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WO/2023/053952A1 |
The purpose of the present invention is to provide: a laminate that can be used as a micro channel chip having an excellent appearance and in which the risk liquid leakage from a channel is reduced, while maintaining binding strength; an...
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WO/2023/052864A1 |
A crosslinkable composition comprises components: (a) at least one polymer comprising isobutylene monomer units; and (b) at least one star polymer represented by the formula SiRn(OSi(R)2-PIB-T)4-n. Each R independently represents a hydro...
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WO/2023/047872A1 |
Provided is a composition for adhesives which gives an adhesive with which a metal foil and a resinous film can be tenaciously bonded to each other even at high temperatures. The composition for adhesives comprises: an acid-modified poly...
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WO/2023/039916A1 |
A process to form a composition, said process comprising at least the following steps A) and B) : A) mixing together at least the following components a and b to form a first composition: a) the "anhydride-functionalized olefin-based pol...
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WO/2023/024267A1 |
The present invention provides a bridging agent, a composition, a masterbatch, a packaging film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1 xR2 y[CH3SiO]n, wher...
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WO/2023/028557A1 |
A hot melt adhesive composition includes less than 35 % by weight polymer where the polymer includes an ethylene/alpha-olefin copolymer, or a combination of an ethylene/alpha-olefin copolymer and a propylene polymer, a wax, and a tackify...
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WO/2023/025721A1 |
The invention relates to hot melt adhesive compositions comprising at least one adhesive base polymer and at least one betulin tackifier, to methods of using the adhesive to bond substrates together, and to articles of manufacture compri...
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WO/2023/022166A1 |
An adhesive resin composition comprising: 60-95 parts by mass of an ethylene-based polymer (A) including a modified ethylene-based polymer (a-2) obtained by modifying, by an unsaturated carboxylic acid and/or a derivative thereof, at lea...
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WO/2023/022168A1 |
An adhesive resin composition including: 50-89.9 parts by mass of a propylene polymer (A) that satisfies (a1) and (a2) below; 0.1-20 parts by mass of a modified polyolefin (B); and 10-30 parts by mass of an ethylene polymer (C) that sati...
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WO/2023/022167A1 |
An adhesive resin composition including 60-95 mass parts of an ethylene polymer (A) that includes a modified ethylene polymer (a-2) obtained by modifying at least one polymer (a-1) selected from the group consisting of ethylene homopolym...
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WO/2023/007257A1 |
The present invention discloses hot-melt adhesive formulations that, besides exhibiting excellent properties in use, both for adhesiveness and cohesion, further have an unexpected and strongly improved processability that allows to proce...
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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/002027A1 |
What is presented and described is an edge strip, especially for items of furniture, comprising a structure layer and at least one function layer, bonded to the structure layer, for securing of the edge strip on a narrow face of a workpi...
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WO/2023/288259A1 |
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...
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WO/2023/286808A1 |
The present invention addresses the problem of providing a multilayer sheet that exhibits a high interlayer peel strength and that comprises: an adhesive layer containing an acid-modified polyolefin; and a substrate layer containing a po...
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WO/2023/288260A1 |
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...
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WO/2023/286487A1 |
Provided are: a heat-fusible laminated film which has high interlaminar adhesion strength and which, when heat-fused, brings about a satisfactory bonded state; and a roll obtained by winding the heat-fusible laminated film. The heat-fu...
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WO/2023/286712A1 |
Provided is an adhesive composition comprising (A) an acid-modified styrene-based elastomer, (B) an isocyanate compound having at least two isocyanate groups per molecule, (C) fluorine-based polymer microparticles and (D) olefin-based po...
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WO/2023/282318A1 |
[Problem] To provide an adhesive composition which has high adhesiveness to not only conventional polyimides and liquid-crystal polymers but also metal substrates, can attain high soldering heat resistance, and is excellent in terms of l...
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WO/2023/283564A1 |
The hot melt adhesive composition includes from 1I % by weight to less than 10 % by weight total polymer content, of which less than 10 % by weight, based on the hot melt adhesive composition, is a single site-catalyzed propylene polymer...
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WO/2022/272276A1 |
An adhesive composition comprising a lignin-based tackifying agent exhibiting a glass transition temperature no greater than 120°C and a thermoplastic polymer.
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WO/2022/265039A1 |
The present invention provides an adhesive film 10 having an adhesive layer 12 which is disposed on at least one surface of a heat-resistant layer 11. An essential component of the heat-resistant layer 11 is a thermoplastic resin having ...
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WO/2022/260058A1 |
Provided is an adhesive composition containing 5-250 parts by mass of liquid farnesene rubber (B) and 10-500 parts by mass of a tackifying resin (C) per 100 parts by mass of at least one solid rubber (A) selected from the group consistin...
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WO/2022/260679A1 |
A peelable and sealable lidstock constructed from a metal substrate and a sealing layer, the sealing layer containing (A) from 70-89% by weight of a copolymer having one or more polymerized olefin monomers and one or more polymerized eth...
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WO/2022/244879A1 |
The present invention addresses the problems of: providing a resin composition having excellent low-temperature heat-sealing properties and excellent adhesion to polyolefin resin substrates, as well as a coating agent obtained therefrom;...
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WO/2022/244286A1 |
An adhesive sheet (100) of the present invention has: a first resin layer (10) containing a 4-methyl-1-pentene polymer; and a design layer (30), wherein at least a portion of the first resin layer (10) is exposed on a surface (11) and a ...
