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WO/2003/045631A1 |
The invention provides a polishing pad comprising composite particles that comprise a solid core encapsulated by a polymeric shell material, wherein the solid core comprises a material that differs from the polymeric shell material, as w...
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WO/2003/039812A1 |
A method of fabricating a polishing pad (10; 16) in which a pad material (50) includes a polishing layer (24) overlying a substantially optical transparent backing layer (26) is subjected to a process in which an optical window (12; 18) ...
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WO/2003/038882A1 |
A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of a...
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WO/2003/038862A2 |
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads are substantially porous and substantially hard for improved polishing and plana...
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WO/2003/037565A2 |
Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mec...
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WO/2003/032379A1 |
In CMP technology for planarizing an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or the like, in the production process of a semiconductor element, irregularities of a matter being polished, ...
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WO/2003/028519A1 |
The invention concerns a method for sanitation of elastic floors covered with crosslinked polymeric systems, by treating the floors with an abrasive cleaning pad, with a solvent and a surfactant. The invention also concerns the agents an...
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WO/2003/026850A1 |
The invention concerns an abrasive tool (1) comprising a metal base (6) and a plurality of metal lamellar elements (2a, 2n), wherein the base has an upper surface (5) whereon is mounted a central cylindrical element (3) comprising means ...
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WO/2003/017348A1 |
Disclosed is a chemical mechanical polishing pad formed with holes, grooves or a combination thereof. The chemical mechanical polishing pad is characterized in that a plurality of concentric circles each having grooves, holes, or a combi...
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WO/2003/017347A1 |
Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and ...
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WO/2003/011520A1 |
Disclosed is a method for forming micro-holes, perforated holes, or grooves on a chemical mechanical polishing pad by a laser. This method involves the steps of determining a pattern of micro-holes, grooves, or perforated holes to be for...
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WO/2003/011522A1 |
Disclosed is a method for forming micro-holes, perforated holes, and/or grooves on a polishing pad using a laser beam and a mask. This method involves the steps of determining a pattern of micro-holes, grooves, and/or perforated holes to...
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WO/2003/012846A1 |
Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with micro-holes each having a desired cross-sectional area while having a desired depth. The shape, size, and density of the micro-holes can be optio...
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WO/2003/009965A2 |
An apparatus (10) for automatically polishing kitchen utensils. The apparatus (10) comprise one or more entry ports (12), through which the ustensils are loaded onto said tracks, to a collection point, from which ustensils are retrieved ...
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WO2002000391A9 |
Apparatus for removing a burr from an edge (30B) of a workpiece (30) comprising a rotating shaft (16), an abrasive mechanism (18) attached to a distal end portion of the shaft (16), and a non-abrasive collar (20) mounted to a distal end ...
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WO/2003/008151A1 |
Described are fixed abrasive articles including wear indicators. Exemplary abrasive article (2) comprising abrasive composite elements (4) in the form of posts. The abrasive composite elements (4) include a binder and abrasive particles ...
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WO/2003/009362A1 |
A wafer (11), an object of polishing, is held by a polishing head (12) and rotates together with the polishing head (12). A polishing element (14) is attached to a polishing member (13) by bonding or the like using an adhesive or a doubl...
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WO/2003/002299A2 |
A material (26) with a mesh of fibers and a binder material holding the fibers in the mesh can be used on a carrier head (20) or a polishing pad (100). A polishing apparatus can include a pad cleaner (40) with nozzles (44) to direct jets...
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WO/2002/102552A1 |
A buffing machine (1) capable of adjusting a polishing force in a wide area ranging from a weak polishing force to a strong one and stabilizing the polishing force by efficiently using buffing material, wherein a stress transmitting memb...
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WO/2002/100593A2 |
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion ...
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WO/2002/100598A2 |
The invention relates to a grinding wheel for grinding curved surface sections (O), which is essentially comprised of a supporting body (2, 12) and of a grinding means (3, 13, 23) that is placed on the supporting body. The supporting bod...
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WO/2002/100599A1 |
A buffing pad assembly (12) having a right pad (14), a left pad (16), a disk (18) securing the two pads together, and an elongated member (32) for releasably attaching the buffing pad (12) to the drive shaft (26) of a buffing motor (28) ...
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WO2001068322A9 |
A polishing pad includes a polishing layer, and a transparent window portion of the polishing layer having dispersed particles, to increase the rate at which the window portion wears away during a polishing operation, and to avoid formin...
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WO/2002/100595A1 |
A polishing sheet (10) not deforming with elapse of time in use and capable of uniformly flattening a polished surface at a high polishing rate and a method of manufacturing the sheet&semi the polishing sheet (10), comprising a fabric sh...
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WO2001092620A9 |
A method of forming a nonwoven fabric suitable for metal-finishing buffing operations includes providing a precursor web comprising polyester, staple length fibers, with hydroentanglement of the web effected to impart desired physical ch...
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WO/2002/096603A1 |
Abrasive article including a backing plate (22). Backing plate (22) has a first major surface (22A) and a second opposite major surface (22B). A central aperture (26( extends through backing plate (22). An abrasive layer is secured to th...
