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WO/2023/063401A1 |
Provided is an aqueous dispersion composition of an olefin-based thermoplastic resin having excellent heat-sealing ability. More specifically, provided is an aqueous dispersion composition that is of an olefin-based thermoplastic resin a...
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WO/2023/063388A1 |
Provided is a fluoro rubber crosslinking composition containing a polyol-crosslinkable fluoro rubber (a), a crosslinking agent (b), and an acid acceptor (d). The crosslinking agent (b) is at least one selected from the group consisting o...
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WO/2023/063811A1 |
The present invention relates to a gel formulation of ammonium salt of glycyrrhizinic acid as active agent with a thermo-reversible gel former such as polyoxyethylene-polyoxypropylene-polyoxyethylene (POE-POP-POE) as a vehicle, character...
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WO/2023/060859A1 |
Disclosed in the present invention are a fluorescent material, and a preparation method therefor and the use thereof. The fluorescent material comprises the following components: a modifier, perovskite, polyethylene oxide and a solvent, ...
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WO/2023/062749A1 |
A resin composition containing an A resin, a B resin and a polymer antistatic agent, wherein: the A resin is a polyphenylene ether resin; the B resin is one or more of resins selected from the group consisting of butylene terephthalate r...
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WO/2023/063491A1 |
The present invention relates to a poly(butyl acrylate)-based electrochromic element composition having light transmissability and elasticity, and a method for producing an electrochromic member. The electrochromic element composition ac...
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WO/2023/058521A1 |
A ceramic-molding binder composition comprising 15-95 mass% of component (A) and 5-85 mass% of component (B). Component (A): A copolymer in which the percentage content of a structural unit derived from formula (1) is 70-99 mol%, the per...
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WO/2023/056586A1 |
The invention relates to a composition, which has excellent durability after curing, and has low oil permeability and is not easy to be stained. The composition contains component (A) silane-crosslinking polymer, component (B) amino sili...
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WO/2023/058425A1 |
Provided is a resin composition for wafer level chip-size package-type semiconductor devices, wherein the resin composition can form a coating film that exhibits good high-frequency characteristics, little variability in thickness, and r...
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WO/2023/055681A1 |
A two-part moisture cure organopolysiloxane composition comprising a base part and a catalyst package. The catalyst package undergoes minimal phase separation during storage despite comprising amino silane(s), alkoxy silane(s), and tin c...
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WO/2023/052715A1 |
The invention relates to a powder comprising particles consisting of a composition comprising at least one polyaryletherketone and at least one flexible thermoplastic polymer. The elastic modulus of the flexible thermoplastic polymer is ...
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WO/2023/054518A1 |
[Problem] The present invention provides: a prepreg which is capable of reducing skew and transmission loss; a laminate; and a printed wiring board. [Solution] The present invention provides a prepreg which is obtained by impregnating or...
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WO/2023/054207A1 |
The purpose of the present invention is to provide a vinyl chloride resin composition from which a vinyl chloride resin molded product having excellent fogging resistance can be molded. This vinyl chloride resin composition is characteri...
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WO/2023/055680A1 |
A two-part moisture cure organopolysiloxane composition comprising a base part and a catalyst package wherein the catalyst package, despite comprising amino silane(s), alkoxy silane(s), and tin catalyst(s) and optionally reinforcing fill...
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WO/2023/054433A1 |
An embodiment of the present disclosure pertains to an eyeglass lens comprising an antifouling layer which is a condensate of an antifouling agent composition containing (A) a compound having a silyl group and a fluorinated alkyl group, ...
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WO/2023/054701A1 |
A curable composition containing: a reactive silicon group-containing polyoxyalkylene polymer (A) having a reactive silicon group, wherein a terminal structure comprises the reactive silicon group and a terminal olefin group and/or an in...
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WO/2023/053749A1 |
Provided is a resin composition that has excellent resistance to soldering heat, has a low dielectric characteristic at an initial state, and can suppress changes in dielectric characteristics when left for an extended period at a high t...
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WO/2023/054434A1 |
One embodiment of the present disclosure relates to a lens for eyewear, the lens being provided with an antifouling layer which is formed of a condensation product of an antifouling agent composition that contains 10-70% by mass of a com...
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WO/2023/054700A1 |
A curable composition containing a reactive silicon group-containing polyoxyalkylene polymer (A) that has a reactive silicon group and a molecular weight per single reactive silicon group of 16,000, and a titanium compound (B) and ammoni...
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WO/2023/047901A1 |
The present invention provides: a non-photosensitive insulation film-forming composition capable of achieving a low dielectric constant and a low dielectric loss tangent; and a non-photosensitive resin film obtained from said composition...
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WO/2023/048025A1 |
Provided are: a novel resin composition which has an excellent appearance after curing and can attain a low CTE; a prepreg; a metal foil-clad laminated sheet; a composite resin sheet; a printed wiring board; and a semiconductor device. T...
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WO/2023/048155A1 |
Provided is a one-pack type curable composition capable of suppressing lowering of the curing rate after storage. A one-pack type curable composition according to one aspect of the present invention comprises: a (meth)acrylic-based copol...
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WO/2023/048186A1 |
The present invention provides a curable composition containing an organic polymer (A) having a reactive silicon group, and a curing catalyst (B) in which constituent components include the following substances (b1), (b2), and (b3). (b1)...
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WO/2023/046575A1 |
The present disclosure relates to a process for manufacturing an injection agent which is a viscoelastic liquor and includes a first and a second poloxamer and at least one other component, wherein the following steps are to be performed...
