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JP2023056678A |
To provide a polyvinyl alcohol film capable of obtaining a polarizing film superior in polarizing performance, a manufacturing method of such polyvinyl alcohol film, and a stretched film and a polarizing film using such polyvinyl alcohol...
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JP7256967B2 |
A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin...
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JP2023512125A |
Ethylene, (meth)acrylic acid, C1~12- A pigment composition comprising a bismuth vanadate pigment dispersed in a copolymer with at least one comonomer selected from the group consisting of alkyl (meth)acrylates and maleic anhydride.
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JP7245922B2 |
The invention relates to a composition comprising a) a polymer a) comprising polymerized units of a N-vinyl lactam, b) a comb copolymer b) having a polymer backbone based on a vinyl aromatic compound and an ethylenically unsaturated poly...
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JP7245334B2 |
A maleimide based copolymer, manufacturing method thereof, and a resin composition using the maleimide based copolymer is provided. A maleimide based copolymer includes 40 to 60 mass% of aromatic vinyl monomer unit, 5 to 20 mass% of viny...
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JP7245333B2 |
A maleimide based copolymer, manufacturing method thereof, and a resin composition using the maleimide based copolymer is provided. The maleimide based copolymer includes 40 to 60 mass% of aromatic vinyl monomer unit, 5 to 20 mass% of vi...
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JP7238732B2 |
To provide a low dielectric resin composition that gives a cured product of low hardness while having a low relative dielectric constant and a low dielectric loss tangent.A low dielectric resin composition contains (a) a maleimide compou...
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JP7228579B2 |
A thermoplastic resin composition according to the present invention comprises: a rubber-modified aromatic vinyl-based copolymer resin; an aliphatic polyamide resin; a poly(ether ester amide) block copolymer; a modified polyolefin resin;...
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JP2023025222A |
To provide a maleimide-based copolymer, a method for producing the same, and a resin composition using the same.MEANS FOR SOLVING THE PROBLEM: A maleimide-based copolymer has 40-60 mass% of an aromatic vinyl monomer unit, 5-20 mass% of a...
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JP7225054B2 |
The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the ...
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JP7225240B2 |
The invention relates to the use of PMMI copolymers for reducing the molecular weight degradation of the polymer induced by oxides such as titanium dioxide or silicon dioxide in compositions based on aromatic polycarbonate. The mechanica...
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JP2023504657A |
A biodegradable resin composition and a method for producing the same, containing three components including at least one or more selected from polyethylene, a biodegradable resin, and polybutylene adipate terephthalate and maleic anhydr...
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JP7215188B2 |
To provide a resin composition excellent in moldability, a cured product, a molding, a prepreg, a resin sheet, a metal foil-clad laminate, a printed wiring board, a semiconductor device, an encapsulant, a fiber-reinforced composite mater...
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JP2023013229A |
To provide a resin composition which is thermally expand at a low level while suppressing the change of a specific dielectric constant (Dk), a prepreg using the resin composition, a laminated plate, a resin film, a multilayer printed wir...
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JP2023013224A |
To provide a method for manufacturing a laminate for an antenna module that can correspond to a high frequency and can be made more compact which has a simple manufacturing process while using a thermosetting resin composition, and a met...
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JP7212626B2 |
Provided is a resin composition for a printed wiring board capable of exhibiting excellent dielectric properties (extremely low dissipation factor tangent) appropriate for high-frequency use, and, when used in a copper-clad laminate boar...
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JP7210349B2 |
To provide a resin composition which has dielectric characteristics in a high frequency region suitable for an interlayer insulation film for a circuit board and for the circuit board or the like aimed at a highly integrated arithmetic u...
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JP7209763B2 |
A benzoxazine resin and a method for manufacturing the same, and a resin composition are provided. The benzoxazine resin is obtained from a condensation polymerization reaction of a phenolic compound, formaldehyde, and a primary amine co...
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JP2023009094A |
To provide a stretched film excellent in heat resistance, dimension stability, mechanical characteristics and adhesion, and a manufacturing method of a stretched film.A stretched film contains an acrylic resin and acrylic rubber particle...
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JP7208705B1 |
The present invention provides a maleimide resin that exhibits excellent heat resistance and electrical properties and has good curability, a curable resin composition, and a cured product thereof. A maleimide resin obtained by reacting ...
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JP7199508B2 |
A germ-repellent plastic for use in a gas pathway of a respiratory device contains an anti-biofouling compound, and a basic plastic. The anti-biofouling compound is optionally selected from the group of a polyol, a polyether polyol, a po...
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JP2022188642A |
To provide a copolymer that is excellent in initial dispersibility and dispersion stability of pigment and also has low foamability.A copolymer contains a constitutional unit (A) derived from a styrenic monomer, a constitutional unit (B)...
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JP7188883B2 |
A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: R-CH=CH...
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JP2022182542A |
To provide a photocurable resin composition to be used for forming a coating film which has excellent antifogging properties and can maintain the antifogging properties over a long period of time..The photocurable resin composition conta...
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JP7181525B2 |
This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an...
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JP2022173868A |
To provide an antibacterial heat resistant composition that is excellent in impact resistance and heat resistance and has excellent antibacterial properties.The present invention provides an antibacterial heat resistant composition conta...
