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WO/2023/157911A1 |
The present invention provides a resin composition which contains a resin and a metallocene compound, wherein: the metallocene compound comprises a metal atom, an optionally substituted cyclopentadienyl ligand, and an aromatic ring that ...
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WO/2023/155247A1 |
Provided are a single-molecular-weight amphiphilic fluorene-azobenzene oligomer, a self-assembled fiber, and a preparation method. The present invention diversifies and expands the studies of molecules having a backbone containing fluori...
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WO/2023/155030A1 |
The present invention relates to a polyimide membrane, a preparation method therefor and use thereof. Both sides of the polyimide membrane are formed with different hydrophilic properties by means of different degrees of polymerization. ...
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WO/2023/157790A1 |
A polyamide acid according to the present invention has a tetracarboxylic acid dianhydride residue and a diamine residue. The tetracarboxylic dianhydride residue includes a 3,3',4,4'-biphenyltetracarboxylic dianhydride residue and a spir...
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WO/2023/157789A1 |
A polyamide acid according to the present invention has a tetracarboxylic acid dianhydride residue and a diamine residue. The tetracarboxylic acid dianhydride residue contains a 3, 3', 4, 4'-biphenyl tetracarboxylic acid dianydride resid...
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WO/2023/155523A1 |
Disclosed is a cross-linked poly(aspartic acid) product that can retain the gel shape, water absorbency, water retentivity, and other performance because it does not undergo hydrolysis over time owing to the absence of an ester bond, and...
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WO/2023/152661A1 |
A polyetherimide composition includes a polyetherimide having a percent transmission of 75% to 85% at 500 nanometers as determined according to ASTM D1003 at a thickness of 1.6 mm. The composition further includes a colorant. A molded sa...
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WO/2023/153390A1 |
The purpose of the present invention is to provide a photosensitive resin sheet in which the cross-sectional shape of a pattern is rectangular, a fine pattern can be formed and a pattern defect part can be identified easily, and through ...
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WO/2023/153087A1 |
[Problem] To provide a resin composition having excellent dispersibility and low impurity content. [Solution] This resin composition has, as a main component, an aromatic polyamide and/or aromatic polyamic acid, wherein when rA (nm) repr...
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WO/2023/149435A1 |
A resin composition comprising a polyimide and an acrylic resin, wherein the polyimide comprises an alicyclic tetracarboxylic dianhydride as at least some of a tetracarboxylic dianhydride component and a fluoroalkyl-substituted benzidine...
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WO/2023/149394A1 |
One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminated body, or an electronic component, said composition including a polymer containing a repeating unit that is represented by formula (...
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WO/2023/149393A1 |
This polymer consists of a repeating unit represented by formula (1). [In formula (1), -N(R')-RN(R')- is a structure derived from an unsubstituted or substituted dimer diamine, and R', R1 and R2 are each independently a hydrogen atom, a ...
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WO/2023/146885A1 |
An ion exchange-functionalized polymer molecule includes a repeating unit having a benzimidazole unit as at least part of a main chain, a side chain, or both. The ion exchange-functionalized polymer molecule also includes an ion exchange...
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WO/2023/144709A1 |
A polyimide (PI), a high-performance engineering polymer, has attracted a great attention in recent past as a protecting organic coating for metals. The present disclosure provides new combinations of monomers to prepare polyimide coatin...
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WO/2023/144228A1 |
The present invention relates to a copolymer having several azide functionalities that can be prepared by cationic ring opening polymerisation. The copolymer comprises a first monomer unit and a second monomer unit which are different fr...
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WO/2023/141035A1 |
In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A t...
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WO/2023/140276A1 |
Provided is a polyimide binder from which a high-capacity power storage device, which has a small irreversible capacity and a high initial charge-discharge efficiency and is lightweight, can be obtained. This polyimide binder precursor c...
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WO/2023/133943A1 |
A cross-linked polyamic acid ester. The cross-linked polyamic acid ester has structural units linked by means of a cross-linked structure. Each structural unit has a structure as shown in general formula I, wherein Ar1 is a dianhydride m...
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WO/2023/136702A1 |
The present specification relates to a compound, a method for preparing same, and a single molecule, an oligomer, and a polymer derived from the compound.
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WO/2023/131679A1 |
The present disclosure relates to poly(ester-imide)s ("PEIs") exhibiting low dielectric constant and dissipation factors, and uses thereof. Such polymers can be used for producing articles, such articles being suitable for mobile electro...
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WO/2023/132310A1 |
This resin composition contains a polyamide-imide and an acrylic resin. The polyamide-imide has diamine-derived structures, tetracarboxylic-acid-dianhydride-derived structures, and dicarboxylic-acid-derived structures. The diamine-derive...
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WO/2023/128075A1 |
The present invention relates to an optical film and a method of preparing same, the optical film comprising a polymer resin comprising imide repeating units and amide repeating units, the amide repeating units being included at a ratio ...
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WO/2023/127582A1 |
This polymer is characterized by comprising a structural unit (I) represented by formula (I) and a structural unit (II) represented by formula (II). In formula (I), two of R1-R4 together may form a ring structure; the R1-R4 that do not f...
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WO/2023/128495A1 |
The present invention relates to a polyimide precursor composition with improved flexibility and elongation. The polyimide precursor composition according to the present invention is a polyimide precursor having a dianhydride monomer and...
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WO/2023/127523A1 |
The present invention provides a resin composition which has substrate processing adequacy including embeddability into substrate relief patterns, heat cycle resistance and plating solution resistance, and which enables the achievement o...
