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JP7377010B2 |
Provided is a polymer composition having sufficient heat resistance and optical characteristics. Disclosed is a polymer composition comprising a polymer containing a monomer unit having a ring structure, wherein the polymer composition i...
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JP7375493B2 |
To provide a resin composition for optical material which can produce an optical film whose in-plane and out-of-plane phase differences are adjusted in a negative direction without impairing heat resistance.A resin composition for optica...
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JP2023158258A |
To provide a thermoplastic resin composition which is excellent in translucency, heat resistance, impact resistance and flowability, and can stably maintain translucency without being affected by a molding temperature and an environment ...
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JP7371242B2 |
The present invention relates to a thermoplastic resin having excellent impact strength, gloss, fluidity, and non-whitening properties and a method of preparing the same. More particularly, the present invention relates to a thermoplasti...
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JP7369580B2 |
To provide a curable composition which, while maintaining low dielectric properties, is soluble in various solvents (organic solvents other than organic solvents having high toxicity, for example, cyclohexanone) and a film by curing it h...
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JP2023156362A |
To provide a resin material which 1) enhances embedding properties to an uneven surface, 2) suppresses excess squeeze out from a periphery of a substrate of a resin material during lamination, 3) keeps curing temperature low, 4) reduces ...
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JP2023154881A |
To achieve a composition for forming low-dielectric-constant resin, which is suitable for use in the next-generation communication devices that are advancing toward higher frequencies, or radars and the like, and also possesses high work...
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JP7364571B2 |
Provided are a polyamide composition containing a polyamide (A) having a melting point of 280°C or higher and a flame retardant (B), which is such that, when a melt of the polyamide composition is injection-molded with a mold having a t...
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JP7363135B2 |
To provide a thermosetting resin composition excellent in dielectric characteristics and laser processability, to provide a prepreg using the thermosetting resin composition, to provide a copper-clad laminate, to provide a printed wiring...
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JP2023152307A |
To provide: a resin composition suitable for optical films; an optical film having excellent phase difference characteristics using the same; and a method for producing the optical film.This invention relates to: a resin composition comp...
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JP2023152060A |
To provide a resin composition from which a molding material excellent in adhesion and mechanical strength such as bending strength can be obtained, a fiber material, and a molding material.A resin composition contains an epoxy resin, an...
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JP2023146886A |
To provide a resin composition from which a cured coating film having excellent heat resistance and coating film appearance can be obtained.A resin composition contains a maleimide resin (A) and a compound (B) having a polymerizable unsa...
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JP2023146878A |
To provide a resin composition which shows high photosensitivity and developability and allows a cured product (cured coating film) obtained therefrom to exhibit excellent heat resistance and coating film appearance.A resin composition c...
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JP2023132149A |
To provide a thermoplastic resin composition which is excellent in heat resistance, impact resistance and fluidity and gives a thermoplastic resin molded article excellent in coatability and durability.The thermoplastic resin composition...
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JP7344471B2 |
A resin composition that has excellent flux activity, flexibility and storage stability and that is suitable for a pre-applied underfill material is provided. The resin composition of the present invention contains a compound (A) having ...
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JP2023128920A |
To provide a resin composition which enables production of a resin molding that has excellent mechanical strength and concealment property, where broken pieces caused by damaging do not have a sharp edge.A resin composition includes a (m...
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JP7343912B2 |
An object of the present invention is to provide a resin composition that can be manufactured consistently with reduced variability in properties and leads to improved productivity and that is suitable for use as a one-part adhesive used...
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JP7339576B2 |
To provide a copolymer having excellent solvent solubility and low dielectric loss tangent.This copolymer includes: an aromatic vinyl monomer unit; a crosslinkable group-containing monomer unit; and a monomer unit which gives a homopolym...
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JP2023124817A |
To provide a resin sheet which has adequate glossiness, designability by surface roughness, and transparency without formation of a mat layer and mat processing.A polystyrene-based resin sheet has a layer (I) composed of a polystyrene-ba...
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JP2023120914A |
To provide a polyamide resin composition that is processed thin to have excellent flame retardancy, extrusion processability, and molding workability, particularly excelling in flow characteristics and weld strength during molding.A poly...
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JP7333638B2 |
It is an object of the present invention to provide a curing agent composition capable of curing, without inconvenience, a base resin containing a 2-methylene-1,3-dicarbonyl compound, and a two-part mixing adhesive and the like containin...
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JP2023116516A |
To provide a resin composition having high storage stability while comprising an amino-modified polymer.The present invention provides a resin composition including a reaction product (P) obtained by reacting an amino-modified silicone (...
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JP7330638B2 |
To provide a heat-curable resin composition that is useful for high frequency and power device purposes and yields a cured product having a superior dielectric property, heat resistance and tracking resistance.A heat-curable resin compos...
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JP7325719B2 |
To provide a crosslinking composition that allows for crosslinking not only at high temperature but also at relatively low temperature, or can accommodate a wide range of crosslinking temperatures.A crosslinking composition has a polymer...
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JP2023104376A |
To provide a resin composition having excellent dielectric properties and low thermal expansion properties, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, a method for...
