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WO/2008/102033A1 |
Sharpening device, comprising a disk (1) shaped from a slightly conical rigid support (2), covered on the outer face (3) thereof with oblique sheets (4) of abrasive material, overlapping each other; intercalated and fastened to a padded ...
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WO/2008/093785A1 |
A simply constructed surface treatment brush that can apply uniform surface treatment to an object having irregularities and in which a material is saved. A large number of brush bodies (58) are intermittently arranged on the surface of ...
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WO/2008/088908A1 |
An abrasive, abrading, or grinding device (10) has a housing (12) for moving over a concrete surface. The housing has depending abrasive elements (14) with a substrate layer (30) and a backing layer (32) mounted to a support bracket (34)...
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WO/2008/083994A1 |
The invention relates to a flap wheel, comprising a plate-shaped carrier, which can be rotatably driven about an axis and carries a plurality of abrasive flaps overlapping in a tile-like manner, wherein the abrasive flaps are fastened to...
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WO/2008/037320A1 |
An abrasive disc (1), in particular for abrasive wheels (15) which can be driven in a rotating manner, comprising an outer edge (2) and an inner edge (3), which merge one into the other at a first point of intersection Si, wherein the in...
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WO/2008/035383A1 |
A device (1) suitable for working hard stones and the like has a marked flexibility of use and comprises: abrasive means (3) apt to abrade a workpiece (P); a support (2) of substantially cylindrical shape, apt to give to said abrasive me...
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WO/2008/034517A1 |
Disclosed is a lamellar grinding disk (10), with a rotationally symmetric support disk (11) on which ring-shaped, laminar lamellae (12) made of abrasive material are distributed around the perimeter and are each affixed on one edge there...
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WO/2008/014807A1 |
The invention relates to a polishing tool (1) for a portable, motor-operated angle polisher (2). The polishing tool (1) has a polishing plate (3), provided for the rotational drive, and a polishing body (5) fastened to an outer flat side...
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WO/2008/008593A1 |
A polishing pad including a window can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. The window of the polishi...
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WO/2007/149704A1 |
Abrasive articles having a compressible composite layer are described. The compressible composite layers include a compressible binder and abrasive agglomerates. Methods of using such abrasive articles to modify the edge of a workpiece a...
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WO/2007/140111A1 |
One embodiment of the disclosure is a method for changing a cutting ability of an abrasive device. The method includes abrading a portion of an abrasive device, thereby reducing a cutting ability of the abrasive device. Moreover, the met...
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WO/2007/139097A1 |
This invention provides a polishing roll that can reduce the occurrence of consumption waste produced upon polishing of an object having a small throughhole such as a printed wiring board with a throughhole and can reduce clogging of the...
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WO/2007/131505A1 |
The present invention relates to a machine for surface treatment, such as grinding or polishing, of a workpiece and comprises a rotating cylinder (1 , 19). On the cylindrical face, a number of grinding or polishing modules (17, 18) are p...
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WO/2007/120163A2 |
The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxid...
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WO/2007/101957A2 |
The invention relates to a fettling, optionally sawing, wheel (1), in the form of a disk, said wheel comprising a central axis X, a central attaching region F, and at least one peripheral working region Z which extends outside the centra...
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WO/2007/104063A1 |
A polishing pad having an optically clear bottom layer and a closed cell top layer where the interface between the top and bottom layers is only a urethane to urethane interface. Grooves may be machined into the top layer or through the ...
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WO/2007/101589A2 |
The invention relates to a grinding lamella (1), in particular for arranging on a rotatingly driven grinding disk (8), comprising at least two annular sections (4, 5, 6, 7, 24, 25, 26, 27, 34, 35, 36, 37, 44, 45, 46, 47) arranged next to...
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WO/2007/095947A1 |
The invention relates to a brush module (1) for a rotating grinding brush for abrading essentially plane elements, said brush module (1) comprising: an elongate body part (10) with two opposed side edges (14,15) and a plurality of bristl...
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WO/2007/098045A1 |
An abrasive article (1) comprises a body (2) of fibrous, non-woven abrasive material, a sleeve (7) positioned in a central opening (5) of the body of abrasive material, and a hub of polymeric material (8) located within the sleeve, where...
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WO/2007/097115A1 |
A brush-like grindstone (1) has threadlike grinding elements (2) each being a thread that is a collection of long inorganic fibers and is impregnated with resin and solidified. To grind work (W), the grindstone (1) is moved relative to t...
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WO/2007/038204A1 |
Conformable abrasive article comprising: a backing having a first major surface; a deformable material contacting a central portion of the first major surface; an elastic member affixed to the first major surface of the backing and toget...
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WO/2007/037302A1 |
A polishing brush adapted for a method for polishing a disk-like glass substrate having a circular hole at its center, where the polishing is made by rotating the brush while it is made to be in contact with an end surface on the inner c...
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WO/2007/035252A2 |
An abrasive article mounting assembly with an integral dust collection system. The abrasive attachment interface is configured to releasably engage and support an abrasive article, such as, for example, a porous abrasive sheet or disc.