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WO/2022/245573A1 |
Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contac...
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WO/2022/238352A1 |
Hot melt adhesive comprising a polar group-containing olefin copolymer having: number average molecular weight (M n ) between 10 to 50 kg/mol, preferably between 20 to 50 kg/mol, crystallinity (X c ) content below 30%, preferably below 1...
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WO/2022/230935A1 |
The purpose of the present invention is to provide an adhesive tape that achieves both excellent adhesive power and holding power. The adhesive tape according to the present invention has an adhesive agent layer. When a small-angle X-ray...
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WO/2022/230938A1 |
The present invention addresses the problem of providing a multi-layer sheet comprising: an adhesive agent layer that contains an acid modified polyolefin; and a base material layer that contains a polyphenylene ether. The peeling streng...
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WO/2022/230936A1 |
The purpose of the present invention is to provide: an adhesive tape which has both excellent adhesive power and excellent holding power; and an adhesive composition which is used for this adhesive tape. The present invention provides an...
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WO/2022/222031A1 |
A hotmelt adhesive comprising a metallocene-catalyzed polyolefin and a hydrophilic melt additive. The adhesive is permanently hydrophilic and can be in particular used to bond components of a disposable hygienic article such as a diaper.
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WO/2022/226440A1 |
An hotmelt adhesive for absorbent article (20), wherein the hotmelt adhesive comprises at least one low molecular weight metallocene-catalyzed polyolefin, at least one high molecular weight polyolefin having a peak molecular weight of fr...
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WO/2022/217672A1 |
Provided in the present invention is a water-based low-temperature heat transfer printing adhesive, which is prepared from the following raw materials in parts by weight: 20-30 parts of an ethylene acrylic resin, 3-10 parts of an alkalin...
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WO/2022/217545A1 |
An aqueous dispersion composition is described. The composition comprising an aqueous dispersion of a) polyisobutylene particles; and b) polyolefin particles, which are polyethylene or polypropylene particles, wherein the weight-to-weigh...
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WO/2022/217509A1 |
A composition comprising the following components: a) a first ethylene/alpha-olefin interpolymer that comprises the following properties: i) a melt viscosity (177℃) from 2,000 to 50,000 mPa·s, ii) a density from 0.855 to 0.885 g/cc; b...
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WO/2022/221874A1 |
The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% ...
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WO/2022/210053A1 |
The present invention relates to a modified polyolefin resin in which a polyolefin resin (A) is modified using an α,β-unsaturated carboxylic acid and/or an acid anhydride thereof (B), the modified polyolefin resin being furthermore mod...
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WO/2022/209431A1 |
The purpose of the present invention is to obtain: a resin composition having further improved adhesion to a base material layer when used as an adhesive layer in a laminate; and a laminate having superior adhesive strength between layer...
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WO/2022/209423A1 |
The present invention addresses the problem of providing: a laminate film that includes a recycled resin, and that has a comparatively exceptional external appearance and comparatively low damage properties; and a bag that includes the l...
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WO/2022/210671A1 |
The present invention provides a curable adhesive composition which contains (A) a binder resin that has a reactive functional group and (B) a crosslinking agent that is reactive with the component (A), while having a molecular weight of...
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WO/2022/210673A1 |
Provided are: a curable adhesive composition including a first curing system, in which a cross-linking agent reacts with a binder resin having a reactive functional group and the reaction proceeds at a temperature of 120°C or less, and ...
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WO/2022/207575A1 |
2020-0076WO 55 / 55 Abstract The invention is directed to a sealing element comprising a filled polymeric layer comprising a polymer component comprising a polyvinylchloride resin and at least one ethylene vinyl acetate copolymer 5 and a...
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WO/2022/210672A1 |
Provided is an adhesive sheet including a curable adhesive layer, wherein the curable adhesive layer is one formed from a starting material composition comprising a binder resin (A) having a reactive functional group and a crosslinking a...
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WO/2022/209918A1 |
[Problem] To provide an adhesive composition that exhibits excellent adhesion to a base material, which is mainly composed of a polyolefin resin such as a polypropylene, a polyethylene and an ethylene-vinyl acetate copolymer (EVA), witho...
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WO/2022/211081A1 |
The present invention addresses the problem of providing a multi-layer sheet comprising an adhesive agent layer that contains an acid modified polyolefin and a base material layer that contains a polyphenylene ether, wherein the peeling ...
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WO/2022/210054A1 |
The present invention relates to an aqueous dispersion which contains a modified polyolefin resin that is obtained by modifying a polyolefin resin (A) with an α,β-unsaturated carboxylic acid and/or an acid anhydride (B) thereof, wherei...
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WO/2022/210702A1 |
A protective film 10 according to the present invention is applied to a resin substrate 21 when heating and bending the resin substrate 21, and includes a base material layer and an adhesive layer located between the base material layer ...
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WO/2022/199579A1 |
The present disclosure relates to the technical field of encapsulation films, and in particular to a black high-reflection high-heat-conducting anti-PID EVA encapsulation film, and a preparation method therefor and an application thereof...
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WO/2022/202570A1 |
This hot melt adhesive composition contains an acid-modified polyolefin and a copolymerized polyester and satisfies the following (1)-(5). (1) The copolymerized polyester is composed of a dicarboxylic acid component and a glycol componen...
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