and high temperatures...
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WO/2022/255382A1 |
The present invention provides a single component composition for temporary fixing of thin layer glass. The composition exhibits excellent photocuring properties and enables thin layer glasses to be strongly temporarily fixed to each oth...
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WO/2022/255049A1 |
A pressure-sensitive adhesive composition comprising: a combination of a β-1,3-glucan derivative obtained by introducing acyl groups into β-1,3-glucan, the β-1,3-glucan derivative having a degree of acyl substitution of 2.6 or higher ...
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WO/2022/254369A1 |
The composition includes a blend of monomers containing at least one of a cyclic imide-containing acrylate or a cyclic imide-containing methacrylate and an organoborane complex. The composition may be packaged as a two-part composition, ...
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WO/2022/250025A1 |
[Problem] To suppress, in an optical laminate including a polarizer on which iodine is adsorbed and oriented, a rise in the iodine concentration of a pressure-sensitive adhesive layer stacked on the optical laminate. [Solution] Provided ...
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WO/2022/250105A1 |
The purpose of the present disclosure is to provide an adhesive composition having excellent adhesiveness. An adhesive composition according to the present disclosure contains a copolymer (A) that includes, as constituent monomers, at le...
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WO/2022/249965A1 |
The purpose of the present invention is to provide an acrylic adhesive which has excellent adhesion strength at high temperatures and gives cured objects having excellent elongation. The provided acrylic adhesive is a two-pack mixing typ...
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WO/2022/244813A1 |
A purpose of the present invention is to provide: an optical pressure-sensitive adhesive sheet that has a layered structure including a pressure-sensitive adhesive layer which is less apt to have failures regarding transparency, appearan...
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WO/2022/243630A1 |
The present invention relates to a crosslinkable two-component composition comprising: ‐ a component A comprising: - a (meth)acrylate monomer, - a reducing agent, - a zinc salt selected from among zinc alkane sulfonates, zinc acetate, ...
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WO/2022/244812A1 |
A purpose of the present invention is to provide a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer which is less apt to have failures regarding transparency, appearance, or durability, exhib...
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WO/2022/243945A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising: (a) a radically (co) polymerizable (meth)acrylate-based component comprising (i) C1-C32 (meth)acrylic acid ester monomers...
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WO/2022/243436A1 |
The present invention relates to non-halogenated and non-metal polymerizable flame retardants, their preparation, compositions containing the same and uses thereof. These flame retardants may be polymerized with other ethylenically unsat...
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WO/2022/241772A1 |
Provided is a curable composition comprising (A) at least one (meth) acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst, which can thermally be curable at a temperature of lower than 100℃ and can...
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WO/2022/241748A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a first part and a second part, wherein the first part comprises: (a) a radically (co) polymerizable (meth) acrylate-based...
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WO/2022/243629A1 |
The present invention relates to a two-component crosslinkable composition comprising: - a component A comprising: - a reducing agent; - a metal salt selected from the group consisting of (meth)acrylic acid metal salts, itaconic acid met...
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WO/2022/246336A1 |
Photocurable compositions are provided herein, which provide a balance of fast curing properties at exposure to radiation in the electromagnetic spectrum and impressive cure through depth.
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WO/2022/238377A1 |
Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or fitting part (11), and at least one second pipe or fitting part (12), which comp...
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WO/2022/234017A1 |
The present invention relates to a two-part curable composition comprising: • a first part (component A) comprising : • at least 50% by weight based on the total weight of the first part, of one or more alkyl cyanoacrylate monomer, s...
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WO/2022/234802A1 |
[Problem] To provide, as a curable silicone composition used in an optical display or the like, an ultraviolet radiation-curable silicone composition which exhibits storage stability and sufficient rapid curing properties and yields a cu...
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WO/2022/227445A1 |
Disclosed in the present invention are an organosilicon-modified acrylate, a silane-modified polyether adhesive, and a preparation method therefor. The organosilicon-modified acrylate has a structure as shown in formula I. The silane-mod...
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WO/2022/230027A1 |
The present invention relates to: an energy ray-crosslinkable adhesive agent composition which contains (A) an acrylic resin that is energy ray-crosslinkable and (B) a tackifier, wherein the tackifier (B) contains (B1) a styrene resin; a...
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WO/2022/232475A1 |
Two part cyanoacrylate/free radical curable adhesive systems are provided.
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WO/2022/230874A1 |
The present invention provides a composition for provisional fixation containing the components (A) to (C) described below, the composition being excellent in terms of compatibility, adaptability to spin coating processes, heat resistanc...
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WO/2022/224934A1 |
Provided is an adhesive composition containing a polymerizable compound, a thermal polymerization initiator, and a dicarboxylic acid diester compound.
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WO/2022/225152A1 |
The present invention relates to a dual curable hybrid resin composition and a display adhesive using same, and, more specifically, has excellent initial adhesive strength after UV curing since a moisture curable component and a radiatio...
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WO/2022/208316A1 |
The present disclosure provides an adhesive precursor composition, comprising a polyfunctional acrylate oligomer, a reactive diluent including an acrylate monomer; a photoinitiator; and heat-expandable microspheres which are capable of e...
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WO/2022/210261A1 |
The present invention provides a curable resin composition that gives a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by cu...
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WO/2022/210166A1 |
An adhesive composition which contains a polymerizable monomer that has a (meth)acryloyl group, a radical polymerization initiator and polymer particles that are swellable with an organic solvent, wherein with respect to the particle siz...
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WO/2022/210673A1 |
Provided are: a curable adhesive composition including a first curing system, in which a cross-linking agent reacts with a binder resin having a reactive functional group and the reaction proceeds at a temperature of 120°C or less, and ...
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