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JP2023103770A |
To provide a polymer composition capable of adjusting hardness and compression set to be sufficiently low values while maintaining extremely high flowability and achieving three properties of high flowability, low hardness and low compre...
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JP2023532044A |
[Solution] Upon curing, cyanoacrylate compositions are provided that improve high temperature strength performance without compromising heat resistance performance.
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JP2023093385A |
To provide a method for efficiently producing an N-alkylmaleimide-based polymer having excellent optical characteristics, heat resistance and mechanical strength.A method for producing an N-alkylmaleimide-based polymer includes suspensio...
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JP7301492B2 |
A resin composite includes a maleimide resin powder and a resin having a glass transition point that is lower that the glass transition point of the maleimide resin. The resin having a glass transition point that is lower than that of th...
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JP7298383B2 |
To provide a resin composition capable of giving a cured body having excellent dielectric characteristics and small warpage.The resin composition contains: (A) a first resin having a poly(phenylene ether) skeleton and a butadiene skeleto...
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JP2023084451A |
To provide a resin composition having excellent toughness and transparency and a method for producing the same, and a molding.A resin composition comprises a methacrylic resin (A) and a styrene-maleic anhydride copolymer (B), the methacr...
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JP2023081801A |
To provide a polyamide composition which improves interfacial adhesion between a carbon fiber and polyamide, enhances dispersibility to polyamide of the carbon fiber, and can impart mechanical physical property substantially equal to the...
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JP7288752B2 |
To provide a thermoplastic resin composition having high heat resistance and excellent in low warpage property, and a molded body consisting of the same.There is provided a thermoplastic resin composition containing, based on total 100 p...
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JP7288789B2 |
To provide a thermoplastic resin composition which has high heat resistance and is excellent in low warpage and flame retardancy, and a molded article comprising the same.The thermoplastic resin composition contains: (A) 10-50 pts.mass o...
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JP7288751B2 |
To provide a thermoplastic resin composition having high heat resistance and excellent in low warpage property, and a molded body consisting of the same.There is provided a thermoplastic resin composition containing, based on total 100 p...
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JP7288773B2 |
To provide a thermoplastic resin composition which has high heat resistance, is excellent in low warpage property and appearance, and is also excellent in mechanical strength and chemical resistance, and a molding formed from the same.A ...
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JP7287183B2 |
To provide a resin composition suitable for an optical compensation film, and an optical compensation film that is prepared therewith and has excellent phase difference properties and a method for producing such an optical compensation f...
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JP7283137B2 |
To provide a binder capable of manufacturing an electrode for an energy device with excellent initial charge/discharge efficiency.An electrode binder includes water and a copolymer including a structural unit containing a nitrile group d...
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JP2023070869A |
To provide a transparent film having high transparency and sufficient mechanical strength, and a resin composition used for manufacturing the film.Provided is a resin composition containing polyimide and ester-based resin, where the poly...
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JP2023069814A |
To provide an admixture for hydraulic compositions that can suppress blackening and excels in storage stability, particularly storage stability during storage at high temperatures.An admixture for hydraulic compositions comprises: (A) a ...
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JP2023067339A |
To provide a heat-curable maleimide resin composition having excellent dielectric properties even in the high-frequency region, and also having improved moldability and embeddability, and provide an uncured/cured film, a prepreg, a lamin...
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JP2023067340A |
To provide a heat-curable maleimide resin composition capable of yielding a cured product having excellent dielectric properties even in the high-frequency region, as well as a low water absorption rate and a high glass-transition temper...
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JP2023067987A |
To provide a resin composition that makes it possible to obtain an insulating layer having high adhesion to a conductor layer after an HAST test, and has a low melt viscosity; a resin sheet containing the resin composition; and a printed...
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JP2023067103A |
To provide a resin composition capable of giving a cured product excellent in plating adhesion and suppressing unevenness after lamination.The resin composition contains (A) a maleimide compound having a sulfur atom and a maleimide group...
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JP7272520B1 |
The present invention relates to a gas barrier film containing a heteroatom compound having dehydration condensation properties and a resin (A) containing a polymer having a carboxyl group, a packaging material containing the gas barrier...
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JP2023517715A |
The subject matter of the present disclosure is directed to nitrogen stabilized compositions containing a nitrogen stabilizer condensed with an organic acid anhydride. The resulting condensation products exhibit a number of beneficial pr...
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JP2023516610A |
(A1) 20 to 40% by weight of butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer; (A2) 30 to 75% by weight of aromatic vinyl-vinyl cyanide copolymer; and (B) polyamide resin 5 (C) 1 to 15 parts by weight of a poly...
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JP2023056678A |
To provide a polyvinyl alcohol film capable of obtaining a polarizing film superior in polarizing performance, a manufacturing method of such polyvinyl alcohol film, and a stretched film and a polarizing film using such polyvinyl alcohol...
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JP7256967B2 |
A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin...
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JP2023512125A |
Ethylene, (meth)acrylic acid, C1~12- A pigment composition comprising a bismuth vanadate pigment dispersed in a copolymer with at least one comonomer selected from the group consisting of alkyl (meth)acrylates and maleic anhydride.
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