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WO/2002/090051A1 |
The invention relates to an industrial cup-type brush that is used to remove material. The inventive brush comprises a rotating tool which is connected by means of an upper nut (3) to studs that project out from portable machines. The br...
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WO2001023141A9 |
A polishing pad for use with a polishing fluid has, a polishing layer (10), a window (30) in an opening (16) through the polishing layer, and a fluid impermeable layer (40) spanning across the polishing layer and the window and the openi...
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WO/2002/083757A1 |
A polyurethane composition containing solid beads dispersed therein, characterized in that the polyurethane is a microcellular polyurethane foam and the composition has a storage modulus at 40 ° C of 270 MPa or more as measured by means...
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WO2002006010A9 |
A polishing device capable of smoothly polishing a painted surface by an easy operation, comprising a base member drivingly rotated by a drive device and having an installation surface orthogonal to the rotating shaft of the drive device...
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WO/2002/081149A1 |
The invention provides a double sided waffle-surface foam polishing pad and a polishing system with which it can be used. The double sided feature allows great versatility in the type of polishing that can be accomplished using the same ...
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WO/2002/076678A1 |
The present invention provides a flexible abrasive product comprised of an open cell foam backing (12), a foraminous barrier coating (13) and a shaped foraminous abrasive coating (33). The flexible abrasive article (31) of the invention ...
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WO/2002/077705A1 |
A pad (15) for processing substrates (17) such as a pad (15) for CMP and methods of using the pad (15): the pad (15) is capable of allowing the substrate (17) to be optically monitored during the process. In one embodiment, at least a po...
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WO/2002/074494A1 |
A sanding disc (10) particularly useful for smoothing drywall. The sanding disc includes a circular abrasive disc (18) having an abrasive surface (19), and a circular foam disc (12) smaller in diameter than the abrasive disc which is co-...
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WO/2002/074490A1 |
An abrasive article (10) that includes a fixed abrasive element (14) having a plurality of abrasive particles (16), a resilient element, and a plurality of rigid segments (22) disposed between the fixed abrasive element and the resilient...
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WO/2002/064315A1 |
The invention provides a polishing disk (10) comprising (a) a body comprising a front surface (11), a back surface (12), and a peripheral surface (13), (b) a polishing surface, (c) an end-point detection port (15) extending through the b...
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WO2000012264A9 |
A polishing pad (400) having a cross-sectional open area (404) which varies with depth from the pad surface is provided. The cross-sectional open area (404) of the pad (400) may increase and/or decrease moving away from the outer pad sur...
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WO/2002/062527A1 |
An abrasive article (100) includes a fixed abrasive element (108), a resilient element (106), a rigid element (104) disposed between the resilient element and the fixed abrasive element, and a plurality of microstructures (110) disposed ...
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WO/2002/057071A2 |
A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal feat...
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WO/2002/055261A1 |
A polisher (1) for polishing a curved surface such as the convex surface of a spectacle lens, comprising a polishing pad (3) having water passing grooves (5) of 0.1 to 5 mm wide stuck on a dome-shaped elastic base material (2), the polis...
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WO/2002/055265A1 |
An abrasive article backup plate assembly (22) and grinder system having an abrasive article backup plate assembly (22) is disclosed. The abrasive article backup plate assembly (22) includes an abrasive article (40) having an abrasive su...
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WO/2002/055266A1 |
A wiping film having a flexible film backing, and a wiping layer formed on one surface of the backing, wherein the wiping layer is composed of a binder and plastic particles dispersed therein. The wiping film is useful for removing forei...
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WO/2002/046283A1 |
The invention aims at providing a polyurethane foam which has a uniformly foamed structure, attains improvement in the flatness of a polished surface and flatting efficiency, is prolonged in serviceable life as compared with those of the...
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WO/2002/043922A1 |
The present invention is directed, in general, to a method of polishing a surface on substrates, such as semiconductor wafers and, more specifically, to a polishing pad suitable for this purpose. The polishing pad comprises a polishing b...
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WO/2002/043940A1 |
The present invention is directed, in general, to an improved material and method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polymers, preferably thermoplastic foam...
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WO/2002/038338A2 |
The present application discloses an agglomerate. The agglomerate comprises a crystalline matrix. The agglomerate may additionally comprise abrasive particles. The agglomerate has a normalized bulk density of less than about 0.38. The pr...
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WO/2002/034469A1 |
The invention can be used in various industries for machining miniature and large sized articles made of sapphire, quartz, ceramic, semiconductor and other hard-to-treat materials, including two-side machined pieces without preglueing. T...
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WO/2002/032254A2 |
The present invention relates to a unitary brush (such as a cup brush, for example) which has abrasive particles secured to at least some of its bristles via a first coating. The unitary brush is made by providing a unitary brush, coatin...
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WO/2002/032609A1 |
The invention relates to a device for machining workpieces (11), especially for sawing a workpiece with a saw blade (12). The device contains a brushing device (19) which is arranged displaceably, in such a way that the brushing device c...
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WO/2002/032627A1 |
A rotary surface finishing tool (10) includes a generally circular body (13) of a finishing material, such as polymeric foam, the peripheral edge of which is wrapped around the outer edge of a circular cup-shaped backing plate. The plate...
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