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WO/2023/042728A1 |
Provided are: a rubber composition capable of giving vulcanized molded objects having a satisfactory balance among oil resistance, freeze resistance, and flex fatigue resistance; and a vulcanizate and a vulcanized molded object which hav...
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WO/2023/042578A1 |
Provided is a resin composition that has good substrate embeddability as well as superior heat resistance, while also having a low dielectric characteristic. The resin composition includes: (A) a polyphenylene ether resin that has, at a ...
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WO/2023/042748A1 |
Provided is a carbon dioxide absorber which contains a polyether compound and which is characterized in that: the polyether compound contains an average of 50 or more repeating units represented by general formula (1) set forth in the de...
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WO/2023/042008A1 |
A reflective article includes an injection molded thermoplastic substrate, and a reflective metal layer disposed on a surface of the thermoplastic substrate. The injection molded thermoplastic substrate is prepared from a pre-blended com...
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WO/2023/042021A1 |
A desirable balance of heat resistance and flame retardancy is exhibited by a composition that includes specific amounts of a poly(phenylene ether), a poly(phenylene ether)-polysiloxane block copolymer reaction product, a hydrogenated bl...
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WO/2023/037710A1 |
The purpose of the present invention is to provide a method for producing PHA having excellent thermal stability, in a pH range in which there is no need to use a corrosion-resistant device. This problem is overcome by providing a method...
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WO/2023/037862A1 |
Provided is a thermally conductive composition comprising: a curable component; a curing agent for curing the curable component; and a metal filler. The metal filler includes thermally conductive particles and low-melting-point metal par...
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WO/2023/037172A1 |
A poly(phenylene ether)-based composition exhibiting improved resistance to decomposition after repeated exposure to high voltages is prepared by melt-blending specific amounts of a poly(phenylene ether), an organophosphate ester flame r...
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WO/2023/030859A1 |
The invention relates to a composition, which comprises the components (i) a synthetic polymer; and (ii) a ternary stabilizer combination comprising a benzofuranone, a sterically hindered phenol compound such as a bisphenolic stabilizer ...
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WO/2023/032759A1 |
Provided are: a composite material having high strength and excellent chemical resistance and solvent resistance; and a method enabling production of the composite material relatively easily and industrially advantageously.　This compos...
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WO/2023/031832A1 |
Disclosed is a composition comprising from about 15 wt. % to about 80 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide or a polyether ketone or a combination thereof; and from about 10 wt....
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WO/2023/033131A1 |
The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a poly(phenylene ether)-based resin, (C) an alkoxysilane compound having a primary amino group, and (D) an inorganic filler; and a prepreg, a ...
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WO/2023/033492A1 |
The present invention relates to a thermoplastic resin composition and a molded product manufactured therefrom, the thermoplastic resin composition comprising, on the basis of 100 parts by weight of a base resin including (A1) 20-40 wt% ...
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WO/2023/026187A1 |
Thermoplastic compositions include: a polymer base resin including at least one liquid crystal polymer (LCP) resin, at least one polyphenylene ether (PPE) resin, or a combination thereof; and from at least 0.1 wt% to 10 wt% of a low-OAN ...
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WO/2023/026584A1 |
A film-like adhesive agent comprising an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), wherein the contained amount of the epoxy resin curing agent (B) in the film-like adhesive agent is 0.30-12.0 mass%, the ...
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WO/2023/027034A1 |
The purpose of the present invention is to obtain a film-forming composition for forming a film that comprises a thinned protective film and has an excellent-circuit wiring- or sensor-electrode-protection performance, and to obtain a cir...
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WO/2023/026845A1 |
The present invention addresses the problem of providing a curable resin composition and a prepreg for obtaining a cured product having improved heat resistance. As a means of solution, provided is a curable resin composition containing ...
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WO/2023/022028A1 |
A thermoplastic elastomer composition including the following component (A) and component (B). Component (A): a styrene thermoplastic elastomer having the following molecular weight distribution. There is a peak top in the range of 360,0...
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WO/2023/020222A1 |
A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by me...
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WO/2023/023205A1 |
A power transmission belt having a belt body, a tensile cord embedded in the belt body, and a jacket defining a pulley contact surface, where the jacket has been treated on at least the pulley contact surface with an aqueous fabric treat...
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WO/2023/022085A1 |
This composition contains a fluorine-containing polymer and a polyaryletherketone, wherein the fluorine-containing polymer is dispersed in the polyaryletherketone and the storage elastic modulus G' of the composition at the melting point...
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WO/2023/021381A1 |
The disclosure provides compositions, methods, and kits that find use in calibrating a mass spectrometer, and can include one or more predetermined concentration(s) of one or more calibrant molecule(s) that comprise a polyethylene glycol...
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WO/2023/022238A1 |
Provided is a nanodiamond aqueous dispersion that achieves high dispersion of nanodiamond particles in water. This nanodiamond aqueous dispersion includes water and nanodiamond particles that are dispersed in the water. The nanodiamond a...
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WO/2023/016244A1 |
Provided by the present invention a resin composition and an application thereof, the resin composition comprises the following components: (A) a thermosetting resin, the thermosetting resin comprising a combination of at least two among...
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WO/2023/017833A1 |
Provided is a low-cost piston ring which has a low sulfur atom content, does not require a particular exposure device and does not require strict safety measures. A piston ring 1 which is to be used in a reciprocating compressor for comp...
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WO/2023/017327A1 |
A polymer processing aid (PPA) reduces melt defects in extruded polyolefins in the absence of fluoropolymers. The polymer processing aid comprises a block copolymer having polyamide blocks and polyether blocks and reduces melt defects we...
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