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WO/2023/117494A1 |
This invention deals with polypropylene imine polymers (PPI) and their derivatives bearing side chains originating from polycondensation or polyaddition reactions using alkylene oxides, and lactones and/or hydroxy carbon acids, their man...
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WO/2023/120304A1 |
This semiconductor resin material comprises a polyimide resin (A) containing repeating structural units derived from an aromatic tetracarboxylic acid component and an aliphatic diamine component.
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WO/2023/120234A1 |
Provided is a polymeric compound represented by formula (1) (in formula (1), R1, R2, R3 and R4 each independently represent a methyl group, an ethyl group, an isopropyl group, or a tertiary butyl group; X's each independently represent a...
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WO/2023/119128A1 |
A thermoplastic composition including 40 to 70 weight percent of a polycarbonate; 15 to 50 weight percent of a polycarbonate-polysiloxane copolymer; 4 to 8 weight percent of a polyetherimide-polysiloxane copolymer; 1 to 8 weight percent ...
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WO/2023/120549A1 |
The present invention addresses the problem of providing a porous polyimide film which can be suitably used as an electrical insulating film, a frequency-selective film, or the like in a flexible substrate (FPC) or the like. In a method ...
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WO/2023/120037A1 |
The present invention provides: a joined body production method that makes it possible to obtain a joined body having a high maximum separation resisting force between two substrates when the two substrates are joined; a joined body obta...
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WO/2023/120627A1 |
The purpose of the present invention is to provide: a curable resin composition in which film cracking does not readily occur at high temperatures in a nitrogen atmosphere even with a thick film; a cured film in which the curable resin c...
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WO/2023/120862A1 |
The present invention relates to a polyimide-based resin film, a substrate that is for a display device and uses the resin film, and an optical device, wherein the polyimide-based resin film has a thermal hysteresis gap of 100 μm to 500...
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WO/2023/120303A1 |
A light-emitting molded body including a polyimide resin (A) that includes repeating structural units represented by formula (1) and repeating structural units represented by formula (2) (R1 is a C6-22 divalent group including at least o...
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WO/2023/109704A1 |
Disclosed are an antibody synthetic bacterium-nano stimulator hybrid novel targeted drug delivery system, and an application thereof in the field of anti-tumor immunotherapy, and particularly disclosed are a pH response copolymer, a nano...
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WO/2023/110751A1 |
The present invention pertains to the use of a polyimide aerogel, wherein the polyimide aerogel comprises polyimide spheres having a diameter of 250 nm to 20 µm, as an insulating, sorption or filter material, as well as to methods for t...
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WO/2023/111782A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide-terminated polyamide-imide polymer. The present disclosure further relates to an adhesive composition comprisi...
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WO/2023/112849A1 |
The purpose of the present invention is to provide: a resin material that has a novel structure and can be suitably used in a printed wiring board; and a resin composition that contains the resin material, has excellent coatability onto ...
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WO/2023/112764A1 |
As a release layer-forming composition for forming a release layer which can be released without causing damage to a resin substrate of a flexible electronic device, provided is a release layer-forming composition that contains an organi...
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WO/2023/112443A1 |
A heat-curable composition comprising: a polyimide resin (A) which has a repeating unit of general formula (1), has a phenolic hydroxyl group, and has a storage modulus G' of 1.0×107 Pa at a temperature of 0-90°C, at least some of the ...
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WO/2023/112948A1 |
Compatibilizers are disclosed that enable the formation of stable alloys of fluoropolymers with cyclic olefin copolymers (COC). The alloys are useful for many purposes, such as high frequency electronics. Methods of making the compatibil...
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WO/2023/114158A1 |
Polyol compositions that contain imide groups are prepared by producing imide compounds from trimellitic anhydride and an aromatic aminoacid or an aromatic diamine, then esterifying the imide compounds with one or more polyols that have ...
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WO/2023/110819A1 |
The present invention relates to novel compositions comprising cyanate ester resins and substituted bisimides (citraconimides, bisitaconimide, citraconimido-itaconimide, bisnadicimide, bistetrahydroimide and mixtures thereof) as defined ...
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WO/2023/105969A1 |
The present invention provides: a polyimide resin composition which comprises a polyimide resin (A) that contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2), with t...
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WO/2023/105487A1 |
A polyimide, comprising 1-100 mol% of repeating units of formula (1), based on 100 mol% of total repeating units of the polyimide, wherein each V is as defined herein; and each R1 is independently a divalent group of formula (3), wherein...
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WO/2023/106369A1 |
Provided are: a polyimide film which, when used as a spacecraft material, exhibits excellent resistance to atomic oxygen derived from oxygen molecules which are a residual atmosphere component, and produces few outgassing components when...
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WO/2023/106104A1 |
The present invention provides a photosensitive resin composition which contains: a polyimide that has a divalent aromatic group having a photopolymerizable group and a divalent aliphatic hydrocarbon group having 10 to 60 carbon atoms; a...
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WO/2023/105480A1 |
A self-branching polyetherimide comprising a first repeating unit derived from polymerization of the aromatic dianhydride and a first diamine, wherein the first diamine comprises a carboxyl-substituted C6-24 aromatic hydrocarbon group; a...
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WO/2023/106843A1 |
The present invention relates to a polyimide powder and a preparation method therefor, and according to the present invention, a diamine monomer and a dianhydride monomer are polymerized using a glass fiber powder, and thus a high-heat-r...
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WO/2023/106108A1 |
A photosensitive resin composition contains the following polyimide (1) or the like and a solvent. Polyimide (1): A polyimide having structural units represented by the following formulas (1-a), (1-b) and (1-c) below. [In formula (1-a)...
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