Title:
NON-PHOTOSENSITIVE INSULATION FILM-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/047901
Kind Code:
A1
Abstract:
The present invention provides: a non-photosensitive insulation film-forming composition capable of achieving a low dielectric constant and a low dielectric loss tangent; and a non-photosensitive resin film obtained from said composition. This non-photosensitive insulation film-forming composition contains a solvent and a polymer that has a repeating unit structure represented by formula (1). (In formula (1), group A1 represents an aromatic heterocycle represented by (AA); group A2 represents an aromatic heterocycle represented by (BB); group A1 and group A2 may have crosslinkable substituents; group B1 represents an organic group having a crosslinkable substituent; and group B2 represents an organic group not having a crosslinkable substituent.)
Inventors:
SUGAWARA SHUN (JP)
ADACHI ISAO (JP)
SHUTO KEISUKE (JP)
SAWADA KAZUHIRO (JP)
ENDO MASAHISA (JP)
ADACHI ISAO (JP)
SHUTO KEISUKE (JP)
SAWADA KAZUHIRO (JP)
ENDO MASAHISA (JP)
Application Number:
PCT/JP2022/032691
Publication Date:
March 30, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08G65/40; C08K5/3415; C08L71/08; C09D171/10
Domestic Patent References:
| WO2019198606A1 | 2019-10-17 | |||
| WO2021187481A1 | 2021-09-23 | |||
| WO2022210095A1 | 2022-10-06 |
Foreign References:
| JP2017200997A | 2017-11-09 | |||
| JP2019051709A | 2019-04-04 | |||
| CN112457651A | 2021-03-09 | |||
| US20110108755A1 | 2011-05-12 | |||
| JP2021172756A | 2021-11-01 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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