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JP7170137B2 |
The present invention relates to a thermosetting resin composition, the raw material components of which comprise a biphenyl-type maleimide resin, a carbodiimide, a rubber toughening agent with a core-shell structure, and a thermosetting...
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JP7170136B2 |
The present invention relates to a high-frequency resin composition and use thereof. The high-frequency resin composition comprises 25-50 parts of a modified polyphenylene ether resin, 15-40 parts of a block copolymer rubber, 10-50 parts...
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JP2022163967A |
To provide: a composition which can be used as a surface coating agent for effectively suppressing moisture dissipation of a surface of a cement-based molded body; a surface coating agent using such a composition; a shrinkage reduction m...
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JP2022163966A |
To provide a curable composition containing methylene malonate with improved defoaming properties.A curable composition contains a monofunctional methylene malonate and/or a polyfunctional methylene malonate, and a fluorine-modified sili...
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JP7161370B2 |
To provide a novel protective film-forming composition.A composition contains a water-soluble polymer and a solvent, and the solvent contains water and a propylene glycol derivative at a mass ratio of 9:1-0:10.SELECTED DRAWING: None
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JP7161371B2 |
To provide a novel protective film-forming composition.A composition contains a polyvinylpyrrolidone resin, a solvent and a laser light absorbent.SELECTED DRAWING: None
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JP7154475B2 |
To provide a resin composition, a prepreg, a metal foil-clad laminate, a resin sheet and a printed wiring board which express balanced physical properties in peel strength, heat resistance and thermal conductivity.A resin composition for...
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JP7152839B1 |
A maleimide resin mixture containing a maleimide resin (B) obtained by reacting a maleimide resin (A) represented by the following formula (1), a diamine (b), and maleic anhydride. [Chemical 1] (In the formula (1), each of a plurality of...
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JP7151834B2 |
A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups...
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JP7151074B2 |
To provide a resin composition suitable for an optical compensation film, and an optical compensation film excellent in phase difference characteristics using the same.The resin composition comprises: a resin with a residue unit represen...
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JP2022152090A |
To provide an aqueous dispersion comprising particles of tetrafluoroethylene polymers, having excellent dispersion stability, handleability, blendability and long-term storageability, and a method for producing an aqueous dispersion, a m...
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JP7147680B2 |
The present invention provides a heat-curable maleimide resin composition capable of yielding a cured product superior in tracking resistance (high comparative tracking index, CTI) and a semiconductor device encapsulated by the cured pro...
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JP2022133827A |
To provide a composition for peeling layer formation which enables formation of a device composed of a resin substrate on a peeling layer, and gives the peeling layer easily peeled at an interface between the peeling layer and the device...
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JP2022133078A |
To provide a softening EVOH-based resin composition excellent in gas barrier property and flexibility.A softening EVOH-based resin composition is prepared by replacing with a softening component, a part of ethylene-vinyl alcohol copolyme...
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JP2022131823A |
To provide a styrenic resin composition excellent in heat resistance, oil resistance, ductility and surface appearance, and a molded article containing the styrenic resin composition.The styrenic resin composition of the present inventio...
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JP7130799B2 |
Composite materials and structural adhesives containing particles of functionalized polymers as a toughening agent. The particles are composed of functionalized polyaryletherketone (PAEK) polymer or copolymer thereof that contain chemica...
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JP7115427B2 |
The present invention relates to a novel tackifying resin emulsion which is excellent in emulsifying properties and mechanical stability, and is capable of imparting high water-resistant adhesive strength to a water-based viscous adhesiv...
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JP7113028B2 |
The present disclosure provides a non-hydrocarbyl-based alcohol initiated polyetheramine. In particular, the polyetheramine of the present disclosure is produced from a tetrahydrofurfuryl alcohol-based initiator which is alkoxylated and ...
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JP7107970B2 |
A free standing dispersant film is provided, including: a partially hydrolyzed polyvinyl acetate; a poly(ethylene oxide); a polyalkylene glycol; a plasticizer; a dispersant polymer; optionally, a poly(isobutylene-co-maleic anhydride) cop...
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JP7107218B2 |
The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free f...
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JP7104374B2 |
To provide a dispersant in which dispersion failure due to incompatibility when changing combination of additives is unlikely to occur, and which can give dispersibility and thixotropy.A non-aqueous dispersant comprises a copolymer of mo...
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JP7100799B2 |
To provide a thermosetting resin composition that is halogen-free and prevents a decrease of heat resistance and a deterioration of dielectric properties and has flame retardancy, and is excellent in heat resistance, low thermal expansib...
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JP7098686B2 |
To provide a water dispersion composition for heat sealants that has excellent heat sealability and heat seal layer blocking resistance without using a lamination process.A water dispersion composition for heat sealants contains an aliph...
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JP2022531224A |
(A) Acrylonitrile-butadiene-styrene graft copolymer 25-30% by weight; (B) Aromatic vinyl-vinyl cyanide copolymer 45-55% by weight; and (C) Maleimide-based copolymer 20-25% by weight Regarding a thermoplastic resin composition containing ...
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