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WO/2007/035292A1 |
An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, and an attachment interface layer. The openings...
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WO/2007/026007A1 |
Disclosed is a separating and grinding device comprising a drive unit, a working spindle (12), and a clamping flange (14) and a nut (16) for clamping a tool (18) to the working spindle (12) through the hub bore of the tool (18). Vibratio...
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WO/2007/024464A1 |
A surface-textured polishing pad suitable for chemical-mechanical polishing comprises a porous polymeric foam having an average pore cell size in the range of 60 m or less. At least 75% of the pores in the foam have a pore cell size with...
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WO/2007/025226A1 |
A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a ...
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WO/2007/012438A1 |
The invention relates to a device for machining a strip or plate-shaped metal workpiece, which comprises at least one conveying device which is provided with machining elements. The conveying device guides the machining elements at an an...
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WO/2007/009456A1 |
According to the invention, a method is used for surface treatment of ob¬ jects (7), wherein wire rollers (15) are caused to contact the object (7) to exert a blow or hammer impact, which wire rollers (15) partly rotate (8), partly revo...
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WO/2007/009466A1 |
The present invention relates to a profile strip (1), preferably for a cylinder drum (5) comprising a bottom strip (3) which is designed for replaceable retention of a bottom profile (2) comprising a number of brushes (6) and a number of...
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WO/2007/001700A2 |
The invention provides polishing pads comprising a deformable polishing pad body and magnetically sensitive particles dispersed therein, wherein one or more properties of the polishing pad are altered when in the presence of an applied m...
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WO/2007/001699A1 |
The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of 0.01 microns to 10 microns. The polishing pad is produc...
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WO/2006/136165A1 |
The present invention relates to a grinding module for a rotating grinding brush, said grinding module comprising an elongate body part, at least one abrasive cloth extending from the body part, and a plurality of bristles projecting fro...
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WO2006097141B1 |
A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on ...
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WO/2006/115924A1 |
The invention is directed to a multi-layer polishing pad (10) for chemical- mechanical polishing comprising a porous polishing layer (12) and a porous bottom layer (14) , wherein the bottom layer (14) is substantially coextensive with th...
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WO/2006/093670A2 |
A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized.
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WO/2006/089293A1 |
The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications wher...
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WO/2006/076060A1 |
The present invention is directed, in general, to a chemical mechanical polishing pad comprising a closed-cell thermoplastic foam polishing body. The polishing body comprises an ethylene vinyl acetate block copolymer. The ethylene vinyl ...
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WO/2006/072324A1 |
In order to fix a grinding disk base body (1a) to the centring section (4) of a grinding spindle rotor in a centring manner, the base body (1) comprises an inner recess (10) from which two fixed projections (11) project inwardly. The bas...
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WO/2006/041727A1 |
The present invention is directed, in general, to a polishing pad comprising a polishing body. The polishing body comprises a thermoplastic foam substrate having a surface comprising concave cells. The thermoplastic foam substrate compri...
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WO/2006/039436A2 |
A method and apparatus for processing a substrate by electrochemical mechanical planarization and electrochemical mechanical plating is disclosed. Included are various embodiments of a processing pad article comprising an open cell foam ...
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WO/2006/031286A1 |
A rotary buffing and finishing pad assembly includes a polymeric foam cushioning layer that has a graded compression load deflection which is interposed between a backing plate and a relatively thin performance layer that is removal y at...
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WO/2006/031475A1 |
An abrasive article (1) for use on a rotary cleaning machine having, on one side, a first abrasive face (2) having a first abrasive nature and, on the other side, a second abrasive face having a second abrasive nature different from the ...
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WO/2006/026315A1 |
A polishing pad having a bottom layer, a top layer attached to the bottom layer, the bottom layer having a modulus of elasticity between 300 and 5000 psi and a compressibility of less than 30% at 73 psi, wherein the top pad has a modulus...
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WO/2006/026343A1 |
A method of improving a removal rate of a pad includes producing a body of a pad of polyurethane from a mix; and introducing into the mix an additive which decreases an elastic rebound of the pad so as to increase a chemical-mechanical p...
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WO/2006/026271A1 |
A polishing pad for chemical mechanical polishing, comprising a body, wherein the body has a working surface in contact with a substrate, the working surface being provided with grooves. The grooves are configured so that over the course...
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WO/2006/023178A1 |
A method of making an abrasive article comprising an abrasive disc (1) of non-woven fibres having a central shaft (3) and a hub (2) securing the shaft (3) to the abrasive disc (1). The method comprising forming the hub (3) by injecting m...
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WO/2006/019541A1 |
A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to vary the residence time across the wafer track of the reaction products formed by the interaction of reactants in the po...
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WO/2006/013598A1 |
The present invention relates to a method for the construction of abrasive diamond wheels and to abrasive diamond wheels obtainable by injection moulding material between a diamond canvas (1) and a support (5) .
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WO/2006/009634A1 |
A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polyme...
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