Title:
RELEASE LAYER-FORMING COMPOSITION AND RELEASE LAYER
Document Type and Number:
WIPO Patent Application WO/2023/112764
Kind Code:
A1
Abstract:
As a release layer-forming composition for forming a release layer which can be released without causing damage to a resin substrate of a flexible electronic device, provided is a release layer-forming composition that contains an organic solvent and a poly(amic acid) obtained by reacting an aromatic diamine having an alkylene group with 1-20 carbon atoms in a main chain segment with an aromatic tetracarboxylic acid dianhydride. Also provided is a layered product in which a base material, a release layer, and a resin substrate are layered in the stated order, and which is characterized in that the release layer has higher adhesion to the base material than to the resin substrate.
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Inventors:
MATSUYAMA MOTONOBU (JP)
KIMURA TETSUYA (JP)
KIMURA TETSUYA (JP)
Application Number:
PCT/JP2022/044823
Publication Date:
June 22, 2023
Filing Date:
December 06, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08L79/08; B32B27/34; C08G73/10; C09D5/20; C09D179/08
Foreign References:
| JP2016120630A | 2016-07-07 | |||
| JP2008156425A | 2008-07-10 | |||
| JP2011212948A | 2011-10-27 | |||
| JP2011225675A | 2011-11-10 | |||
| JP2016037048A | 2016-03-22 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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